RDNA 3

Last updated

RDNA 3
AMD RDNA-3 Logo.png
LaunchedDecember 13, 2022 (2022-12-13)
Designed by AMD
Manufactured by
Fabrication process
Codename(s)Navi 3x
Product Series
Desktop
Professional/workstation
Specifications
Compute
  • Up to 122.8 TFLOPS (FP16)
  • Up to 61.42 TFLOPS (FP32)
  • Up to 1.919 TFLOPS (FP64)
Clock rate 1500 MHz to 2500 MHz
Shader clock rate2269 MHz
L0 cache 64 KB (per WGP):
  • 32 KB instructions cache
  • 16 KB K data cache
L1 cache256 KB (per array)
L2 cache6 MB
L3 cacheup to 96 MB
Memory support GDDR6
Memory clock rate18-20 Gbps
PCIe support PCIe 4.0
Supported Graphics APIs
Direct3D Direct3D 12.0 Ultimate (feature level 12_2)
Shader Model Shader Model 6.7
OpenCL OpenCL 2.1
OpenGL OpenGL 4.6
Vulkan Vulkan 1.3
Media Engine
Encode codecs
Decode codecs
Color bit-depth
  • 8-bit
  • 10-bit
  • 12-bit
Encoder(s) supported
  • AMF
  • VCE
Display outputs
History
Predecessor RDNA 2
VariantCDNA 3 (datacenter)
Successor RDNA 4
Support status
Supported

RDNA 3 is a GPU microarchitecture designed by AMD, released with the Radeon RX 7000 series on December 13, 2022. Alongside powering the RX 7000 series, RDNA 3 is also featured in the SoCs designed by AMD for the Asus ROG Ally and Lenovo Legion Go consoles.

Contents

Background

On June 9, 2022, AMD held their Financial Analyst Day where they presented a client GPU roadmap which contained mention of RDNA 3 coming in 2022 and RDNA 4 coming in 2024. [1] AMD announced to investors their intention to achieve a performance-per-watt uplift of over 50% with RDNA 3 and that the upcoming architecture would be built using chiplet packaging on a 5 nm process. [2]

A sneak preview for RDNA 3 was included towards the end of AMD's Ryzen 7000 unveiling event on August 29, 2022. The preview included RDNA 3 running gameplay of Lies of P , AMD CEO Lisa Su confirming that a chiplet design would be used, and a partial look at AMD's reference design for an RDNA 3 GPU. [3]

Full details for the RDNA 3 architecture were unveiled on November 3, 2022 at an event in Las Vegas. [4]

Architecture

Chiplet packaging

For the first time ever in a consumer GPU, RDNA 3 utilizes modular chiplets rather than a single large monolithic die. AMD previously had great success with its use of chiplets in its Ryzen desktop and Epyc server processors. [5] The decision to move to a chiplet-based GPU microarchitecture was led by AMD Senior Vice President Sam Naffziger who had also lead the chiplet initiative with Ryzen and Epyc. [6] The development of RDNA 3's chiplet architecture began towards the end of 2017 with Naffziger leading the AMD graphics team in the effort. [7] The benefit of using chiplets is that dies can be fabricated on different process nodes depending on their functions and intended purpose. According to Naffziger, cache and SRAM do not scale as linearly as logic does on advanced nodes like N5 in terms of density and power consumption so they can instead be fabricated on the cheaper, more mature N6 node. The use of smaller dies rather than one large monolithic die is beneficial for maximizing wafer yields as more dies can be fitted onto a single wafer. [7] Alternatively, a large monolithic RDNA 3 die built on N5 would be more expensive to produce with lower yields.

RDNA 3 uses two types of chiplets: the Graphics Compute Die (GCD) and Memory Cache Dies (MCDs). On Ryzen and Epyc processors, AMD used its PCIe-based Infinity Fabric protocol with the package's dies connected via traces on an organic substrate. This approach is easily scalable in a cost-effective manner but has the drawbacks of increased latency, increased power consumption when moving data between dies at around 1.5 picojoules per bit, and it cannot achieve the connection density needed for high-bandwidth GPUs. [8] An organic package could not host the number of wires that would be needed to connect multiple dies in a GPU. [9]

