An operating temperature is the allowable temperature range of the local ambient environment at which an electrical or mechanical device operates. The device will operate effectively within a specified temperature range which varies based on the device function and application context, and ranges from the minimum operating temperature to the maximum operating temperature (or peak operating temperature). Outside this range of safe operating temperatures the device may fail.
It is one component of reliability engineering.
Similarly, biological systems have a viable temperature range, which might be referred to as an "operating temperature".
Most semiconductor devices are manufactured in several temperature grades. Broadly accepted grades [1] are:
Nevertheless, each manufacturer defines its own temperature grades so designers must pay attention to datasheet specifications. For example, Maxim Integrated uses five temperature grades for its products: [2]
The use of such grades ensures that a device is suitable for its application, and will withstand the environmental conditions in which it is used. Normal operating temperature ranges are affected by several factors, such as the power dissipation of the device. [3] These factors are used to define a "threshold temperature" of a device, i.e. its maximum normal operating temperature, and a maximum operating temperature beyond which the device will no longer function. Between these two temperatures, the device will operate at a non-peak level. [4] For instance, a resistor may have a threshold temperature of 70 °C (158 °F) and a maximum temperature of 155 °C (311 °F), between which it exhibits a thermal derating. [3]
For electrical devices, the operating temperature may be the junction temperature (TJ) of the semiconductor in the device. The junction temperature is affected by the ambient temperature, and for integrated circuits, is given by the equation: [5]
in which TJ is the junction temperature in °C, Ta is the ambient temperature in °C, PD is the power dissipation of the integrated circuit in W, and Rja is the junction to ambient thermal resistance in °C/W.
Electrical and mechanical devices used in military and aerospace applications may need to endure greater environmental variability, including temperature range.
In the United States Department of Defense has defined the United States Military Standard for all products used by the United States Armed Forces. A product's environmental design and test limits to the conditions that it will undergo throughout its service life are specified in MIL-STD-810, the Department of Defense Test Method Standard for Environmental Engineering Considerations and Laboratory Tests. [6]
The MIL-STD-810G standard specifies that the "operating temperature stabilization is attained when the temperature of the functioning part(s) of the test item considered to have the longest thermal lag is changing at a rate of no more than 2.0 °C (3.6 °F) per hour." [6] It also specifies procedures to assess the performance of materials to extreme temperature loads. [7]
Military engine turbine blades experience two significant deformation stresses during normal service, creep and thermal fatigue. [8] Creep life of a material is "highly dependent on operating temperature", [8] and creep analysis is thus an important part of design validation. Some of the effects of creep and thermal fatigue may be mitigated by integrating cooling systems into the device's design, reducing the peak temperature experienced by the metal. [8]
Commercial and retail products are manufactured to less stringent requirements than those for military and aerospace applications. For example, microprocessors produced by Intel Corporation are manufactured to three grades: commercial, industrial and extended. [9]
Because some devices generate heat during operation, they may require thermal management to ensure they are within their specified operating temperature range; specifically, that they are operating at or below the maximum operating temperature of the device. [10] Cooling a microprocessor mounted in a typical commercial or retail configuration requires "a heatsink properly mounted to the processor, and effective airflow through the system chassis". [10] Systems are designed to protect the processor from unusual operating conditions, such as "higher than normal ambient air temperatures or failure of a system thermal management component (such as a system fan)", [10] though in "a properly designed system, this feature should never become active". [10] Cooling and other thermal management techniques may affect performance and noise level. [10] Noise mitigation strategies may be required in residential applications to ensure that the noise level does not become uncomfortable.
Battery service life and efficacy is affected by operating temperature. [11] Efficacy is determined by comparing the service life achieved by the battery as a percentage of its service life achieved at 20 °C (68 °F) versus temperature. Ohmic load and operating temperature often jointly determine a battery's discharge rate. [12] Moreover, if the expected operating temperature for a primary battery deviates from the typical 10 °C to 25 °C (50 to 77 °F) range, then operating temperature "will often have an influence on the type of battery selected for the application". [13] Energy reclamation from partially depleted lithium sulfur dioxide battery has been shown to improve when "appropriately increasing the battery operating temperature". [14]
Mammals attempt to maintain a comfortable body temperature under various conditions by thermoregulation, part of mammalian homeostasis. The lowest normal temperature of a mammal, the basal body temperature, is achieved during sleep. In women, it is affected by ovulation, causing a biphasic pattern which may be used as a component of fertility awareness.
In humans, the hypothalamus regulates metabolism, and hence the basal metabolic rate. Amongst its functions is the regulation of body temperature. The core body temperature is also one of the classic phase markers for measuring the timing of an individual's Circadian rhythm. [15]
Changes to the normal human body temperature may result in discomfort. The most common such change is a fever, a temporary elevation of the body's thermoregulatory set-point, typically by about 1–2 °C (1.8–3.6 °F). Hyperthermia is an acute condition caused by the body absorbing more heat than it can dissipate, whereas hypothermia is a condition in which the body's core temperature drops below that required for normal metabolism, and which is caused by the body's inability to replenish the heat that is being lost to the environment. [16]
A resistor is a passive two-terminal electrical component that implements electrical resistance as a circuit element. In electronic circuits, resistors are used to reduce current flow, adjust signal levels, to divide voltages, bias active elements, and terminate transmission lines, among other uses. High-power resistors that can dissipate many watts of electrical power as heat may be used as part of motor controls, in power distribution systems, or as test loads for generators. Fixed resistors have resistances that only change slightly with temperature, time or operating voltage. Variable resistors can be used to adjust circuit elements, or as sensing devices for heat, light, humidity, force, or chemical activity.
