A memory rank is a set of DRAM chips connected to the same chip select, which are therefore accessed simultaneously. In practice all DRAM chips share all of the other command and control signals, and only the chip select pins for each rank are separate (the data pins are shared across ranks). [1]
The term rank was created and defined by JEDEC, the memory industry standards group. On a DDR, DDR2, or DDR3 memory module, each rank has a 64-bit-wide data bus (72 bits wide on DIMMs that support ECC). The number of physical DRAMs depends on their individual widths. For example, a rank of ×8 (8-bit wide) DRAMs would consist of eight physical chips (nine if ECC is supported), but a rank of ×4 (4-bit wide) DRAMs would consist of 16 physical chips (18, if ECC is supported). Multiple ranks can coexist on a single DIMM. Modern DIMMs can for example feature one rank (single rank), two ranks (dual rank), four ranks (quad rank), or eight ranks (octal rank).[ citation needed ]
There is only a little difference between a dual rank UDIMM and two single-rank UDIMMs in the same memory channel, other than that the DRAMs reside on different PCBs. The electrical connections between the memory controller and the DRAMs are almost identical (with the possible exception of which chip selects go to which ranks). Increasing the number of ranks per DIMM is mainly intended to increase the memory density per channel. Too many ranks in the channel can cause excessive loading and decrease the speed of the channel. Also some memory controllers have a maximum supported number of ranks. DRAM load on the command/address (CA) bus can be reduced by using registered memory.[ citation needed ]
Predating the term rank (sometimes also called row) is the use of single-sided and double-sided modules , especially with SIMMs. While most often the number of sides used to carry RAM chips corresponded to the number of ranks, sometimes they did not. This could lead to confusion and technical issues. [2] [3]
A Multi-Ranked Buffered DIMM (MR-DIMM) allows both ranks to be accessed simultaneously by the memory controller, and is supported by AMD, Google, Microsoft, JEDEC, and Intel. [4]
There are several effects to consider regarding memory performance in multi-rank configurations:
Double Data Rate Synchronous Dynamic Random-Access Memory is a double data rate (DDR) synchronous dynamic random-access memory (SDRAM) class of memory integrated circuits used in computers. DDR SDRAM, also retroactively called DDR1 SDRAM, has been superseded by DDR2 SDRAM, DDR3 SDRAM, DDR4 SDRAM and DDR5 SDRAM. None of its successors are forward or backward compatible with DDR1 SDRAM, meaning DDR2, DDR3, DDR4 and DDR5 memory modules will not work on DDR1-equipped motherboards, and vice versa.
Synchronous dynamic random-access memory is any DRAM where the operation of its external pin interface is coordinated by an externally supplied clock signal.
A DIMM is a popular type of memory module used in computers. It is a printed circuit board with one or both sides holding DRAM chips and pins. The vast majority of DIMMs are standardized through JEDEC standards, although there are proprietary DIMMs. DIMMs come in a variety of speeds and sizes, but generally are one of two lengths: PC, which are 133.35 mm (5.25 in), and laptop (SO-DIMM), which are about half the size at 67.60 mm (2.66 in).
Rambus DRAM (RDRAM), and its successors Concurrent Rambus DRAM (CRDRAM) and Direct Rambus DRAM (DRDRAM), are types of synchronous dynamic random-access memory (SDRAM) developed by Rambus from the 1990s through to the early 2000s. The third-generation of Rambus DRAM, DRDRAM was replaced by XDR DRAM. Rambus DRAM was developed for high-bandwidth applications and was positioned by Rambus as replacement for various types of contemporary memories, such as SDRAM. RDRAM is a serial memory bus.
A SIMM is a type of memory module used in computers from the early 1980s to the early 2000s. It is a printed circuit board on which has random-access memory attached to one or both sides. It differs from a dual in-line memory module (DIMM), the most predominant form of memory module since the late 1990s, in that the contacts on a SIMM are redundant on both sides of the module. SIMMs were standardised under the JEDEC JESD-21C standard.
Double Data Rate 2 Synchronous Dynamic Random-Access Memory is a double data rate (DDR) synchronous dynamic random-access memory (SDRAM) interface. It is a JEDEC standard (JESD79-2); first published in September 2003. DDR2 succeeded the original DDR SDRAM specification, and was itself succeeded by DDR3 SDRAM in 2007. DDR2 DIMMs are neither forward compatible with DDR3 nor backward compatible with DDR.
