Peregrine Semiconductor

Last updated
pSemi
Industry Semiconductor
Founded1990
Founders Ron Reedy
Mark Burgener
Rory Moore
Headquarters San Diego, United States
Key people
Tatsuo Bizen (CEO)
Number of employees
605 (2019) [1]
Parent Murata Manufacturing
Website psemi.com

pSemi (formerly Peregrine Semiconductor), is a San Diego-based manufacturer of high-performance RF (radio frequency) CMOS integrated circuits. A Murata Manufacturing company since December 2014, the company's products are used in aerospace and defense, broadband, industrial, mobile wireless device, test and measurement equipment and wireless infrastructure markets. [2] Their UltraCMOS technology is a proprietary implementation of silicon on sapphire (SOS) [3] and silicon on insulator (SOI) substrates that enables high levels of monolithic integration.

Contents

History

The company was founded in 1990 by former NOSC (Naval Ocean Systems Center) researchers Dr. Ron Reedy and Dr. Mark Burgener, along with partner Rory Moore. Reedy served as the CEO from 1990 to 1998, followed by Stav Prodromou from 1999 to 2002. Since then, Dr. James "Jim" Cable has served as the company's CEO. [4]

In May 2010 the company entered a joint development agreement with IBM Microelectronics for the development and manufacture of future generations of the pSemi's UltraCMOS process, with migration to 200mm wafers that facilitates the evolution of the process to advanced 180 nm, 130 nm and 90 nm nodes. [5] According to an article by EDN executive editor Ron Wilson, with mobile operators like China Mobile and Vodafone needing handsets with 11 or 12 bands and air interfaces, "designers need high levels of front end integration". [6]

On November 19, 2010 the company filed a preliminary prospectus S-1 registration statement in preparation for an IPO. [7] On August 8, 2012 the company's stock began trading on the NASDAQ under the ticker symbol PSMI. The IPO raised $77 million for the company. [8]

On August 22, 2014 Murata Electronics, a subsidiary of Murata Manufacturing, announced that they had purchased all outstanding shares of the company. [9] The deal was completed on December 12, 2014. [10] The company continues to market its RF solutions under the Peregrine brand, as a wholly owned subsidiary of Murata Electronics North America, Inc. [11] Since the acquisition, Murata has invested in the company's growth and has increased their employee count by 40 percent, as of summer 2016. [12]

In March 2017 the company acquired Arctic Sand Technologies, a designer and manufacturer of power converters based in Burlington, Massachusetts. [13]

Peregrine Semiconductor changed its name to pSemi in January 2018. The change comes at the same time of the sale of their four billionth chip and the companies 30th anniversary of RF CMOS innovation. [14] [15]

On 1 July 2019, Sumit Tomar took over the position of CEO, [16] and Go Maruyama was promoted to senior vice president of administrations. [17] [18] Former CEO of pSemi, Jim Cable, retired in January 2020 from his positions of chairman and chief technology officer after 20 years with the company. [19]

pSemi opened a design center in Chennai, India, in March 2021. [20]

In November 2021, Takaki Murata was appointed interim CEO. He occupied the position of Director of the RF Device Division of Murata, and held the position at pSemi until a permanent replacement was found. [21] As of April 2022, Tatsuo Bizen took over the position of CEO. [22] [23]

Products

The company has about 150 products used in applications such as cellular base stations, medical devices, public safety radios, test and measurement equipment and mobile handsets. [24] In their handset business, the company's components are found in devices such as the Galaxy S4, Galaxy Note 3, iPhone 5S and iPad Air. [25]

In 2014 the company announced UltraCMOS Global 1, a specialized wireless chip that combines different radio frequency functions on a single microchip and claims to let a single phone connect to more than 40 frequency bands. [26] [27] The company also claims that the power amplifier embedded on the Global 1 chip provides the same level of performance as the competing technology, gallium arsenide (GaAS). Global 1 will not be in volume production until late 2015 and will compete with Qualcomm's RF360 chip. [26]

The company began a partnership with Aemulus in 2016 for the development of a new microwave frequency tester as an upgrade to the Aemulus Amoeba AMB7600. [28]

In September 2018, pSemi launched the PE561221, the first monolithic SOI Wi-Fi front-end module. [29] [30]

