Automotive engineering, along with aerospace engineering and naval architecture, is a branch of vehicle engineering, incorporating elements of mechanical, electrical, electronic, software, and safety engineering as applied to the design, manufacture and operation of motorcycles, automobiles, and trucks and their respective engineering subsystems. It also includes modification of vehicles. Manufacturing domain deals with the creation and assembling the whole parts of automobiles is also included in it. The automotive engineering field is research intensive and involves direct application of mathematical models and formulas. The study of automotive engineering is to design, develop, fabricate, and test vehicles or vehicle components from the concept stage to production stage. Production, development, and manufacturing are the three major functions in this field.
Test-driven development (TDD) is a software development process relying on software requirements being converted to test cases before software is fully developed, and tracking all software development by repeatedly testing the software against all test cases. This is as opposed to software being developed first and test cases created later.
In industry, product lifecycle management (PLM) is the process of managing the entire lifecycle of a product from its inception through the engineering, design and manufacture, as well as the service and disposal of manufactured products. PLM integrates people, data, processes, and business systems and provides a product information backbone for companies and their extended enterprises.
JTAG is an industry standard for verifying designs and testing printed circuit boards after manufacture.
A design engineer is an engineer focused on the engineering design process in any of the various engineering disciplines and design disciplines like Human-Computer Interaction. Design engineers tend to work on products and systems that involve adapting and using complex scientific and mathematical techniques. The emphasis tends to be on utilizing engineering physics and other applied sciences to develop solutions for society.
Depaneling is a process step in high-volume electronics assembly production. In order to increase the throughput of printed circuit board (PCB) manufacturing and surface mount (SMT) lines, PCBs are often designed so that they consist of many smaller individual PCBs that will be used in the final product. This PCB cluster is called a panel or multiblock. The large panel is broken up or "depaneled" as a certain step in the process - depending on the product, it may happen right after SMT process, after in-circuit test (ICT), after soldering of through-hole elements, or even right before the final assembly of the PCBA into the enclosure.
Automatic test equipment or automated test equipment (ATE) is any apparatus that performs tests on a device, known as the device under test (DUT), equipment under test (EUT) or unit under test (UUT), using automation to quickly perform measurements and evaluate the test results. An ATE can be a simple computer-controlled digital multimeter, or a complicated system containing dozens of complex test instruments capable of automatically testing and diagnosing faults in sophisticated electronic packaged parts or on wafer testing, including system on chips and integrated circuits.
Boundary scan is a method for testing interconnects on printed circuit boards or sub-blocks inside an integrated circuit. Boundary scan is also widely used as a debugging method to watch integrated circuit pin states, measure voltage, or analyze sub-blocks inside an integrated circuit.
Reliability engineering is a sub-discipline of systems engineering that emphasizes the ability of equipment to function without failure. Reliability describes the ability of a system or component to function under stated conditions for a specified period of time. Reliability is closely related to availability, which is typically described as the ability of a component or system to function at a specified moment or interval of time.
Design for testing or design for testability (DFT) consists of IC design techniques that add testability features to a hardware product design. The added features make it easier to develop and apply manufacturing tests to the designed hardware. The purpose of manufacturing tests is to validate that the product hardware contains no manufacturing defects that could adversely affect the product's correct functioning.
The process of circuit design can cover systems ranging from complex electronic systems down to the individual transistors within an integrated circuit. One person can often do the design process without needing a planned or structured design process for simple circuits. Still, teams of designers following a systematic approach with intelligently guided computer simulation are becoming increasingly common for more complex designs. In integrated circuit design automation, the term "circuit design" often refers to the step of the design cycle which outputs the schematics of the integrated circuit. Typically this is the step between logic design and physical design.
Integrated circuit design, or IC design, is a sub-field of electronics engineering, encompassing the particular logic and circuit design techniques required to design integrated circuits, or ICs. ICs consist of miniaturized electronic components built into an electrical network on a monolithic semiconductor substrate by photolithography.
Environmental stress screening (ESS) refers to the process of exposing a newly manufactured or repaired product or component to stresses such as thermal cycling and vibration in order to force latent defects to manifest themselves by permanent or catastrophic failure during the screening process. The surviving population, upon completion of screening, can be assumed to have a higher reliability than a similar unscreened population.
Design for manufacturability is the general engineering practice of designing products in such a way that they are easy to manufacture. The concept exists in almost all engineering disciplines, but the implementation differs widely depending on the manufacturing technology. DFM describes the process of designing or engineering a product in order to facilitate the manufacturing process in order to reduce its manufacturing costs. DFM will allow potential problems to be fixed in the design phase which is the least expensive place to address them. Other factors may affect the manufacturability such as the type of raw material, the form of the raw material, dimensional tolerances, and secondary processing such as finishing.
Design Closure is a part of the digital electronic design automation workflow by which an integrated circuit design is modified from its initial description to meet a growing list of design constraints and objectives.
An engineering change order (ECO), also called an engineering change notice (ECN), engineering change (EC), or engineering release notice(ERN), is an artifact used to implement changes to components or end products. The ECO is utilized to control and coordinate changes to product designs that evolve over time.
Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) manufacture where a camera autonomously scans the device under test for both catastrophic failure and quality defects. It is commonly used in the manufacturing process because it is a non-contact test method. It is implemented at many stages through the manufacturing process including bare board inspection, solder paste inspection (SPI), pre-reflow and post-re-flow as well as other stages.
Engineer to order is a production approach characterized by:
- Engineering activities need to be added to product lead time.
- Upon receipt of a customer order, the order engineering requirements and specifications are not known in detail. There is a substantial amount of design and engineering analysis required.
In-circuit testing (ICT) is an example of white box testing where an electrical probe tests a populated printed circuit board (PCB), checking for shorts, opens, resistance, capacitance, and other basic quantities which will show whether the assembly was correctly fabricated. It may be performed with a "bed of nails" test fixture and specialist test equipment, or with a fixtureless in-circuit test setup.
In the manufacture of electronic printed circuit boards, flying probes are used for testing both bare circuit boards and boards loaded with components. Flying probes were introduced in the late 1980’s. Flying probes can be found in many manufacturing and assembly operations. A flying probe tester uses one or more test probes to make contact with the circuit board under test; the probes are moved from place to place on the circuit board to carry out tests of multiple conductors or components. Flying probe testers are an alternative to bed of nails testers, which use multiple contacts to simultaneously contact the board and which rely on electrical switching to carry out measurements.