RDNA 3's dies are instead connected using TSMC's Integrated Fan-Out Re-Distribution Layer (InFO-RDL) packaging technique which provides a silicon bridge for high bandwidth and high density die-to-die communication. [10] InFO allows dies to be connected without the use of a more costly silicon interposer such as the one used in AMD's Instinct MI200 and MI300 datacenter accelerators. Each Infinity Fanout link has 9.2 Gbps in bandwidth. Naffziger explains that "The bandwidth density that we achieve is almost 10x" with the Infinity Fanout rather than the wires used by Ryzen and Epyc processors. The chiplet interconnects in RDNA achieve cumulative bandwidth of 5.3 TB/s. [10]

Memory Cache Dies (MCDs)

With a respective 2.05 billion transistors, each Memory Cache Die (MCD) contains 16 MB of L3 cache. Theoretically, additional L3 cache could be added to the MCDs via AMD's 3D V-Cache die stacking technology as the MCDs contain unused TSV connection points. [11] [12] Also present on each MCD are two physical 32-bit GDDR6 memory interfaces for a combined 64-bit interface per MCD. [13] The Radeon RX 7900 XTX has a 384-bit memory bus through the use of six MCDs while the RX 7900 XT has a 320-bit bus due to its five MCDs.

Graphics Compute Die (GCD)

Compute Units

RDNA 3's Compute Units (CUs) for graphics processing are organized in dual CU Work Group Processors (WGPs). Rather than including a very large number of WGPs in RDNA 3 GPUs, AMD instead focussed on improving per-WGP throughput. This is done with improved dual-issue shader ALUs with the ability to execute two instructions per cycle. It can contain up to 96 graphics Compute Units that can provide up to 61 TFLOPS of compute. [14] Each RDNA 3 Compute Unit has dedicated AI acceleration with Wave MMA (matrix multiply-accumulate) instructions, [15] which can improve AI-based performance by 2.7x and also benefits ray tracing instructions, similar to Nvidia's Tensor cores. [14]

Ray tracing

RDNA 3 features second generation ray-tracing accelerators. Each Compute Unit contains one ray tracing accelerator. The overall number of ray tracing accelerators is increased due to the higher number of Compute Units, though the number of ray tracing accelerators per Compute Unit has not increased over RDNA 2.

Clock speeds

RDNA 3 was designed to support high clock speeds. On RDNA 3, clock speeds have been decoupled with the front end operating at a 2.5 GHz frequency while the shaders operate at 2.3 GHz. The shaders operating at a lower clock speed gives up to 25% power savings according to AMD and RDNA 3's shader clock speed is still 15% faster than RDNA 2. [16]

Cache and memory subsystem

RDNA 3 increased the capacity of L1 and L2 caches. The 16-way associative L1 cache shared across a shader array is doubled in RDNA 3 to 256 KB. The L2 cache increased from 4 MB on RDNA 2 to 6 MB on RDNA 3. The L3 Infinity Cache has been lowered in capacity from 128 MB to 96 MB and latency has increased as it is physically present on the MCDs rather than being closer to the WGPs within the GCD. [17] The Infinity Cache capacity was decreased due to RDNA 3 having wider a memory interface up to 384-bit whereas RDNA 2 used memory interfaces up to 256-bit. RDNA 3 having a wider 384-bit memory means that its cache hitrate does not have to be as high to still avoid bandwidth bottlenecks as there is higher memory bandwidth. [17] RDNA 3 GPUs use GDDR6 memory rather than faster GDDR6X due to the latter's increased power consumption.

Media engine

RDNA 3 is the first RDNA architecture to have a dedicated media engine. It is built into the GCD and is based on VCN 4.0 encoding and decoding core. [18] AMD's AMF AV1 encoder is comparable in quality to Nvidia's NVENC AV1 encoder but can handle a higher number of simultaneous encoding streams compared to the limit of 3 on the GeForce RTX 40 series. [19]

Supported encoding frame rates (FPS) per resolution and video coding format [20]
Resolution H.264 H.265 AV1
1080p60360360360
1440p60360360360
4K60180180240
8K60484860

Display engine

RDNA 3 GPUs feature a new display engine called the "Radiance Display Engine". AMD touted its support for DisplayPort 2.1 UHBR 13.5, delivering up to 54Gbps bandwidth for high refresh rates at 4K and 8K resolutions. [21] The Radeon Pro W7900 and W7800 support the 80Gbps UHBR20 standard. DisplayPort 2.1 can support 4K at 480 Hz and 8K at 165 Hz with Display Stream Compression (DSC). The previous DisplayPort 1.4 standard with DSC was limited to 4K at 240 Hz and 8K at 60 Hz.