Locations

pSemi is headquartered in San Diego, California, where its manufacturing, shipping and engineering facilities are located. It also has R&D facilities and offices in the United States, Europe and Asia. [31] [32]

United States

Europe

Asia

Accomplishments

For their development of the silicon on sapphire technologies, founders Reedy & Burgener earned the IEEE Daniel E. Noble Award for Emerging Technology in 2011. [33]

In Oct. 2013 the company announced that they had shipped their two billionth chip in an order to Murata Manufacturing company. [34]

Related Research Articles

<span class="mw-page-title-main">Semiconductor device fabrication</span> Manufacturing process used to create integrated circuits

Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips that are present in everyday electronic devices. It is a multiple-step photolithographic and physio-chemical process during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.

<span class="mw-page-title-main">CMOS</span> Technology for constructing integrated circuits

Complementary metal–oxide–semiconductor is a type of metal–oxide–semiconductor field-effect transistor (MOSFET) fabrication process that uses complementary and symmetrical pairs of p-type and n-type MOSFETs for logic functions. CMOS technology is used for constructing integrated circuit (IC) chips, including microprocessors, microcontrollers, memory chips, and other digital logic circuits. CMOS technology is also used for analog circuits such as image sensors, data converters, RF circuits, and highly integrated transceivers for many types of communication.

<span class="mw-page-title-main">Cypress Semiconductor</span> Defunct American semiconductor company

Cypress Semiconductor was an American semiconductor design and manufacturing company. It offered NOR flash memories, F-RAM and SRAM Traveo microcontrollers, PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions.

<span class="mw-page-title-main">Infineon Technologies</span> Semiconductor manufacturing company

Infineon Technologies AG is Germany's largest semiconductor manufacturer. The company was spun-off from Siemens AG in 1999. Infineon has about 58,600 employees in 2023 and is one of the ten largest semiconductor manufacturers worldwide. In 2023 the company achieved sales of €16.309 billion.

Silicon on sapphire (SOS) is a hetero-epitaxial process for metal–oxide–semiconductor (MOS) integrated circuit (IC) manufacturing that consists of a thin layer of silicon grown on a sapphire wafer. SOS is part of the silicon-on-insulator (SOI) family of CMOS technologies.

In semiconductor manufacturing, silicon on insulator (SOI) technology is fabrication of silicon semiconductor devices in a layered silicon–insulator–silicon substrate, to reduce parasitic capacitance within the device, thereby improving performance. SOI-based devices differ from conventional silicon-built devices in that the silicon junction is above an electrical insulator, typically silicon dioxide or sapphire. The choice of insulator depends largely on intended application, with sapphire being used for high-performance radio frequency (RF) and radiation-sensitive applications, and silicon dioxide for diminished short-channel effects in other microelectronics devices. The insulating layer and topmost silicon layer also vary widely with application.

<span class="mw-page-title-main">Dado Banatao</span> Filipino entrepreneur and engineer

Diosdado P. Banatao is a Filipino entrepreneur and engineer working in the high-tech industry, credited with having developed the first 10-Mbit Ethernet CMOS with silicon coupler data-link control and transceiver chip, the first system logic chip set for IBM's PC-XT and the PC-AT, and the local bus concept and the first Windows Graphics accelerator chip for personal computers. A three-time start-up veteran, he co-founded Mostron, Chips and Technologies, and S3 Graphics.

<span class="mw-page-title-main">Murata Manufacturing</span> Japanese electronic components manufacturer

Murata Manufacturing Co., Ltd. is a Japanese manufacturer of electronic components, based in Nagaokakyo, Kyoto. It produces ceramic passive electronic components, primarily capacitors, and has a majority marketshare worldwide in ceramic filters, high-frequency parts, and sensors. As of March 31, 2013 Murata Manufacturing has 24 subsidiaries in Japan and 52 overseas in the United States, Canada, Mexico, Brazil, Germany, France, Italy, the United Kingdom, Switzerland, the Netherlands, Spain, Hungary, Finland, China, Taiwan, South Korea, Singapore, Malaysia, the Philippines, Thailand, Hong Kong, Vietnam and India.

Soitec is an international company based in France, that manufactures substrates used in the creation of semiconductors.

Microchip Technology Incorporated is a publicly listed American corporation that manufactures microcontroller, mixed-signal, analog, and Flash-IP integrated circuits. Its products include microcontrollers, Serial EEPROM devices, Serial SRAM devices, embedded security devices, radio frequency (RF) devices, thermal, power and battery management analog devices, as well as linear, interface and wireless products.

