Background
Semiconductor devices (as of 2005) are built by depositing and patterning many thin layers. The patterning steps, or lithography, define the function of the device and the density of its components.
For example, in the interconnect layers of a modern microprocessor, a conductive material (copper or aluminum) is inlaid in an electrically insulating matrix (typically fluorinated silicon dioxide or another low-k dielectric). The metal patterns define multiple electrical circuits that are used to connect the microchip's transistors to one another and ultimately to external devices via the chip's pins.
Copper is a chemical element with symbol Cu and atomic number 29. It is a soft, malleable, and ductile metal with very high thermal and electrical conductivity. A freshly exposed surface of pure copper has a pinkish-orange color. Copper is used as a conductor of heat and electricity, as a building material, and as a constituent of various metal alloys, such as sterling silver used in jewelry, cupronickel used to make marine hardware and coins, and constantan used in strain gauges and thermocouples for temperature measurement.
Silicon dioxide, also known as silica, is an oxide of silicon with the chemical formula SiO2, most commonly found in nature as quartz and in various living organisms. In many parts of the world, silica is the major constituent of sand. Silica is one of the most complex and most abundant families of materials, existing as a compound of several minerals and as synthetic product. Notable examples include fused quartz, fumed silica, silica gel, and aerogels. It is used in structural materials, microelectronics (as an electrical insulator), and as components in the food and pharmaceutical industries.
A dielectric is an electrical insulator that can be polarized by an applied electric field. When a dielectric is placed in an electric field, electric charges do not flow through the material as they do in an electrical conductor but only slightly shift from their average equilibrium positions causing dielectric polarization. Because of dielectric polarization, positive charges are displaced in the direction of the field and negative charges shift in the opposite direction. This creates an internal electric field that reduces the overall field within the dielectric itself. If a dielectric is composed of weakly bonded molecules, those molecules not only become polarized, but also reorient so that their symmetry axes align to the field.
The most common patterning method used by the semiconductor device industry is photolithography -- patterning using light. In this process, the substrate of interest is coated with photosensitive resist and irradiated with short-wavelength light projected through a photomask, which is a specially prepared stencil formed of opaque and transparent regions - usually a quartz substrate with a patterned chromium layer. The shadow of opaque regions in the photomask forms a submicrometer-scale pattern of dark and illuminated regions in the resist layer -- the areal image. Chemical and physical changes occur in the exposed areas of the resist layer. For example, chemical bonds may be formed or destroyed, inducing a change in solubility. This latent image is then developed for example by rinsing with an appropriate solvent. Selected regions of the resist remain, which after a post-exposure bake step form a stable polymeric pattern on the substrate. This pattern can be used as a stencil in the next process step. For example, areas of the underlying substrate that are not protected by the resist pattern may be etched or doped. Material may be selectively deposited on the substrate. After processing, the remaining resist may be stripped. Sometimes (esp. during Microelectromechanical systems fabrication), the patterned resist layer may be incorporated in the final product. Many photolithography and processing cycles may be performed to create complex devices.
A photomask is an opaque plate with holes or transparencies that allow light to shine through in a defined pattern. They are commonly used in photolithography.
Quartz is a mineral composed of silicon and oxygen atoms in a continuous framework of SiO4 silicon–oxygen tetrahedra, with each oxygen being shared between two tetrahedra, giving an overall chemical formula of SiO2. Quartz is the second most abundant mineral in Earth's continental crust, behind feldspar.
Chromium is a chemical element with symbol Cr and atomic number 24. It is the first element in group 6. It is a steely-grey, lustrous, hard and brittle transition metal. Chromium is highly valued as a metal that is able to be highly polished while resisting tarnishing. Chromium is also the main additive in stainless steel, a popular steel alloy due to its uncommonly high specular reflection. Simple polished chromium reflects almost 70% of the visible spectrum, with almost 90% of infrared light being reflected. The name of the element is derived from the Greek word χρῶμα, chrōma, meaning color, because many chromium compounds are intensely colored.
Resists may also be formulated to be sensitive to charged particles, such as the electron beams produced in scanning electron microscopes. This is the basis of electron-beam direct-write lithography.
The electron is a subatomic particle, symbol
e−
or
β−
, whose electric charge is negative one elementary charge. Electrons belong to the first generation of the lepton particle family, and are generally thought to be elementary particles because they have no known components or substructure. The electron has a mass that is approximately 1/1836 that of the proton. Quantum mechanical properties of the electron include an intrinsic angular momentum (spin) of a half-integer value, expressed in units of the reduced Planck constant, ħ. As it is a fermion, no two electrons can occupy the same quantum state, in accordance with the Pauli exclusion principle. Like all elementary particles, electrons exhibit properties of both particles and waves: they can collide with other particles and can be diffracted like light. The wave properties of electrons are easier to observe with experiments than those of other particles like neutrons and protons because electrons have a lower mass and hence a longer de Broglie wavelength for a given energy.
A scanning electron microscope (SEM) is a type of electron microscope that produces images of a sample by scanning the surface with a focused beam of electrons. The electrons interact with atoms in the sample, producing various signals that contain information about the surface topography and composition of the sample. The electron beam is scanned in a raster scan pattern, and the position of the beam is combined with the intensity of the detected signal to produce an image. In the most common SEM mode, secondary electrons emitted by atoms excited by the electron beam are detected using an Everhart-Thornley detector. The number of secondary electrons that can be detected, and thus the signal intensity, depends, among other things, on specimen topography. SEM can achieve resolution better than 1 nanometer.
A resist is not always necessary. Several materials may be deposited or patterned directly using techniques like soft lithography, Dip-Pen Nanolithography, evaporation through a shadow mask or stencil.