Power efficiency

AMD claims that RDNA 3 achieves a 54% increase in performance-per-watt which is in line with their previous claims of 50% performance-per-watt increases for both RDNA and RDNA 2.

Graphics Compute Die (GCD)Memory Cache Die
(MCD)
Navi 31 [13] Navi 32 Navi 33
LaunchDec 2022Sep 2023Jan 2023Dec 2022
CodenamePlum BonitoWheat NasHotpink Bonefish—
Compute units
(Stream processors)
[FP32 cores]		96
(6144)
[12288]		60
(3840)
[7680]		32
(2048)
[4096]
Process TSMC N5 TSMC N6
Transistors45.4 bn.19.9 bn.13.3 bn.2.05 bn.
Transistor density150.2 MTr/mm2101.5 MTr/mm265.2 MTr/mm254.64 MTr/mm2
Die size304.35 mm2196 mm2204 mm237.52 mm2
Max TDP405 W263 W200 W—
ProductsConsumerDesktop
  • RX 7900 GRE
  • RX 7900 XT
  • RX 7900 XTX
  • RX 7700 XT
  • RX 7800 XT
  • RX 7600
  • RX 7600 XT
  • RX 7700 XT (3×)
  • RX 7800 XT (4×)
  • RX 7900 GRE (4×)
  • RX 7900 XT (5×)
  • RX 7900 XTX (6×)
Mobile
  • RX 7900M
—
  • RX 7600S
  • RX 7600M
  • RX 7600M XT
  • RX 7700S
  • RX 7900M (4×)
WorkstationDesktop
  • W7800
  • W7900
  • W7700
  • W7500
  • W7600
  • W7700 (4×)
  • W7800 (4×)
  • W7900 (6×)
Mobile————

Products

Gaming

Desktop

SKU
(GPU Die)		Release Date
& Price		 Architecture
&  fab 		Chiplets Transistors
& die size [lower-alpha 1] 		Core Fillrate [lower-alpha 2] [lower-alpha 3] [lower-alpha 4] Processing power [lower-alpha 2] [lower-alpha 5]
(TFLOPS)		 Infinity Cache MemoryTBPInterface
Config [lower-alpha 6] [lower-alpha 7] Clock [lower-alpha 2]
(MHz)		Texture
(GT/s)		Pixel
(GP/s)		 FP16 FP32 FP64 SizeBandwidth
(GB/s)		SizeBandwidth
(GB/s)		Bus type
& width		Clock
(Gb/s)
Radeon RX 7600
(Navi 33) [23] 		May 25, 2023
$269 USD		 RDNA 3
TSMC N6 		Monolithic13.3×109
204 mm2		32 CUs
2048:128:64:32:64		1720
2655		220.2
339.8		110.1
169.9		28.18
43.50		14.09
21.75		0.440
0.680		32 MB476.98 GB288 GDDR6
128-bit		18.0165 W PCIe 4.0
×8
Radeon RX 7600 XT
(Navi 33) [24] [25] 		Jan 24, 2024
$329 USD		1720
2755		220.2
352.6		110.1
176.3		28.18
45.14		14.09
22.57		0.440
0.705		16 GB190 W
Radeon RX 7700 XT
(Navi 32) [26] 		Sep 6, 2023
$449 USD		RDNA 3
TSMC N5 (GCD)
TSMC N6 (MCD)		1 × GCD
3 × MCD		28.1×109
346 mm2		54 CUs
3456:216:96:54:108		1900
2544		410.4
549.5		182.4
244.2		52.53
70.34		26.27
35.17		0.821
1.099		48 MB199512 GB432GDDR6
192-bit		245 WPCIe 4.0
×16
Radeon RX 7800 XT
(Navi 32) [27] 		Sep 6, 2023
$499 USD		1 × GCD
4 × MCD		60 CUs
3840:240:96:60:120		1800
2430		432
583.2		172.8
233.2		55.30
74.65		27.64
37.32		0.864
1.166		64 MB270816 GB624GDDR6
256-bit		19.5263 W
Radeon RX 7900 GRE
(Navi 31) [28] 		Jul 27, 2023
China only,
Feb 27, 2024
$549 USD		57.7×109
529 mm2		80 CUs
5120:320:192:80:160		1270
2245		406.4
718.4		243.8
431.0		52.02
91.96		26.01
45.98		0.813
1.437		225057618.0260 W
Radeon RX 7900 XT
(Navi 31) [29] 		Dec 13, 2022
$899 USD		1 × GCD
5 × MCD		84 CUs
5376:336:192:84:168		1500
2400		504.0
806.4		288.0
460.8		64.51
103.2		32.26
51.61		1.008
1.613		80 MB290020 GB800GDDR6
320-bit		20.0315 W
Radeon RX 7900 XTX
(Navi 31) [30] 		Dec 13, 2022
$999 USD		1 × GCD
6 × MCD		96 CUs
6144:384:192:96:192		1900
2500		729.6
960.0		364.8
480.0		93.39
122.9		46.69
61.44		1.459
1.920		96 MB350024 GB960GDDR6
384-bit		355 W
  1. ↑ Approximate die size of entire MCM package that consists of single GCD (Graphics Compute Die) and six MCDs (Memory Cache Die).
    The Radeon RX 7900 XT has only five active MCDs, while the inactive one is for structural support and heat dissipation. Die size of GCD is 306 mm2, size of each MCD is 37.5 mm2. [22]
  2. 1 2 3 Boost values (if available) are stated below the base value in italic.
  3. ↑ Texture fillrate is calculated as the number of Texture Mapping Units multiplied by the base (or boost) core clock speed.
  4. ↑ Pixel fillrate is calculated as the number of Render Output Units multiplied by the base (or boost) core clock speed.
  5. ↑ Precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  6. ↑ Compute Units (CUs)
    Unified shaders  : Texture mapping units  : Render output units  : Ray accelerators  : AI accelerators
  7. ↑ GPUs based on RDNA 3 have dual-issue stream processors so that up to two shader instructions can be executed per clock cycle under certain parallelism conditions.