RF Micro Devices, was an American company that designed and manufactured high-performance radio frequency systems and solutions for applications that drive wireless and broadband communications. Headquartered in Greensboro, North Carolina, RFMD traded on the NASDAQ under the symbol RFMD. The Company was founded in Greensboro, North Carolina, in 1991. RF Micro had 3500 employees, 1500 of them in Guilford County, North Carolina.

<span class="mw-page-title-main">X-Fab</span> German semiconductor foundry

The X-FAB Silicon Foundries is a group of semiconductor foundries. The group specializes in the fabrication of analog and mixed-signal integrated circuits for fabless semiconductor companies, as well as MEMS and solutions for high voltage applications. The holding company named "X-FAB Silicon Foundries SE" is based in Tessenderlo, Belgium while its headquarters is located in Erfurt, Germany.

<span class="mw-page-title-main">Cadence Design Systems</span> American multinational computational software company

Cadence Design Systems, Inc., is a multinational technology and computational software company. Headquartered in San Jose, California, Cadence was formed in 1988 through the merger of SDA Systems and ECAD. Initially specialized in electronic design automation (EDA) software for the semiconductor industry, currently the company makes software and hardware for designing products such as integrated circuits, systems on chips (SoCs), printed circuit boards, and pharmaceutical drugs, also licensing intellectual property for the electronics, aerospace, defense and automotive industries, among others.

The term die shrink refers to the scaling of metal–oxide–semiconductor (MOS) devices. The act of shrinking a die creates a somewhat identical circuit using a more advanced fabrication process, usually involving an advance of lithographic nodes. This reduces overall costs for a chip company, as the absence of major architectural changes to the processor lowers research and development costs while at the same time allowing more processor dies to be manufactured on the same piece of silicon wafer, resulting in less cost per product sold.

<span class="mw-page-title-main">Silicon Labs</span> Global technology company

Silicon Laboratories, Inc. is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide.

<span class="mw-page-title-main">MaxLinear</span> American hardware company

MaxLinear is an American hardware company. Founded in 2003, it provides highly integrated radio-frequency (RF) analog and mixed-signal semiconductor products for broadband communications applications. It is a New York Stock Exchange-traded company.

<span class="mw-page-title-main">Tower Semiconductor</span> Integrated circuit manufacturer

Tower Semiconductor Ltd. is an Israeli company that manufactures integrated circuits using specialty process technologies, including SiGe, BiCMOS, Silicon Photonics, SOI, mixed-signal and RFCMOS, CMOS image sensors, non-imaging sensors, power management (BCD), and non-volatile memory (NVM) as well as MEMS capabilities. Tower Semiconductor also owns 51% of TPSCo, an enterprise with Nuvoton Technology Corporation Japan (NTCJ).

The IEEE International Electron Devices Meeting (IEDM) is an annual micro- and nanoelectronics conference held each December that serves as a forum for reporting technological breakthroughs in the areas of semiconductor and related device technologies, design, manufacturing, physics, modeling and circuit-device interaction.

Ronald Reedy is an American businessman, scientist and researcher. In the semiconductor industry, he advanced silicon on sapphire (SOS) and CMOS technology.

RF CMOS is a metal–oxide–semiconductor (MOS) integrated circuit (IC) technology that integrates radio-frequency (RF), analog and digital electronics on a mixed-signal CMOS RF circuit chip. It is widely used in modern wireless telecommunications, such as cellular networks, Bluetooth, Wi-Fi, GPS receivers, broadcasting, vehicular communication systems, and the radio transceivers in all modern mobile phones and wireless networking devices. RF CMOS technology was pioneered by Pakistani engineer Asad Ali Abidi at UCLA during the late 1980s to early 1990s, and helped bring about the wireless revolution with the introduction of digital signal processing in wireless communications. The development and design of RF CMOS devices was enabled by van der Ziel's FET RF noise model, which was published in the early 1960s and remained largely forgotten until the 1990s.

