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A capacitively coupled plasma (CCP) is one of the most common types of industrial plasma sources. It essentially consists of two metal electrodes separated by a small distance, placed in a reactor. The gas pressure in the reactor can be lower than atmosphere or it can be atmospheric.
A typical CCP system is driven by a single radio-frequency (RF) power supply, typically at 13.56 MHz. [1] One of two electrodes is connected to the power supply, and the other one is grounded. As this configuration is similar in principle to a capacitor in an electric circuit, the plasma formed in this configuration is called a capacitively coupled plasma.
When an electric field is generated between electrodes, atoms are ionized and release electrons. The electrons in the gas are accelerated by the RF field and can ionize the gas directly or indirectly by collisions, producing secondary electrons. When the electric field is strong enough, it can lead to what is known as electron avalanche. After avalanche breakdown, the gas becomes electrically conductive due to abundant free electrons. Often it accompanies light emission from excited atoms or molecules in the gas. When visible light is produced, plasma generation can be indirectly observed even with bare eyes.
A variation on capacitively coupled plasma involves isolating one of the electrodes, usually with a capacitor. The capacitor appears like a short circuit to the high frequency RF field, but like an open circuit to direct current (DC) field. Electrons impinge on the electrode in the sheath, and the electrode quickly acquires a negative charge (or self-bias) because the capacitor does not allow it to discharge to ground. This sets up a secondary, DC field across the plasma in addition to the alternating current (AC) field. Massive ions are unable to react to the quickly changing AC field, but the strong, persistent DC field accelerates them toward the self-biased electrode. These energetic ions are exploited in many microfabrication processes (see reactive-ion etching (RIE)) by placing a substrate on the isolated (self-biased) electrode.
CCPs have wide applications in the semiconductor processing industry for thin film deposition (see sputtering, plasma-enhanced chemical vapor deposition (PECVD)) and etching.
An electric current is a flow of charged particles, such as electrons or ions, moving through an electrical conductor or space. It is defined as the net rate of flow of electric charge through a surface. The moving particles are called charge carriers, which may be one of several types of particles, depending on the conductor. In electric circuits the charge carriers are often electrons moving through a wire. In semiconductors they can be electrons or holes. In an electrolyte the charge carriers are ions, while in plasma, an ionized gas, they are ions and electrons.
A fusor is a device that uses an electric field to heat ions to a temperature in which they undergo nuclear fusion. The machine induces a voltage between two metal cages, inside a vacuum. Positive ions fall down this voltage drop, building up speed. If they collide in the center, they can fuse. This is one kind of an inertial electrostatic confinement device – a branch of fusion research.
A corona discharge is an electrical discharge caused by the ionization of a fluid such as air surrounding a conductor carrying a high voltage. It represents a local region where the air has undergone electrical breakdown and become conductive, allowing charge to continuously leak off the conductor into the air. A corona discharge occurs at locations where the strength of the electric field around a conductor exceeds the dielectric strength of the air. It is often seen as a bluish glow in the air adjacent to pointed metal conductors carrying high voltages, and emits light by the same mechanism as a gas discharge lamp. Corona discharges can also happen in weather, such as thunderstorms, where objects like ship masts or airplane wings have a charge significantly different from the air around them.
A flashtube (flashlamp) is an electric arc lamp designed to produce extremely intense, incoherent, full-spectrum white light for a very short time. A flashtube is a glass tube with an electrode at each end and is filled with a gas that, when triggered, ionizes and conducts a high-voltage pulse to make light. Flashtubes are used most in photography; they also are used in science, medicine, industry, and entertainment.
Paschen's law is an equation that gives the breakdown voltage, that is, the voltage necessary to start a discharge or electric arc, between two electrodes in a gas as a function of pressure and gap length. It is named after Friedrich Paschen who discovered it empirically in 1889.
Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching. RIE uses chemically reactive plasma to remove material deposited on wafers. The plasma is generated under low pressure (vacuum) by an electromagnetic field. High-energy ions from the plasma attack the wafer surface and react with it.
Neutron generators are neutron source devices which contain compact linear particle accelerators and that produce neutrons by fusing isotopes of hydrogen together. The fusion reactions take place in these devices by accelerating either deuterium, tritium, or a mixture of these two isotopes into a metal hydride target which also contains deuterium, tritium or a mixture of these isotopes. Fusion of deuterium atoms results in the formation of a helium-3 ion and a neutron with a kinetic energy of approximately 2.5 MeV. Fusion of a deuterium and a tritium atom results in the formation of a helium-4 ion and a neutron with a kinetic energy of approximately 14.1 MeV. Neutron generators have applications in medicine, security, and materials analysis.
An inductively coupled plasma (ICP) or transformer coupled plasma (TCP) is a type of plasma source in which the energy is supplied by electric currents which are produced by electromagnetic induction, that is, by time-varying magnetic fields.