Mobile

Model
(Code name)		Release
date		 Architecture
&  fab 		Chiplets Transistors
& die size		Core Fillrate [lower-alpha 1] [lower-alpha 2] [lower-alpha 3] Processing power [lower-alpha 1] [lower-alpha 4]
(TFLOPS) [lower-alpha 5] 		Infinity
Cache 		Memory TDP Interface
Config [lower-alpha 6] Clock [lower-alpha 1]
(MHz)		Texture
(GT/s)		Pixel
(GP/s)		 Half Single Double SizeBandwidth
(GB/s)		Bus type
& width		Clock
(MT/s)
Radeon RX 7600S
(Navi 33) [31] 		Jan 4, 2023 RDNA 3
TSMC N6 		Monolithic13.3×109
204 mm2		28 CUs
1792:112:64:28:56		1500
2200		168.0
246.4		96.00
140.8		21.50
31.54		10.75
15.77		0.336
0.493		32 MB8 GB256 GDDR6
128-bit		1600075 W PCIe 4.0
×8
Radeon RX 7600M
(Navi 33) [32] 		1500
2410		168.0
269.9		96.0
154.2		21.50
34.55		10.75
17.28		0.336
0.540		90 W
Radeon RX 7600M XT
(Navi 33) [33] 		32 CUs
2048:128:64:32:64		1500
2615		192.0
334.1		96.00
167.0		24.58
42.84		12.29
21.42		0.384
0.669		28818000120 W
Radeon RX 7700S
(Navi 33) [34] 		1500
2500		192.0
320.0		96.0
160.0		24.58
40.96		12.29
20.48		0.384
0.640		100 W
Radeon RX 7900M
(Navi 31) [35] 		Oct 19, 2023RDNA 3
TSMC N5 (GCD)
TSMC N6 (MCD)		1 × GCD
4 × MCD		57.7×109
529 mm2		72 CUs
4608:288:192:72:144
2090
601.9
401.3
77.05
38.52
1.204		64 MB16 GB576GDDR6
256-bit		180 W PCIe 4.0
×16
  1. 1 2 3 Boost values (if available) are stated below the base value in italic.
  2. ↑ Texture fillrate is calculated as the number of Texture Mapping Units multiplied by the base (or boost) core clock speed.
  3. ↑ Pixel fillrate is calculated as the number of Render Output Units multiplied by the base (or boost) core clock speed.
  4. ↑ Precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  5. ↑ GPUs based on RDNA 3 have dual-issue stream processors so that up to two shader instructions can be executed per clock cycle under certain parallelism conditions.
  6. ↑ Unified shaders  : Texture mapping units  : Render output units  : Ray accelerators  : AI accelerators and Compute units (CU)

