Micas are a group of minerals whose outstanding physical characteristic is that individual mica crystals can easily be split into extremely thin elastic plates. This characteristic is described as perfect basal cleavage. Mica is common in igneous and metamorphic rock and is occasionally found as small flakes in sedimentary rock. It is particularly prominent in many granites, pegmatites, and schists, and "books" of mica several feet across have been found in some pegmatites.
A resistor is a passive two-terminal electrical component that implements electrical resistance as a circuit element. In electronic circuits, resistors are used to reduce current flow, adjust signal levels, to divide voltages, bias active elements, and terminate transmission lines, among other uses. High-power resistors that can dissipate many watts of electrical power as heat, may be used as part of motor controls, in power distribution systems, or as test loads for generators. Fixed resistors have resistances that only change slightly with temperature, time or operating voltage. Variable resistors can be used to adjust circuit elements, or as sensing devices for heat, light, humidity, force, or chemical activity.
A printed circuit board (PCB) mechanically supports and electrically connects electrical or electronic components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.
BoPET is a polyester film made from stretched polyethylene terephthalate (PET) and is used for its high tensile strength, chemical and dimensional stability, transparency, reflectivity, gas and aroma barrier properties, and electrical insulation.
Spot welding is a type of electric resistance welding used to weld various sheet metal products, through a process in which contacting metal surface points are joined by the heat obtained from resistance to electric current.
Surface-mount technology (SMT) is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality - It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.
An autoclave is a machine used to carry out industrial and scientific processes requiring elevated temperature and pressure in relation to ambient pressure/temperature. Autoclaves are used in medical applications to perform sterilization and in the chemical industry to cure coatings and vulcanize rubber and for hydrothermal synthesis. Industrial autoclaves are used in industrial applications, especially in the manufacturing of composites.
Flexible electronics, also known as flex circuits, is a technology for assembling electronic circuits by mounting electronic devices on flexible plastic substrates, such as polyimide, PEEK or transparent conductive polyester film. Additionally, flex circuits can be screen printed silver circuits on polyester. Flexible electronic assemblies may be manufactured using identical components used for rigid printed circuit boards, allowing the board to conform to a desired shape, or to flex during its use. An alternative approach to flexible electronics suggests various etching techniques to thin down the traditional silicon substrate to few tens of micrometers to gain reasonable flexibility, referred to as flexible silicon.
A heat sink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.
Polyvinylidene fluoride or polyvinylidene difluoride (PVDF) is a highly non-reactive thermoplastic fluoropolymer produced by the polymerization of vinylidene difluoride.
A microplate or microtiter plate, microwell plate, multiwell, is a flat plate with multiple "wells" used as small test tubes. The microplate has become a standard tool in analytical research and clinical diagnostic testing laboratories. A very common usage is in the enzyme-linked immunosorbent assay (ELISA), the basis of most modern medical diagnostic testing in humans and animals.
Kapton is a polyimide film developed by DuPont in the late 1960s that remains stable across a wide range of temperatures, from −269 to +400 °C. Kapton is used in, among other things, flexible printed circuits and space blankets, which are used on spacecraft, satellites, and various space instruments.
A heating element converts electrical energy into heat through the process of Joule heating. Electric current through the element encounters resistance, resulting in heating of the element. Unlike the Peltier effect, this process is independent of the direction of current.
Borosilicate glass is a type of glass with silica and boron trioxide as the main glass-forming constituents. Borosilicate glasses are known for having very low coefficients of thermal expansion, making them more resistant to thermal shock than any other common glass. Such glass is subjected to less thermal stress and can withstand temperature differentials without fracturing of about 165 °C (297 °F). It is commonly used for the construction of reagent bottles and flasks as well as lighting, electronics and cookware.
A power cable is an electrical cable, an assembly of one or more electrical conductors, usually held together with an overall sheath. The assembly is used for transmission of electrical power. Power cables may be installed as permanent wiring within buildings, buried in the ground, run overhead, or exposed. Power cables that are bundled inside thermoplastic sheathing and that are intended to be run inside a building are known as NM-B.
Heat-shrink tubing is a shrinkable plastic tube used to insulate wires, providing abrasion resistance and environmental protection for stranded and solid wire conductors, connections, joints and terminals in electrical work. It can also be used to repair the insulation on wires or to bundle them together, to protect wires or small parts from minor abrasion, and to create cable entry seals, offering environmental sealing protection. Heat-shrink tubing is ordinarily made of polyolefin, which shrinks radially when heated, to between one-half and one-sixth of its diameter.
Tape-automated bonding (TAB) is a process that places bare semiconductor chips (dies) like integrated circuits onto a flexible circuit board (FPC) by attaching them to fine conductors in a polyamide or polyimide film carrier. This FPC with the die(s) can be mounted on the system or module board or assembled inside a package. Typically the FPC includes from one to three conductive layers and all inputs and outputs of the semiconductor die are connected simultaneously during the TAB bonding. Tape automated bonding is one of the methods needed for achieving chip-on-flex (COF) assembly and it is one of the first roll-to-roll processing type methods in the electronics manufacturing.
Pressure-sensitive adhesive is a type of non reactive adhesive which forms a bond when pressure is applied to bond the adhesive with a surface. No solvent, water, or heat is needed to activate the adhesive. It is used in pressure-sensitive tapes, labels, glue dots, note pads, automobile trim, and a wide variety of other products.
Upilex is a heat-resistant polyimide film that is the product of the polycondensation reaction between biphenyl tetracarboxylic dianhydride (BPDA) monomers and a diamine. Its properties include dimensional stability, low water absorption, high chemical resistance and high mechanical properties, high heat and chemical resistance. It was developed by UBE Industries. Upilex-S is the standard grade but other grades include Upilex-RN, VT, CA and SGA. Upilex-S is used when excellent mechanical properties are required. Upilex-RN possesses excellent molding processability, while Upilex-VT has superior heat bonding characteristics. General applications of Upilex include their use in flexible printed circuits, electric motor and generator insulation, high temperature wire and cable wrapping, and specialty pressure sensitive tapes. Polyimides have also been extensively studied in gas and humidity sensors, where the concentration is determined by monitoring the capacitance of modified Upilex films. With advantages of flexibility and easy functionalization, Upilex films are often used as substrate materials in biosensor platforms. For instance, it is possible to electropolymerize onto these films or attach enzymes to it for the detection of glucose.
Packaging machinery is used throughout all packaging operations, involving primary packages to distribution packs. This includes many packaging processes: fabrication, cleaning, filling, sealing, combining, labeling, overwrapping, palletizing.
