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Solder is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics.
Tin is a chemical element; it has symbol Sn and atomic number 50. A silvery-colored metal, tin is soft enough to be cut with little force, and a bar of tin can be bent by hand with little effort. When bent, the so-called "tin cry" can be heard as a result of twinning in tin crystals.
A eutectic system or eutectic mixture is a type of a homogeneous mixture that has a melting point lower than those of the constituents. The lowest possible melting point over all of the mixing ratios of the constituents is called the eutectic temperature. On a phase diagram, the eutectic temperature is seen as the eutectic point.
Brazing is a metal-joining process in which two or more metal items are joined by melting and flowing a filler metal into the joint, with the filler metal having a lower melting point than the adjoining metal.
Wood's metal, also known as Lipowitz's alloy or by the commercial names Cerrobend, Bendalloy, Pewtalloy and MCP 158, is a metal alloy that is useful for soldering and making custom metal parts, but its fumes are toxic, as well as being toxic on skin exposure. The alloy is named for Barnabas Wood, who invented and patented the alloy in 1860. It is a eutectic, fusible alloy of 50% bismuth, 26.7% lead, 13.3% tin, and 10% cadmium by mass. It has a melting point of approximately 70 °C (158 °F).
Galinstan is a brand name for an alloy composed of gallium, indium, and tin which melts at −19 °C (−2 °F) and is thus liquid at room temperature. In scientific literature, galinstan is also used to denote the eutectic alloy of gallium, indium, and tin, which melts at around +11 °C (52 °F). The commercial product Galinstan is not a eutectic alloy, but a near eutectic alloy. Additionally, it likely has added flux to improve flowability, to reduce melting temperature, and to reduce surface tension.
A solid solution, a term popularly used for metals, is a homogeneous mixture of two different kinds of atoms in solid state and having a single crystal structure. Many examples can be found in metallurgy, geology, and solid-state chemistry. The word "solution" is used to describe the intimate mixing of components at the atomic level and distinguishes these homogeneous materials from physical mixtures of components. Two terms are mainly associated with solid solutions – solvents and solutes, depending on the relative abundance of the atomic species.
Field's metal, also known as Field's alloy, is a fusible alloy that becomes liquid at approximately 62 °C (144 °F). It is named after its inventor, Simon Quellen Field. It is a eutectic alloy of bismuth, indium, and tin, with the following mass fractions: 32.5% Bi, 51% In, 16.5% Sn.
A liquid metal cooled nuclear reactor, or LMR is a type of nuclear reactor where the primary coolant is a liquid metal. Liquid metal cooled reactors were first adapted for breeder reactor power generation. They have also been used to power nuclear submarines.
Soldering is a process of joining two metal surfaces together using a filler metal called solder. The soldering process involves heating the surfaces to be joined and melting the solder, which is then allowed to cool and solidify, creating a strong and durable joint.
Tin-silver-copper, is a lead-free (Pb-free) alloy commonly used for electronic solder. It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, as it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. Lead-free solder is gaining much attention as the environmental effects of lead in industrial products is recognized, and as a result of Europe's RoHS legislation to remove lead and other hazardous materials from electronics. Japanese electronics companies have also looked at Pb-free solder for its industrial advantages.
Eutectic bonding, also referred to as eutectic soldering, describes a wafer bonding technique with an intermediate metal layer that can produce a eutectic system. Those eutectic metals are alloys that transform directly from solid to liquid state, or vice versa from liquid to solid state, at a specific composition and temperature without passing a two-phase equilibrium, i.e. liquid and solid state. The fact that the eutectic temperature can be much lower than the melting temperature of the two or more pure elements can be important in eutectic bonding.
Granulation is a jewellery manufacturing technique whereby a surface is covered in spherules or granules of precious metal. The technique is thought to have its origins in Sumer about 5,000 years ago. This technique then spread to southern Europe during the orientalizing period, also through the role of Phoenicians, who had founded colonies in Sardinia, Sicily and Spain, or Near Eastern craftsmen.
The metallic elements in the periodic table located between the transition metals to their left and the chemically weak nonmetallic metalloids to their right have received many names in the literature, such as post-transition metals, poor metals, other metals, p-block metals and chemically weak metals. The most common name, post-transition metals, is generally used in this article.
The elements bismuth and indium have relatively low melting points when compared to other metals, and their alloy bismuth–indium (Bi–In) is classified as a fusible alloy. It has a melting point lower than the eutectic point of the tin–lead alloy. The most common application of the Bi-In alloy is as a low temperature solder, which can also contain, besides bismuth and indium, lead, cadmium, and tin.
I-III-VI2 semiconductors are solid semiconducting materials that contain three or more chemical elements belonging to groups I, III and VI (IUPAC groups 1/11, 13 and 16) of the periodic table. They usually involve two metals and one chalcogen. Some of these materials have a direct bandgap, Eg, of approximately 1.5 eV, which makes them efficient absorbers of sunlight and thus potential solar cell materials. A fourth element is often added to a I-III-VI2 material to tune the bandgap for maximum solar cell efficiency. A representative example is copper indium gallium selenide (CuInxGa(1–x)Se2, Eg = 1.7–1.0 eV for x = 0–1), which is used in copper indium gallium selenide solar cells.
Solder is a metallic material that is used to connect metal workpieces. The choice of specific solder alloys depends on their melting point, chemical reactivity, mechanical properties, toxicity, and other properties. Hence a wide range of solder alloys exist, and only major ones are listed below. Since early 2000s the use of lead in solder alloys is discouraged by several governmental guidelines in the European Union, Japan and other countries, such as Restriction of Hazardous Substances Directive and Waste Electrical and Electronic Equipment Directive.