Workstation

Desktop workstation

SKU
(GPU Die)		Release datePrice
(USD)		 Architecture
&  fab 		Chiplets Transistors
& die size [lower-alpha 1] 		Core Fillrate [lower-alpha 2] [lower-alpha 3] [lower-alpha 4] Processing power [lower-alpha 2] [lower-alpha 5]
(TFLOPS)		 Infinity
Cache 		Memory TDP Bus
interface
Config [lower-alpha 6] [lower-alpha 7] Clock [lower-alpha 2]
(MHz)		Texture
(GT/s)		Pixel
(GP/s)		 FP16 FP32 FP64 SizeBandwidth
(GB/s)		Bus type
& width		Clock
(Gb/s)
Radeon Pro W7500
(Navi 33) [36] [37] 		Aug 3, 2023$429 RDNA 3
TSMC N6 		Monolithic13.3×109
204 mm2		28 CUs
1792:112:64:28:56		1500
1700		168.0
190.4		96.0
108.8
24.37
12.19
0.381		32 MB8 GB172 GDDR6
128-bit		18.070 W PCIe 4.0
×8
Radeon Pro W7600
(Navi 33) [36] [38] 		$59932 CUs
2048:128:64:32:64		1720
2440		220.16
312.32		110.08
156.16
39.98
19.99
0.625		288130 W
Radeon Pro W7700
(Navi 32)		Nov 13, 2023$999RDNA 3
TSMC N5 (GCD)
TSMC N6 (MCD)		1 × GCD
4 × MCD		28.1×109
~346 mm2		48 CUs
3072:192:96:48:96		1900
2600		364.8
499.2		182.4
249.2		56.5428.30.88464 MB16 GB576GDDR6
256-bit		190 WPCIe 4.0
×16
Radeon Pro W7800
(Navi 31) [39] [40] 		Apr 13, 2023$2,49957.7×109
~531 mm2		70 CUs
4480:280:128:70:128		1855
2499		519.40
699.72		237.44
319.87
90.50
45.25
1.414		32 GB260 W
Radeon Pro W7900
(Navi 31) [39] [41] 		$3,9991 × GCD
6 × MCD		96 CUs
6144:384:192:96:192		1855
2495		712.32
958.08		356.16
479.04
122.6
61.32
1.916		96 MB48 GB864GDDR6
384-bit		295 W
  1. ↑ Approximate die size of entire MCM package that consists of single GCD (Graphics Compute Die) and six MCDs (Memory Cache Die).
    Radeon Pro W7800 has only four active MCDs, inactive one is for structural support and heat dissipation.
  2. 1 2 3 Boost values (if available) are stated below the base value in italic.
  3. ↑ Texture fillrate is calculated as the number of Texture Mapping Units multiplied by the base (or boost) core clock speed.
  4. ↑ Pixel fillrate is calculated as the number of Render Output Units multiplied by the base (or boost) core clock speed.
  5. ↑ Precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  6. ↑ Compute Units (CUs)
    Unified shaders  : Texture Mapping Units  : Render Output Units  : Ray Accelerators  : AI Accelerators
  7. ↑ GPUs based on RDNA 3 have dual-issue stream processors so that up to two shader instructions can be executed per clock cycle under certain parallelism conditions.

Integrated graphics processing units (iGPUs)

