In an integrated circuit, a signal can couple from one node to another via the substrate. This phenomenon is referred to as substrate coupling or substrate noise coupling.
The push for reduced cost, more compact circuit boards, and added customer features has provided incentives for the inclusion of analog functions on primarily digital MOS integrated circuits (ICs) forming mixed-signal ICs. In these systems, the speed of digital circuits is constantly increasing, chips are becoming more densely packed, interconnect layers are added, and analog resolution is increased. In addition, recent increase in wireless applications and its growing market are introducing a new set of aggressive design goals for realizing mixed-signal systems. Here, the designer integrates radio frequency (RF) analog and base band digital circuitry on a single chip. The goal is to make single-chip radio frequency integrated circuits (RFICs) on silicon, where all the blocks are fabricated on the same chip. One of the advantages of this integration is low power dissipation for portability due to a reduction in the number of package pins and associated bond wire capacitance. Another reason that an integrated solution offers lower power consumption is that routing high-frequency signals off-chip often requires a 50Ω impedance match, which can result in higher power dissipation. Other advantages include improved high-frequency performance due to reduced package interconnect parasitics, higher system reliability, smaller package count, and higher integration of RF components with VLSI-compatible digital circuits. In fact, the single-chip transceiver is now a reality.
The design of such systems, however, is a complicated task. There are two main challenges in realizing mixed-signal ICs. The first challenging task, specific to RFICs, is to fabricate good on-chip passive elements such as high-Q inductors. The second challenging task, applicable to any mixed-signal IC and the subject of this chapter, is to minimize noise coupling between various parts of the system to avoid any malfunctioning of the system. In other words, for successful system-on-chip integration of mixed-signal systems, the noise coupling caused by nonideal isolation must be minimized so that sensitive analog circuits and noisy digital circuits can effectively coexist, and the system operates correctly. To elaborate, note that in mixed-signal circuits, both sensitive analog circuits and high-swing high-frequency noise injector digital circuits may be present on the same chip, leading to undesired signal coupling between these two types of circuit via the conductive substrate. The reduced distance between these circuits, which is the result of constant technology scaling (see Moore's law and the International Technology Roadmap for Semiconductors), exacerbates the coupling. The problem is severe, since signals of different nature and strength interfere, thus affecting the overall performance, which demands higher clock rates and greater analog precisions.
The primary mixed-signal noise coupling problem comes from fast-changing digital signals coupling to sensitive analog nodes. Another significant cause of undesired signal coupling is the crosstalk between analog nodes themselves owing to high-frequency/high-power analog signals. One of the media through which mixed-signal noise coupling occurs is the substrate. Digital operations cause fluctuations in the underlying substrate voltage, which spreads through the common substrate causing variations in the substrate potential of sensitive devices in the analog section. Similarly, in the case of crosstalk between analog nodes, a signal can couple from one node to another via the substrate. This phenomenon is referred to as substrate coupling or substrate noise coupling.
There is a sizeable literature on substrate, and mixed signal coupling. Some of the most common topics are:
An amplifier, electronic amplifier or (informally) amp is an electronic device that can increase the magnitude of a signal. It is a two-port electronic circuit that uses electric power from a power supply to increase the amplitude of a signal applied to its input terminals, producing a proportionally greater amplitude signal at its output. The amount of amplification provided by an amplifier is measured by its gain: the ratio of output voltage, current, or power to input. An amplifier is defined as a circuit that has a power gain greater than one.
An integrated circuit (IC), also known as a microchip, computer chip, or simply chip, is a small electronic device made up of multiple interconnected electronic components such as transistors, resistors, and capacitors. These components are etched onto a small piece of semiconductor material, usually silicon. Integrated circuits are used in a wide range of electronic devices, including computers, smartphones, and televisions, to perform various functions such as processing and storing information. They have greatly impacted the field of electronics by enabling device miniaturization and enhanced functionality.
An operational amplifier is a DC-coupled electronic voltage amplifier with a differential input, a (usually) single-ended output, and an extremely high gain. Its name comes from its original use of performing mathematical operations in analog computers.
In electronics, an analog-to-digital converter is a system that converts an analog signal, such as a sound picked up by a microphone or light entering a digital camera, into a digital signal. An ADC may also provide an isolated measurement such as an electronic device that converts an analog input voltage or current to a digital number representing the magnitude of the voltage or current. Typically the digital output is a two's complement binary number that is proportional to the input, but there are other possibilities.
Capacitive coupling is the transfer of energy within an electrical network or between distant networks by means of displacement current between circuit(s) nodes, induced by the electric field. This coupling can have an intentional or accidental effect.
Transistor–transistor logic (TTL) is a logic family built from bipolar junction transistors. Its name signifies that transistors perform both the logic function and the amplifying function, as opposed to earlier resistor–transistor logic (RTL) and diode–transistor logic (DTL).