In the fields of digital electronics and computer hardware, multi-channel memory architecture is a technology that increases the data transfer rate between the DRAM memory and the memory controller by adding more channels of communication between them. Theoretically, this multiplies the data rate by exactly the number of channels present. Dual-channel memory employs two channels. The technique goes back as far as the 1960s having been used in IBM System/360 Model 91 and in CDC 6600.
Registered memory is computer memory that has a register between the DRAM modules and the system's memory controller. A registered memory module places less electrical load on a memory controller than an unregistered one. Registered memory allows a computer system to remain stable with more memory modules than it would have otherwise.
In computing, serial presence detect (SPD) is a standardized way to automatically access information about a memory module. Earlier 72-pin SIMMs included five pins that provided five bits of parallel presence detect (PPD) data, but the 168-pin DIMM standard changed to a serial presence detect to encode more information.
Double Data Rate 3 Synchronous Dynamic Random-Access Memory is a type of synchronous dynamic random-access memory (SDRAM) with a high bandwidth interface, and has been in use since 2007. It is the higher-speed successor to DDR and DDR2 and predecessor to DDR4 synchronous dynamic random-access memory (SDRAM) chips. DDR3 SDRAM is neither forward nor backward compatible with any earlier type of random-access memory (RAM) because of different signaling voltages, timings, and other factors.
A Fully Buffered DIMM (FB-DIMM) is a type of memory module used in computer systems. It is designed to improve memory performance and capacity by allowing multiple memory modules to be each connected to the memory controller using a serial interface, rather than a parallel one. Unlike the parallel bus architecture of traditional DRAMs, an FB-DIMM has a serial interface between the memory controller and the advanced memory buffer (AMB). Conventionally, data lines from the memory controller have to be connected to data lines in every DRAM module, i.e. via multidrop buses. As the memory width increases together with the access speed, the signal degrades at the interface between the bus and the device. This limits the speed and memory density, so FB-DIMMs take a different approach to solve the problem.
Error correction code memory is a type of computer data storage that uses an error correction code (ECC) to detect and correct n-bit data corruption which occurs in memory.
A memory controller, also known as memory chip controller (MCC) or a memory controller unit (MCU), is a digital circuit that manages the flow of data going to and from a computer's main memory. When a memory controller is integrated into another chip, such as an integral part of a microprocessor, it is usually called an integrated memory controller (IMC).
In computing, a memory module or RAM stick is a printed circuit board on which memory integrated circuits are mounted.
Double Data Rate 4 Synchronous Dynamic Random-Access Memory is a type of synchronous dynamic random-access memory with a high bandwidth interface.
Low-Power Double Data Rate (LPDDR), also known as LPDDR SDRAM, is a type of synchronous dynamic random-access memory that consumes less power than other random access memory designs and is thus targeted for mobile computing devices such as laptop computers and smartphones. Older variants are also known as Mobile DDR, and abbreviated as mDDR.
In the design of modern computers, memory geometry describes the internal structure of random-access memory. Memory geometry is of concern to consumers upgrading their computers, since older memory controllers may not be compatible with later products. Memory geometry terminology can be confusing because of the number of overlapping terms.
Apollo VP3 is a x86 based Socket 7 chipset which was manufactured by VIA Technologies and was launched in 1997. On its time Apollo VP3 was a high performance, cost effective, and energy efficient chipset. It offered AGP support for Socket 7 processors which was not supported at that moment by Intel, SiS and ALi chipsets. In November 1997 FIC released motherboard PA-2012, which uses Apollo VP3 and has AGP bus. This was the first Socket 7 motherboard supporting AGP.
HyperCloud Memory (HCDIMM) is a DDR3 SDRAM dual in-line memory module (DIMM) used in server applications requiring a great deal of memory. It was initially launched in 2009 at the International Supercomputing Conference by Irvine, California, based company, Netlist Inc. It was never a JEDEC standard, and the main server vendors supporting it were IBM and Hewlett Packard Enterprise.
Double Data Rate 5 Synchronous Dynamic Random-Access Memory is a type of synchronous dynamic random-access memory. Compared to its predecessor DDR4 SDRAM, DDR5 was planned to reduce power consumption, while doubling bandwidth. The standard, originally targeted for 2018, was released on July 14, 2020.