A thermistor is a semiconductor type of resistor whose resistance is strongly dependent on temperature, more so than in standard resistors. The word thermistor is a portmanteau of thermal and resistor.
Complementary metal–oxide–semiconductor is a type of metal–oxide–semiconductor field-effect transistor (MOSFET) fabrication process that uses complementary and symmetrical pairs of p-type and n-type MOSFETs for logic functions. CMOS technology is used for constructing integrated circuit (IC) chips, including microprocessors, microcontrollers, memory chips, and other digital logic circuits. CMOS technology is also used for analog circuits such as image sensors, data converters, RF circuits, and highly integrated transceivers for many types of communication.
Processor power dissipation or processing unit power dissipation is the process in which computer processors consume electrical energy, and dissipate this energy in the form of heat due to the resistance in the electronic circuits.
Underclocking, also known as downclocking, is modifying a computer or electronic circuit's timing settings to run at a lower clock rate than is specified. Underclocking is used to reduce a computer's power consumption, increase battery life, reduce heat emission, and it may also increase the system's stability, lifespan/reliability and compatibility. Underclocking may be implemented by the factory, but many computers and components may be underclocked by the end user. Underclocking is the opposite of overclocking.
Thermoelectric cooling uses the Peltier effect to create a heat flux at the junction of two different types of materials. A Peltier cooler, heater, or thermoelectric heat pump is a solid-state active heat pump which transfers heat from one side of the device to the other, with consumption of electrical energy, depending on the direction of the current. Such an instrument is also called a Peltier device, Peltier heat pump, solid state refrigerator, or thermoelectric cooler (TEC) and occasionally a thermoelectric battery. It can be used either for heating or for cooling, although in practice the main application is cooling. It can also be used as a temperature controller that either heats or cools.
Infrared thermography (IRT), thermal video and/or thermal imaging, is a process where a thermal camera captures and creates an image of an object by using infrared radiation emitted from the object in a process, which are examples of infrared imaging science. Thermographic cameras usually detect radiation in the long-infrared range of the electromagnetic spectrum and produce images of that radiation, called thermograms. Since infrared radiation is emitted by all objects with a temperature above absolute zero according to the black body radiation law, thermography makes it possible to see one's environment with or without visible illumination. The amount of radiation emitted by an object increases with temperature; therefore, thermography allows one to see variations in temperature. When viewed through a thermal imaging camera, warm objects stand out well against cooler backgrounds; humans and other warm-blooded animals become easily visible against the environment, day or night. As a result, thermography is particularly useful to the military and other users of surveillance cameras.
A heat sink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with other high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.
A heat pipe is a heat-transfer device that employs phase transition to transfer heat between two solid interfaces.
In electrical engineering and mechanical engineering, the power rating of equipment is the highest power input allowed to flow through particular equipment. According to the particular discipline, the term power may refer to electrical or mechanical power. A power rating can also involve average and maximum power, which may vary depending on the kind of equipment and its application.
Computer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipsets, graphics cards, hard disk drives, and solid state drives.
A power semiconductor device is a semiconductor device used as a switch or rectifier in power electronics. Such a device is also called a power device or, when used in an integrated circuit, a power IC.
A voltage regulator module (VRM), sometimes called processor power module (PPM), is a buck converter that provides the microprocessor and chipset the appropriate supply voltage, converting +3.3 V, +5 V or +12 V to lower voltages required by the devices, allowing devices with different supply voltages be mounted on the same motherboard. On personal computer (PC) systems, the VRM is typically made up of power MOSFET devices.
Capacitors are manufactured in many styles, forms, dimensions, and from a large variety of materials. They all contain at least two electrical conductors, called plates, separated by an insulating layer (dielectric). Capacitors are widely used as parts of electrical circuits in many common electrical devices.
All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. There are several techniques for cooling including various styles of heat sinks, thermoelectric coolers, forced air systems and fans, heat pipes, and others. In cases of extreme low environmental temperatures, it may actually be necessary to heat the electronic components to achieve satisfactory operation.
Molten-salt batteries are a class of battery that uses molten salts as an electrolyte and offers both a high energy density and a high power density. Traditional non-rechargeable thermal batteries can be stored in their solid state at room temperature for long periods of time before being activated by heating. Rechargeable liquid-metal batteries are used for industrial power backup, special electric vehiclesand for grid energy storage, to balance out intermittent renewable power sources such as solar panels and wind turbines.
Junction temperature, short for transistor junction temperature, is the highest operating temperature of the actual semiconductor in an electronic device. In operation, it is higher than case temperature and the temperature of the part's exterior. The difference is equal to the amount of heat transferred from the junction to case multiplied by the junction-to-case thermal resistance.
Film capacitors, plastic film capacitors, film dielectric capacitors, or polymer film capacitors, generically called film caps as well as power film capacitors, are electrical capacitors with an insulating plastic film as the dielectric, sometimes combined with paper as carrier of the electrodes.
Aluminum electrolytic capacitors are (usually) polarized electrolytic capacitors whose anode electrode (+) is made of a pure aluminum foil with an etched surface. The aluminum forms a very thin insulating layer of aluminum oxide by anodization that acts as the dielectric of the capacitor. A non-solid electrolyte covers the rough surface of the oxide layer, serving in principle as the second electrode (cathode) (-) of the capacitor. A second aluminum foil called "cathode foil" contacts the electrolyte and serves as the electrical connection to the negative terminal of the capacitor.