ModelLaunchCodename Architecture
& fab 		Die
size		Core Fillrate [lower-alpha 1] [lower-alpha 2] [lower-alpha 3] Processing power [lower-alpha 1] [lower-alpha 4]
(GFLOPS)		 Cache TDP
Config [lower-alpha 5] [lower-alpha 6] Clock [lower-alpha 1]
(MHz)		Texture
(GT/s)		Pixel
(GP/s)		 Half
[FP16]		 Single
[FP32]		 Double
[FP64]		L0L1L2
Radeon 740M Apr 2023PhoenixRDNA 3
TSMC   N4P 		178 mm24 CUs
256:16:8:4		2,50040.020.05,1202,56080.064 KB512 KB2 MB15–30 W
Radeon 760M 8 CUs
512:32:16:8		1,000
2,600		32.0
83.2		21.3
55.5		4,096
10,649		2,048
5,324		64.0
166.4		128 KB1 MB35–65 W
Radeon 780M 12 CUs
768:48:24:12		1,000
2,800		40.020.06,144
17,203		3,072
8,601		192
537.6		192 KB1.5 MB
Ryzen Z1 Jun 13, 20234 CUs
256:16:8:4		2,50040.020.05,1202,56080.064 KB512 KB9–30 W
Ryzen Z1 Extreme 12 CUs
768:48:24:12		2,800134.467.217,2038,600268.8192 KB1.5 MB
  1. 1 2 3 Boost values (if available) are stated below the base value in italic.
  2. ↑ Texture fillrate is calculated as the number of Texture Mapping Units multiplied by the base (or boost) core clock speed.
  3. ↑ Pixel fillrate is calculated as the number of Render Output Units multiplied by the base (or boost) core clock speed.
  4. ↑ Precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  5. ↑ Compute Units (CUs)
    Stream Processors  : Texture mapping units  : Render output units  : Ray accelerators
  6. ↑ GPUs based on RDNA 3 have dual-issue stream processors so that up to two shader instructions can be executed per clock cycle under certain parallelism conditions.

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The Radeon RX 5000 series is a series of graphics processors developed by AMD, based on their RDNA architecture. The series is targeting the mainstream mid to high-end segment and is the successor to the Radeon RX Vega series. The launch occurred on July 7, 2019. It is manufactured using TSMC's 7 nm FinFET semiconductor fabrication process.

<span class="mw-page-title-main">RDNA (microarchitecture)</span> GPU microarchitecture and accompanying instruction set architecture

RDNA is a graphics processing unit (GPU) microarchitecture and accompanying instruction set architecture developed by AMD. It is the successor to their Graphics Core Next (GCN) microarchitecture/instruction set. The first product lineup featuring RDNA was the Radeon RX 5000 series of video cards, launched on July 7, 2019. The architecture is also used in mobile products. It is manufactured and fabricated with TSMC's N7 FinFET graphics chips used in the Navi series of AMD Radeon graphics cards.

The AMD Radeon 600 series is a series of graphics processors developed by AMD. Its cards are desktop and mobile rebrands of previous generation Polaris cards, available only for OEMs. The series is targeting the entry-level segment and launched on August 13, 2019.

<span class="mw-page-title-main">RDNA 2</span> GPU microarchitecture by AMD released in 2020

RDNA 2 is a GPU microarchitecture designed by AMD, released with the Radeon RX 6000 series on November 18, 2020. Alongside powering the RX 6000 series, RDNA 2 is also featured in the SoCs designed by AMD for the PlayStation 5, Xbox Series X/S, and Steam Deck consoles.

<span class="mw-page-title-main">Zen 3</span> 2020 AMD 7-nanometer processor microarchitecture

Zen 3 is the codename for a CPU microarchitecture by AMD, released on November 5, 2020. It is the successor to Zen 2 and uses TSMC's 7 nm process for the chiplets and GlobalFoundries's 14 nm process for the I/O die on the server chips and 12 nm for desktop chips. Zen 3 powers Ryzen 5000 mainstream desktop processors and Epyc server processors. Zen 3 is supported on motherboards with 500 series chipsets; 400 series boards also saw support on select B450 / X470 motherboards with certain BIOSes. Zen 3 is the last microarchitecture before AMD switched to DDR5 memory and new sockets, which are AM5 for the desktop "Ryzen" chips alongside SP5 and SP6 for the EPYC server platform and sTRX8. According to AMD, Zen 3 has a 19% higher instructions per cycle (IPC) on average than Zen 2.

<span class="mw-page-title-main">Radeon RX 6000 series</span> Series of video cards by AMD

The Radeon RX 6000 series is a series of graphics processing units developed by AMD, based on their RDNA 2 architecture. It was announced on October 28, 2020 and is the successor to the Radeon RX 5000 series. It consists of the entry-level RX 6400, mid-range RX 6500 XT, high-end RX 6600, RX 6600 XT, RX 6650 XT, RX 6700, RX 6700 XT, upper high-end RX 6750 XT, RX 6800, RX 6800 XT, and enthusiast RX 6900 XT and RX 6950 XT for desktop computers; and the RX 6600M, RX 6700M, and RX 6800M for laptops. A sub-series for mobile, Radeon RX 6000S, was announced in CES 2022, targeting thin and light laptop designs.