In electronics, electrical breakdown or dielectric breakdown is a process that occurs when an electrically insulating material, subjected to a high enough voltage, suddenly becomes a conductor and current flows through it. All insulating materials undergo breakdown when the electric field caused by an applied voltage exceeds the material's dielectric strength. The voltage at which a given insulating object becomes conductive is called its breakdown voltage and, in addition to its dielectric strength, depends on its size and shape, and the location on the object at which the voltage is applied. Under sufficient voltage, electrical breakdown can occur within solids, liquids, or gases. However, the specific breakdown mechanisms are different for each kind of dielectric medium.
A glow discharge is a plasma formed by the passage of electric current through a gas. It is often created by applying a voltage between two electrodes in a glass tube containing a low-pressure gas. When the voltage exceeds a value called the striking voltage, the gas ionization becomes self-sustaining, and the tube glows with a colored light. The color depends on the gas used.
A nitrogen laser is a gas laser operating in the ultraviolet range using molecular nitrogen as its gain medium, pumped by an electrical discharge.
An electron avalanche is a process in which a number of free electrons in a transmission medium are subjected to strong acceleration by an electric field and subsequently collide with other atoms of the medium, thereby ionizing them. This releases additional electrons which accelerate and collide with further atoms, releasing more electrons—a chain reaction. In a gas, this causes the affected region to become an electrically conductive plasma.
Plasma etching is a form of plasma processing used to fabricate integrated circuits. It involves a high-speed stream of glow discharge (plasma) of an appropriate gas mixture being shot at a sample. The plasma source, known as etch species, can be either charged (ions) or neutral. During the process, the plasma generates volatile etch products at room temperature from the chemical reactions between the elements of the material etched and the reactive species generated by the plasma. Eventually the atoms of the shot element embed themselves at or just below the surface of the target, thus modifying the physical properties of the target.
Plasma activation is a method of surface modification employing plasma processing, which improves surface adhesion properties of many materials including metals, glass, ceramics, a broad range of polymers and textiles and even natural materials such as wood and seeds. Plasma functionalization also refers to the introduction of functional groups on the surface of exposed materials. It is widely used in industrial processes to prepare surfaces for bonding, gluing, coating and painting. Plasma processing achieves this effect through a combination of reduction of metal oxides, ultra-fine surface cleaning from organic contaminants, modification of the surface topography and deposition of functional chemical groups. Importantly, the plasma activation can be performed at atmospheric pressure using air or typical industrial gases including hydrogen, nitrogen and oxygen. Thus, the surface functionalization is achieved without expensive vacuum equipment or wet chemistry, which positively affects its costs, safety and environmental impact. Fast processing speeds further facilitate numerous industrial applications.
Plasma-enhanced chemical vapor deposition (PECVD) is a chemical vapor deposition process used to deposit thin films from a gas state (vapor) to a solid state on a substrate. Chemical reactions are involved in the process, which occur after creation of a plasma of the reacting gases. The plasma is generally created by radio frequency (RF) frequency or direct current (DC) discharge between two electrodes, the space between which is filled with the reacting gases.
Plasma-immersion ion implantation (PIII) or pulsed-plasma doping is a surface modification technique of extracting the accelerated ions from the plasma by applying a high voltage pulsed DC or pure DC power supply and targeting them into a suitable substrate or electrode with a semiconductor wafer placed over it, so as to implant it with suitable dopants. The electrode is a cathode for an electropositive plasma, while it is an anode for an electronegative plasma. Plasma can be generated in a suitably designed vacuum chamber with the help of various plasma sources such as electron cyclotron resonance plasma source which yields plasma with the highest ion density and lowest contamination level, helicon plasma source, capacitively coupled plasma source, inductively coupled plasma source, DC glow discharge and metal vapor arc. The vacuum chamber can be of two types - diode and triode type depending upon whether the power supply is applied to the substrate as in the former case or to the perforated grid as in the latter.
Plasma is one of four fundamental states of matter, characterized by the presence of a significant portion of charged particles in any combination of ions or electrons. It is the most abundant form of ordinary matter in the universe, mostly in stars, but also dominating the rarefied intracluster medium and intergalactic medium. Plasma can be artificially generated by heating a neutral gas or subjecting it to a strong electromagnetic field.
Ion milling is a specialized physical etching technique that is a crucial step in the preparation of material analysis techniques. After a specimen goes through ion milling, the surface becomes much smoother and more defined, which allows scientists to study the material much easier. The ion mill generates high-energy particles to remove material off the surface of a specimen, similar to how sand and dust particles wear away at rocks in a canyon to create a smooth surface. Relative to other techniques, ion milling creates much less surface damage [3], which makes it perfect for surface-sensitive analytical techniques. This article discusses the principle, equipment, applications, and significance of ion milling.
Plasma-activated bonding is a derivative, directed to lower processing temperatures for direct bonding with hydrophilic surfaces. The main requirements for lowering temperatures of direct bonding are the use of materials melting at low temperatures and with different coefficients of thermal expansion (CTE).
In electromagnetism, a streamer discharge, also known as filamentary discharge, is a type of transient electric discharge which forms at the surface of a conductive electrode carrying a high voltage in an insulating medium such as air. Streamers are luminous writhing branching sparks, plasma channels composed of ionized air molecules, which repeatedly strike out from the electrode into the air.