In technology, soft lithography is a family of techniques for fabricating or replicating structures using "elastomeric stamps, molds, and conformable photomasks". It is called "soft" because it uses elastomeric materials, most notably PDMS.
Stencilling produces an image or pattern by applying pigment to a surface over an intermediate object with designed gaps in it which create the pattern or image by only allowing the pigment to reach some parts of the surface. The stencil is both the resulting image or pattern and the intermediate object; the context in which stencil is used makes clear which meaning is intended. In practice, the (object) stencil is usually a thin sheet of material, such as paper, plastic, wood or metal, with letters or a design cut from it, used to produce the letters or design on an underlying surface by applying pigment through the cut-out holes in the material.
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Microelectromechanical systems is the technology of microscopic devices, particularly those with moving parts. It merges at the nano-scale into nanoelectromechanical systems (NEMS) and nanotechnology. MEMS are also referred to as micromachines in Japan, or micro systems technology (MST) in Europe.
Since the mid-20th century, electron-beam technology has provided the basis for a variety of novel and specialized applications in semiconductor manufacturing, microelectromechanical systems, nanoelectromechanical systems, and microscopy.
Electron-beam lithography is the practice of scanning a focused beam of electrons to draw custom shapes on a surface covered with an electron-sensitive film called a resist (exposing). The electron beam changes the solubility of the resist, enabling selective removal of either the exposed or non-exposed regions of the resist by immersing it in a solvent (developing). The purpose, as with photolithography, is to create very small structures in the resist that can subsequently be transferred to the substrate material, often by etching.
Maskless lithography utilizes methods that directly transfer the information onto the substrate, without utilizing an intermediate static mask, i.e. photomask that is directly replicated. In microlithography typically radiation transfer casts an image of a time constant mask onto a photosensitive emulsion .
Traditionally mask aligners, steppers, scanners, but also other non-optical techniques for high speed replication of microstructures are common. The concept takes advantage of high speed or parallel manipulation technologies that have been enabled by large and cheap available computing capacity, which is not an issue with the standard approach that decouples a slow, but precise structuring process for writing a mask from a fast and highly parallel copy process to achieve high replication throughputs as demanded for in industrial microstructuring.
Next-generation lithography or NGL is a term used in integrated circuit manufacturing to describe the lithography technologies slated to replace open air, visible light photolithography. As of 2016 the most advanced form of photolithography is immersion lithography, in which water is used as an immersion medium for the final lens. It is being applied to the 16 nm and 14 nm nodes, with the required use of multiple patterning. The increasing costs of multiple patterning have motivated the continued search for a next-generation technology that can flexibly achieve the required resolution in a single processing step.
Dip pen nanolithography (DPN) is a scanning probe lithography technique where an atomic force microscope (AFM) tip is used to create patterns directly on a range of substances with a variety of inks. A common example of this technique is exemplified by the use of alkane thiolates to imprint onto a gold surface. This technique allows surface patterning on scales of under 100 nanometers. DPN is the nanotechnology analog of the dip pen, where the tip of an atomic force microscope cantilever acts as a "pen," which is coated with a chemical compound or mixture acting as an "ink," and put in contact with a substrate, the "paper."
Nanoimprint lithography (NIL) is a method of fabricating nanometer scale patterns. It is a simple nanolithography process with low cost, high throughput and high resolution. It creates patterns by mechanical deformation of imprint resist and subsequent processes. The imprint resist is typically a monomer or polymer formulation that is cured by heat or UV light during the imprinting. Adhesion between the resist and the template is controlled to allow proper release.
SU-8 is a commonly used epoxy-based negative photoresist. Negative refers to a photoresist whereby the parts exposed to UV become cross-linked, while the remainder of the film remains soluble and can be washed away during development.
Contact lithography, also known as contact printing, is a form of photolithography whereby the image to be printed is obtained by illumination of a photomask in direct contact with a substrate coated with an imaging photoresist layer.
LIGA is a German acronym for Lithographie, Galvanoformung, Abformung that describes a fabrication technology used to create high-aspect-ratio microstructures.
Patterned media is a potential future hard disk drive technology to record data in magnetic islands, as opposed to current hard disk drive technology where each bit is stored in 20-30 magnetic grains within a continuous magnetic film. The islands would be patterned from a precursor magnetic film using nanolithography. It is one of the proposed technologies to succeed perpendicular recording due to the greater storage densities it would enable. BPM was introduced by Toshiba in 2010.
Lift-off process in microstructuring technology is a method of creating structures (patterning) of a target material on the surface of a substrate using a sacrificial material .
It is an additive technique as opposed to more traditional subtracting technique like etching.
The scale of the structures can vary from the nanoscale up to the centimeter scale or further, but are typically of micrometric dimensions.
Stencil lithography is a novel method of fabricating nanometer scale patterns using nanostencils, stencils with nanometer size apertures. It is a resist-less, simple, parallel nanolithography process, and it does not involve any heat or chemical treatment of the substrates .
SÜSS MicroTec SE is a supplier of equipment and process solutions for the semiconductor industry and related markets.
The microstructuring systems like photolithography tools are used for manufacturing of processors, memory chips, MEMS, LED and other micro system devices.
X-ray lithography, is a process used in electronic industry to selectively remove parts of a thin film. It uses X-rays to transfer a geometric pattern from a mask to a light-sensitive chemical photoresist, or simply "resist," on the substrate. A series of chemical treatments then engraves the produced pattern into the material underneath the photoresist.
Three-dimensional (3D) microfabrication refers to manufacturing techniques that involve the layering of materials to produce a three-dimensional structure at a microscopic scale. These structures are usually on the scale of micrometers and are popular in microelectronics and microelectromechanical systems.