<span class="mw-page-title-main">CDNA (microarchitecture)</span> AMD compute-focused GPU microarchitecture

CDNA is a compute-centered graphics processing unit (GPU) microarchitecture designed by AMD for datacenters. Mostly used in the AMD Instinct line of data center graphics cards, CDNA is a successor to the Graphics Core Next (GCN) microarchitecture; the other successor being RDNA, a consumer graphics focused microarchitecture.

<span class="mw-page-title-main">Radeon RX 7000 series</span> Series of video cards by AMD

The Radeon RX 7000 series is a series of graphics processing units developed by AMD, based on their RDNA 3 architecture. It was announced on November 3, 2022 and is the successor to the Radeon RX 6000 series. Currently AMD has announced and released seven graphics cards of the Radeon RX 7000 series: RX 7600, RX 7600 XT, RX 7700 XT, RX 7800 XT, RX 7900 GRE, RX 7900 XT, and RX 7900 XTX. AMD officially launched the RX 7900 XT and RX 7900 XTX on December 13, 2022. AMD released the RX 7600 on May 25, 2023. AMD released their last two models of the RDNA 3 family on September 6, 2023; the 7700 XT and the 7800 XT. As of January 2024, AMD have also released the RX 7600 XT and the RX 7900 GRE.

References

  1. ↑ Smith, Ryan (June 9, 2022). "AMD's 2022-2024 Client GPU Roadmap: RDNA 3 This Year, RDNA 4 Lands in 2024". AnandTech. Retrieved April 8, 2023.
  2. ↑ Walton, Jarred (June 9, 2022). "AMD GPU Roadmap: RDNA 3 With 5nm GPU Chiplets Coming This Year". Tom's Hardware. Retrieved April 8, 2023.
  3. ↑ Wickens, Katie (August 31, 2022). "AMD's Lisa Su confirms chiplet-based RDNA 3 GPU architecture". PC Gamer. Retrieved April 8, 2023.
  4. ↑ "AMD Unveils World's Most Advanced Gaming Graphics Cards, Built on Groundbreaking AMD RDNA 3 Architecture with Chiplet Design". AMD (Press release). Las Vegas, NV. November 3, 2022. Retrieved April 8, 2023.
  5. ↑ James, Dave (June 24, 2022). "AMD suggests a Ryzen-like design for RDNA 3 chiplets would be 'a reasonable inference'". PC Gamer. Retrieved April 8, 2023.
  6. ↑ Alcorn, Paul; Walton, Jarred (June 23, 2022). "Into the GPU Chiplet Era: An Interview With AMD's Sam Naffziger". Tom's Hardware. Retrieved April 8, 2023.
  7. 1 2 Brosdahl, Peter (November 22, 2022). "AMD Lead Engineer Sam Naffziger Explains Advantages of RDNA3 Chiplet Design". The FPS Review. Retrieved April 8, 2023.
  8. ↑ Walton, Jarred (June 5, 2023). "AMD RDNA 3 GPU Architecture Deep Dive: The Ryzen Moment for GPUs". Tom's Hardware. Retrieved April 29, 2024.
  9. ↑ Ridley, Jacob (November 14, 2022). "AMD's Infinity Links is the unsung hero of RDNA 3 and chiplet gaming GPUs". PC Gamer. Retrieved April 29, 2024.
  10. 1 2 "AMD Explains the Economics Behind Chiplets for GPUs". TechPowerUp. November 14, 2022. Retrieved April 8, 2023.
  11. ↑ Klotz, Aaron (January 29, 2023). "AMD GPU Appears to Leave Room for Future 3D V-Cache". Tom's Hardware. Retrieved April 8, 2023.
  12. ↑ Ridley, Jacob (January 30, 2023). "Tiny spots on AMD's RDNA 3 GPU hint at massive cache potential". PC Gamer. Retrieved April 8, 2023.
  13. 1 2 Walton, Jarred (November 14, 2022). "AMD RDNA 3 GPU Architecture Deep Dive: The Ryzen Moment for GPUs". Tom's Hardware. Retrieved April 8, 2023.
  14. 1 2 Gula, Damien (November 3, 2022). "AMD's RDNA 3 GPUs are Way Cheaper Than the RTX 4090". Gizmodo. Retrieved April 8, 2023.