Aluminium (British and IUPAC spellings) or aluminum (North American spelling) combines characteristics of pre- and post-transition metals. Since it has few available electrons for metallic bonding, like its heavier group 13 congeners, it has the characteristic physical properties of a post-transition metal, with longer-than-expected interatomic distances. Furthermore, as Al3+ is a small and highly charged cation, it is strongly polarizing and aluminium compounds tend towards covalency; this behaviour is similar to that of beryllium (Be2+), an example of a diagonal relationship. However, unlike all other post-transition metals, the underlying core under aluminium's valence shell is that of the preceding noble gas, whereas for gallium and indium it is that of the preceding noble gas plus a filled d-subshell, and for thallium and nihonium it is that of the preceding noble gas plus filled d- and f-subshells. Hence, aluminium does not suffer the effects of incomplete shielding of valence electrons by inner electrons from the nucleus that its heavier congeners do. Aluminium's electropositive behavior, high affinity for oxygen, and highly negative standard electrode potential are all more similar to those of scandium, yttrium, lanthanum, and actinium, which have ds2 configurations of three valence electrons outside a noble gas core: aluminium is the most electropositive metal in its group. Aluminium also bears minor similarities to the metalloid boron in the same group; AlX3 compounds are valence isoelectronic to BX3 compounds (they have the same valence electronic structure), and both behave as Lewis acids and readily form adducts. Additionally, one of the main motifs of boron chemistry is regular icosahedral structures, and aluminium forms an important part of many icosahedral quasicrystal alloys, including the Al–Zn–Mg class.
While chemically pure materials have a single melting point, chemical mixtures often partially melt at the solidus temperature (TS or Tsol), and fully melt at the higher liquidus temperature (TL or Tliq). The solidus is always less than or equal to the liquidus, but they need not coincide. If a gap exists between the solidus and liquidus it is called the freezing range, and within that gap, the substance consists of a mixture of solid and liquid phases (like a slurry). Such is the case, for example, with the olivine (forsterite-fayalite) system, which is common in Earth's mantle.
References
- ↑ One or more of the preceding sentences incorporates text from a publication now in the public domain : Chisholm, Hugh, ed. (1911). "Fusible Metal". Encyclopædia Britannica . Vol. 11 (11th ed.). Cambridge University Press. p. 369.
- ↑ "F.A.Q." Archived from the original on 2004-08-07.
- ↑ Oshe, R.W. (ed.), "Handbook of Thermodynamic and Transport Properties of Alkali Metals", Oxford. UK, Blackwell Scientific Publications Ltd, 1985, p. 987
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- ↑ Johnson Manufacturing Co, MSDS for Chip Quik Alloy w/Lead. Retrieved on February 6, 2015.
- ↑ "Lens Blocking alloy 136 58oC". Archived from the original on 2016-10-17.
- 1 2 3 "A Guide to Low Temperature Solder Alloys | Indium Corporation® | Indium Corporation Blogs | Indium | Solder Alloys". indium.com. Retrieved 2022-10-08.
- ↑ François Cardarelli (2008-03-19). Materials Handbook: A Concise Desktop Reference. Springer Science & Business Media. pp. 210–. ISBN 978-1-84628-669-8.
- ↑ Jensen, William B. (2010-10-01). "The Origin of the Name "Onion's Fusible Alloy"". Journal of Chemical Education. 87 (10): 1050–1051. Bibcode:2010JChEd..87.1050J. doi:10.1021/ed100764f. ISSN 0021-9584.
- 1 2 John H. Lau (1991). Solder joint reliability: theory and applications. Springer. p. 178. ISBN 0-442-00260-2.[ permanent dead link ]
- 1 2 Ray P. Prasad (1997). Surface mount technology: principles and practice. Springer. p. 385. ISBN 0-412-12921-3.
- ↑ Charles A. Harper (2003). Electronic materials and processes. McGraw-Hill Professional. pp. 5–8. ISBN 0-07-140214-4.
- ↑ Karl J. Puttlitz, Kathleen A. Stalter (2004). Handbook of lead-free solder technology for microelectronic assemblies. CRC Press. ISBN 0-8247-4870-0.
- ↑ Qualitek. Technical Data Sheet Sn42/Bi58 Solid Wire Rev.A 03/14 (PDF). Retrieved 3 May 2018.
- ↑ "Oregon State University". Oregon State University. Retrieved 2022-04-06.
- ↑ T.Q. Collier (May–Jun 2008). "Choosing the best bumb for the buck". Advanced Packaging. 17 (4): 24. ISSN 1065-0555.
- ↑ msl747.PDF. (PDF). Retrieved 2010-07-06.
- ↑ Qualitek. Technical Data Sheet Sn42/Bi58 Solid Wire Rev.A 03/14 (PDF). Retrieved 3 May 2018.
- ↑ "Tin-Zinc Solders for Aluminium to Aluminium and Copper". Kapp Alloy & Wire, Inc. Archived from the original on 16 July 2013. Retrieved 23 October 2012.
- ↑ Madara Ogot, Gul Okudan-Kremer (2004). Engineering design: a practical guide. Trafford Publishing. p. 445. ISBN 1-4120-3850-2.
- ↑ Howard H. Manko (8 February 2001). Solders and soldering: materials, design, production, and analysis for reliable bonding. McGraw-Hill Professional. pp. 396–. ISBN 978-0-07-134417-3 . Retrieved 17 April 2011.
