Semiconductor device fabrication |
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MOSFET scaling (process nodes) |
The "28 nm" lithography process is a half-node semiconductor manufacturing process based on a die shrink of the "32 nm" lithography process. [1] It appeared in production in 2010. [2]
Since at least 1997, "process nodes" have been named purely on a marketing basis, and have no direct relation to the dimensions on the integrated circuit; [3] neither gate length, metal pitch or gate pitch on a "28nm" device is twenty-eight nanometers. [4] [5] [6] [7]
Taiwan Semiconductor Manufacturing Company has offered "28 nm" production using high-K metal gate process technology. [8]
GlobalFoundries offers a "28nm" foundry process called the "28SLPe" ("28nm Super Low Power") foundry process, which uses high-K metal gate technology. [9]
According to a 2016 presentation by Sophie Wilson, 28nm has the lowest cost per logic gate. Cost per gate had decreased as processes shrunk until reaching 28nm, and has slowly risen since then. [10]
"28nm" requires twice the number of design rules for ensuring reliability in manufacturing as "80nm". [11]
![]() | This section needs to be updated.(April 2024) |
AMD's Radeon HD 7970 uses a graphics processing unit manufactured using a "28nm" process. [12]
Some models of the PS3 use a RSX 'Reality Synthesizer' chip manufactured using a "28nm" process. [13]
FPGAs produced with "28 nm" process technology include models of the Xilinx Artix 7 FPGAs and Altera Cyclone V FPGAs. [14]