  15. ↑ Vasishta, Aaryaman (January 10, 2023). "How to accelerate AI applications on RDNA 3 using WMMA". GPUOpen. Archived from the original on January 10, 2023. Retrieved August 14, 2023.
  16. ↑ Olšan, Jan (November 7, 2022). "AMD RDNA 3 details: architecture changes, AI acceleration, DP 2.1". HWCooling. Retrieved April 8, 2023.
  17. 1 2 "Microbenchmarking AMD's RDNA 3 Graphics Architecture". Chips and Cheese. January 7, 2023. Retrieved April 29, 2024.
  18. ↑ Shilov, Anton (May 4, 2022). "First Details About AMD's Next Generation Video Engine Revealed". Tom's Hardware. Retrieved April 10, 2023.
  19. ↑ Klotz, Aaron (December 12, 2022). "AMD's Radeon RX 7900 AV1 encoder is almost on par with Intel Arc and Nvidia's RTX 40 series". TechSpot. Retrieved April 8, 2023.
  20. ↑ Taylor, Adam (December 14, 2022). "Tested: With RDNA 3, AMD Radeon is finally useful for content creators". PCWorld. Retrieved April 8, 2023.
  21. ↑ Sag, Anshel (November 14, 2022). "AMD's New Radeon RX 7900XTX And 7900XT Put The Pressure On NVIDIA". Forbes. Retrieved April 8, 2023.
  22. ↑ "AMD Unveils World's Most Advanced Gaming Graphics Cards, Built on Groundbreaking AMD RDNA 3 Architecture with Chiplet Design". AMD (Press release). April 21, 2023.
  23. ↑ "AMD Radeon RX 7600 Specs". TechPowerUp. Retrieved May 24, 2023.
  24. ↑ "AMD Radeon RX 7600 XT Specs". TechPowerUp. Retrieved January 8, 2024.
  25. ↑ Mujtaba, Hassan (January 8, 2024). "AMD Radeon RX 7600 XT 16 GB GPU Introduced: Faster 2048 Core RDNA 3 Chip, Double The VRAM of RTX 4060 At $329". Wccftech. Retrieved January 8, 2024.
  26. ↑ "AMD Radeon RX 7700 XT Specs". TechPowerUp. Retrieved August 25, 2023.
  27. ↑ "AMD Radeon RX 7800 XT Specs". TechPowerUp. Retrieved August 25, 2023.
  28. ↑ Walton, Jarred (February 26, 2024). "AMD Radeon RX 7900 GRE review: the lowest binned Navi 31 variant is now globally available, starting at $549". Tom's Hardware. Retrieved March 1, 2024.
  29. ↑ "AMD Radeon RX 7900 XT Specs". TechPowerUp. Retrieved November 4, 2022.
  30. ↑ "AMD Radeon RX 7900 XTX Specs". TechPowerUp. Retrieved November 4, 2022.
  31. ↑ "AMD Radeon RX 7600S Specs". TechPowerUp. Retrieved January 16, 2023.
  32. ↑ "AMD Radeon RX 7600M Specs". TechPowerUp. Retrieved January 16, 2023.
  33. ↑ "AMD Radeon RX 7600M XT Specs". TechPowerUp. Retrieved April 20, 2023.
  34. ↑ "AMD Radeon RX 7700S Specs". TechPowerUp. Retrieved January 16, 2023.
  35. ↑ "AMD Radeon RX 7900M Specs". TechPowerUp. Retrieved November 15, 2023.
  36. 1 2 "New AMD Radeon PRO W7000 Series Workstation Graphics Cards Deliver Advanced Technologies and Exceptional Performance for Mainstream Professional Workflows" (Press release). AMD. August 3, 2023. Retrieved August 4, 2023.
  37. ↑ "AMD Radeon PRO W7500 Specs". TechPowerUp. Retrieved August 4, 2023.
  38. ↑ "AMD Radeon PRO W7600 Specs". TechPowerUp. Retrieved August 4, 2023.
  39. 1 2 "AMD Unveils the Most Powerful AMD Radeon PRO Graphics Cards, Offering Unique Features and Leadership Performance to Tackle Heavy to Extreme Professional Workloads" (Press release). AMD. April 13, 2023. Retrieved April 13, 2023.
  40. ↑ "AMD Radeon PRO W7800 Specs". TechPowerUp. Retrieved April 13, 2023.
  41. ↑ "AMD Radeon PRO W7900 Specs". TechPowerUp. Retrieved April 13, 2023.
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