References

  1. "San Diego's Peregrine gets new name, ships 4 billionth smartphone chip". 22 January 2018.
  2. Hargrave, Marshall (Nov 14, 2013). "Peregrine Semiconductor: Misunderstood And Mispriced Apple Supplier". Seeking Alpha. Retrieved 15 November 2013.
  3. IEEE Electron Device Letters, Vol. 9 Issue 1, Jan. 1988 High-quality CMOS in thin (100 nm) silicon on sapphire
  4. Press Release James Cable, CEO & Stav Prodromou, Chairman
  5. EE Times
  6. EDN Archived 2012-07-29 at archive.today
  7. S-1 Statement (Amendment 2)
  8. Bigelow, Bruce (August 7, 2012). "After Persevering for 22 Years, Peregrine Semiconductor Marks IPO". Xconomy. Retrieved 14 November 2013.
  9. "Murata Electronics to Acquire Peregrine Semi (PSMI) in Net $465M Deal". Street Insider.
  10. Maan, Lehar (22 August 2014). "UPDATE 2-Japan's Murata to buy Peregrine Semiconductor for $465 mln". Reuters. Retrieved 7 March 2015.
  11. "Murata Completes Acquisition of Peregrine Semiconductor". PR Newswire. 12 December 2014. Retrieved 7 March 2015.
  12. "Peregrine appoints Murata veteran as general manager of High Performance Analog business unit". Semiconductor Today. 26 July 2016. Retrieved 23 August 2016.
  13. Cox, John (March 20, 2017). "Peregrine Semiconductor Acquires Arctic Sand Technologies". San Diego Business Journal. Retrieved 22 March 2017.
  14. "Peregrine Semiconductor becomes pSemi". www.electronicspecifier.com. Retrieved 2023-11-14.
  15. "Peregrine Semiconductor is now pSemi | Solid State Technology" . Retrieved 2023-11-14.
  16. Graves, Brad (2019-07-09). "New CEO to Lead PSemi in Producing Next Billion Chips". San Diego Business Journal. Retrieved 2023-11-14.
  17. "pSemi announces new leadership structure". www.semiconductor-today.com. Retrieved 2023-11-14.
  18. "pSemi Announces New Leadership Structure". GISCafe. Retrieved 2023-11-14.
  19. "pSemi's former CEO Jim Cable retires as chairman & chief technology officer". www.semiconductor-today.com. Retrieved 2023-11-14.
  20. "pSemi Opens New Design Center in India". www.prnewswire.com. Retrieved 2023-11-15.
  21. Marias, Stephen Las (2021-11-10). "pSemi Announces New Interim CEO". EE Times Asia. Retrieved 2023-11-14.
  22. Marias, Stephen Las (2022-04-01). "Tatsuo Bizen Named New CEO of pSemi". EE Times India. Retrieved 2023-11-14.
  23. "pSemi Welcomes New CEO Tatsuo Bizen". www.prnewswire.com. Retrieved 2023-11-14.
  24. Freeman, Mike (13 December 2013). "Peregrine Semiconductor keeping the pace". U-T San Diego. Retrieved 7 February 2014.
  25. Bedigian, Louis (Nov 9, 2013). "Apple Supplier Peregrine Semiconductor Is In More iPhones, iPads Than Investors Realize". Benzinga. Retrieved 15 November 2013.
  26. 1 2 Bigelow, Bruce (4 February 2014). "Peregrine Semiconductor Bets Big on Industry Shift in Wireless Chips". Xconomy. Retrieved 7 February 2014.
  27. Fitchard, Kevin (7 February 2014). "The first smartphone powered end-to-end by Qualcomm will debut this year". GigaOM. Retrieved 7 February 2014.
  28. "Aemulus and Peregrine Semiconductor Collaborate to Advance High Frequency Testing". prnewswire.com. 2016-08-23. Retrieved 2023-12-21.
  29. "pSemi unveils industry's first one-chip SOI Wi-Fi FEM". electronicproducts.com. 2018-09-28. Retrieved 2023-12-21.
  30. "PE561221". everythingrf.com. Retrieved 2023-12-21.
  31. "Locations - pSemi sales contacts and customer support". pSemi. Retrieved 2024-01-29.
  32. Ravi, Sarah (2023-03-20). "U.S. Semiconductor Ecosystem Map". Semiconductor Industry Association. Retrieved 2024-01-29.
  33. IEEE Noble Awards
  34. SDBJ Staff (Oct 31, 2013). "Peregrine Ships Its 2 Billionth Chip". NBC San Diego. Retrieved 14 November 2013.