Complementary metal–oxide–semiconductor is a type of metal–oxide–semiconductor field-effect transistor (MOSFET) fabrication process that uses complementary and symmetrical pairs of p-type and n-type MOSFETs for logic functions. CMOS technology is used for constructing integrated circuit (IC) chips, including microprocessors, microcontrollers, memory chips, and other digital logic circuits. CMOS technology is also used for analog circuits such as image sensors, data converters, RF circuits, and highly integrated transceivers for many types of communication.
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Bipolar CMOS (BiCMOS) is a semiconductor technology that integrates two semiconductor technologies, those of the bipolar junction transistor and the CMOS logic gate, into a single integrated circuit. In more recent times the bipolar processes have been extended to include high mobility devices using silicon–germanium junctions.
A mixed-signal integrated circuit is any integrated circuit that has both analog circuits and digital circuits on a single semiconductor die. Their usage has grown dramatically with the increased use of cell phones, telecommunications, portable electronics, and automobiles with electronics and digital sensors.
Differential signalling is a method for electrically transmitting information using two complementary signals. The technique sends the same electrical signal as a differential pair of signals, each in its own conductor. The pair of conductors can be wires in a twisted-pair or ribbon cable or traces on a printed circuit board.
Integrated circuit design, semiconductor design, chip design or IC design, is a sub-field of electronics engineering, encompassing the particular logic and circuit design techniques required to design integrated circuits, or ICs. ICs consist of miniaturized electronic components built into an electrical network on a monolithic semiconductor substrate by photolithography.
In electronics, crosstalk is a phenomenon by which a signal transmitted on one circuit or channel of a transmission system creates an undesired effect in another circuit or channel. Crosstalk is usually caused by undesired capacitive, inductive, or conductive coupling from one circuit or channel to another.
Signal integrity or SI is a set of measures of the quality of an electrical signal. In digital electronics, a stream of binary values is represented by a voltage waveform. However, digital signals are fundamentally analog in nature, and all signals are subject to effects such as noise, distortion, and loss. Over short distances and at low bit rates, a simple conductor can transmit this with sufficient fidelity. At high bit rates and over longer distances or through various mediums, various effects can degrade the electrical signal to the point where errors occur and the system or device fails. Signal integrity engineering is the task of analyzing and mitigating these effects. It is an important activity at all levels of electronics packaging and assembly, from internal connections of an integrated circuit (IC), through the package, the printed circuit board (PCB), the backplane, and inter-system connections. While there are some common themes at these various levels, there are also practical considerations, in particular the interconnect flight time versus the bit period, that cause substantial differences in the approach to signal integrity for on-chip connections versus chip-to-chip connections.
In electronics, noise is an unwanted disturbance in an electrical signal.
An electronic circuit is composed of individual electronic components, such as resistors, transistors, capacitors, inductors and diodes, connected by conductive wires or traces through which electric current can flow. It is a type of electrical circuit. For a circuit to be referred to as electronic, rather than electrical, generally at least one active component must be present. The combination of components and wires allows various simple and complex operations to be performed: signals can be amplified, computations can be performed, and data can be moved from one place to another.
Electronic circuit simulation uses mathematical models to replicate the behavior of an actual electronic device or circuit. Simulation software allows for modeling of circuit operation and is an invaluable analysis tool. Due to its highly accurate modeling capability, many colleges and universities use this type of software for the teaching of electronics technician and electronics engineering programs. Electronics simulation software engages its users by integrating them into the learning experience. These kinds of interactions actively engage learners to analyze, synthesize, organize, and evaluate content and result in learners constructing their own knowledge.
In integrated circuits, optical interconnects refers to any system of transmitting signals from one part of an integrated circuit to another using light. Optical interconnects have been the topic of study due to the high latency and power consumption incurred by conventional metal interconnects in transmitting electrical signals over long distances, such as in interconnects classed as global interconnects. The International Technology Roadmap for Semiconductors (ITRS) has highlighted interconnect scaling as a problem for the semiconductor industry.
RF CMOS is a metal–oxide–semiconductor (MOS) integrated circuit (IC) technology that integrates radio-frequency (RF), analog and digital electronics on a mixed-signal CMOS RF circuit chip. It is widely used in modern wireless telecommunications, such as cellular networks, Bluetooth, Wi-Fi, GPS receivers, broadcasting, vehicular communication systems, and the radio transceivers in all modern mobile phones and wireless networking devices. RF CMOS technology was pioneered by Pakistani engineer Asad Ali Abidi at UCLA during the late 1980s to early 1990s, and helped bring about the wireless revolution with the introduction of digital signal processing in wireless communications. The development and design of RF CMOS devices was enabled by van der Ziel's FET RF noise model, which was published in the early 1960s and remained largely forgotten until the 1990s.
The Blackmer gain cell is an audio frequency voltage-controlled amplifier (VCA) circuit with an exponential control law. It was invented and patented by David E. Blackmer between 1970 and 1973. The four-transistor core of the original Blackmer cell contains two complementary bipolar current mirrors that perform log-antilog operations on input voltages in a push-pull, alternating fashion. Earlier log-antilog modulators using the fundamental exponential characteristic of a p–n junction were unipolar; Blackmer's application of push-pull signal processing allowed modulation of bipolar voltages and bidirectional currents.