Electronics is a scientific and engineering discipline that studies and applies the principles of physics to design, create, and operate devices that manipulate electrons and other electrically charged particles. Electronics is a subfield of electrical engineering which uses active devices such as transistors, diodes, and integrated circuits to control and amplify the flow of electric current and to convert it from one form to another, such as from alternating current (AC) to direct current (DC) or from analog signals to digital signals.
An integrated circuit (IC), also known as a microchip, computer chip, or simply chip, is a small electronic device made up of multiple interconnected electronic components such as transistors, resistors, and capacitors. These components are etched onto a small piece of semiconductor material, usually silicon. Integrated circuits are used in a wide range of electronic devices, including computers, smartphones, and televisions, to perform various functions such as processing and storing information. They have greatly impacted the field of electronics by enabling device miniaturization and enhanced functionality.
Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips that are present in everyday electronic devices. It is a multiple-step photolithographic and physio-chemical process during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.
Very-large-scale integration (VLSI) is the process of creating an integrated circuit (IC) by combining millions or billions of MOS transistors onto a single chip. VLSI began in the 1970s when MOS integrated circuit chips were developed and then widely adopted, enabling complex semiconductor and telecommunication technologies. The microprocessor and memory chips are VLSI devices.
Gene Myron Amdahl was an American computer architect and high-tech entrepreneur, chiefly known for his work on mainframe computers at IBM and later his own companies, especially Amdahl Corporation. He formulated Amdahl's law, which states a fundamental limitation of parallel computing.
The history of computing hardware starting at 1960 is marked by the conversion from vacuum tube to solid-state devices such as transistors and then integrated circuit (IC) chips. Around 1953 to 1959, discrete transistors started being considered sufficiently reliable and economical that they made further vacuum tube computers uncompetitive. Metal–oxide–semiconductor (MOS) large-scale integration (LSI) technology subsequently led to the development of semiconductor memory in the mid-to-late 1960s and then the microprocessor in the early 1970s. This led to primary computer memory moving away from magnetic-core memory devices to solid-state static and dynamic semiconductor memory, which greatly reduced the cost, size, and power consumption of computers. These advances led to the miniaturized personal computer (PC) in the 1970s, starting with home computers and desktop computers, followed by laptops and then mobile computers over the next several decades.
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Department, Utica, New York. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry, it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and fine wires are welded onto the chip pads and lead frame contacts to interconnect the chip pads to external circuitry.
Amdahl Corporation was an information technology company which specialized in IBM mainframe-compatible computer products, some of which were regarded as supercomputers competing with those from Cray Research. Founded in 1970 by Gene Amdahl, a former IBM computer engineer best known as chief architect of System/360, it has been a wholly owned subsidiary of Fujitsu since 1997. The company was located in Sunnyvale, California.
A gate array is an approach to the design and manufacture of application-specific integrated circuits (ASICs) using a prefabricated chip with components that are later interconnected into logic devices according to custom order by adding metal interconnect layers in the factory. It was popular during the upheaval in the semiconductor industry in the 1980s, and its usage declined by the end of the 1990s.
Solid Logic Technology (SLT) was IBM's method for hybrid packaging of electronic circuitry introduced in 1964 with the IBM System/360 series of computers and related machines. IBM chose to design custom hybrid circuits using discrete, flip chip-mounted, glass-encapsulated transistors and diodes, with silk-screened resistors on a ceramic substrate, forming an SLT module. The circuits were either encapsulated in plastic or covered with a metal lid. Several of these SLT modules were then mounted on a small multi-layer printed circuit board to make an SLT card. Each SLT card had a socket on one edge that plugged into pins on the computer's backplane.
Fujitsu Siemens Computers GmbH was a Japanese and German vendor of information technology. The company was founded in 1999 as a 50/50 joint venture between Fujitsu of Japan and Siemens of Germany. On April 1, 2009, the company became Fujitsu Technology Solutions as a result of Fujitsu buying out Siemens' share of the company.
Wafer-scale integration (WSI) is a system of building very-large integrated circuit networks from an entire silicon wafer to produce a single "super-chip". Combining large size and reduced packaging, WSI was expected to lead to dramatically reduced costs for some systems, notably massively parallel supercomputers but is now being employed for deep learning. The name is taken from the term very-large-scale integration, the state of the art when WSI was being developed.
A hybrid integrated circuit (HIC), hybrid microcircuit, hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices and passive components, bonded to a substrate or printed circuit board (PCB). A PCB having components on a Printed Wiring Board (PWB) is not considered a true hybrid circuit according to the definition of MIL-PRF-38534.
Plug compatible refers to "hardware that is designed to perform exactly like another vendor's product." The term PCM was originally applied to manufacturers who made replacements for IBM peripherals. Later this term was used to refer to IBM-compatible computers.
The transistor count is the number of transistors in an electronic device. It is the most common measure of integrated circuit complexity. The rate at which MOS transistor counts have increased generally follows Moore's law, which observes that transistor count doubles approximately every two years. However, being directly proportional to the area of a chip, transistor count does not represent how advanced the corresponding manufacturing technology is: a better indication of this is transistor density.
Lam Research Corporation is an American supplier of wafer-fabrication equipment and related services to the semiconductor industry. Its products are used primarily in front-end wafer processing, which involves the steps that create the active components of semiconductor devices and their wiring (interconnects). The company also builds equipment for back-end wafer-level packaging (WLP) and for related manufacturing markets such as for microelectromechanical systems (MEMS).
In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection (via) that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits. Compared to alternatives such as package-on-package, the interconnect and device density is substantially higher, and the length of the connections becomes shorter.
A three-dimensional integrated circuit is a MOS integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
The VAX 9000 is a discontinued family of mainframes developed and manufactured by Digital Equipment Corporation (DEC) using custom ECL-based processors implementing the VAX instruction set architecture (ISA). Equipped with optional vector processors, they were marketed into the supercomputer space as well. As with other VAX systems, they were sold with either the VMS or Ultrix operating systems.
Glossary of microelectronics manufacturing terms
