Universal Flash Storage (UFS) is a flash storage specification for digital cameras, mobile phones and consumer electronic devices. [1] [2] It was designed to bring higher data transfer speed and increased reliability to flash memory storage, while reducing market confusion and removing the need for different adapters for different types of cards. [3] The standard encompasses both packages permanently embedded (via ball grid array package) within a device (eUFS), and removable UFS memory cards.
UFS uses NAND flash. It may use multiple stacked 3D TLC NAND flash dies (integrated circuits) with an integrated controller. [4]
The proposed flash memory specification is supported by consumer electronics companies such as Nokia, Sony Ericsson, Texas Instruments, STMicroelectronics, Samsung, Micron, and SK Hynix. [5] UFS is positioned as a replacement for eMMCs and SD cards. The electrical interface for UFS uses the M-PHY, [6] developed by the MIPI Alliance, a high-speed serial interface targeting 2.9 Gbit/s per lane with up-scalability to 5.8 Gbit/s per lane. [7] [8] UFS implements a full-duplex serial LVDS interface that scales better to higher bandwidths than the 8-lane parallel and half-duplex interface of eMMCs. Unlike eMMC, Universal Flash Storage is based on the SCSI architectural model and supports SCSI Tagged Command Queuing. [9] The standard is developed by, and available from, the JEDEC Solid State Technology Association.
The Linux kernel supports UFS. [10] OpenBSD 7.3 and later support UFS. [11] Windows 10 and later support UFS. [12]
In 2010, the Universal Flash Storage Association (UFSA) was founded as an open trade association to promote the UFS standard.[ citation needed ]
In September 2013, JEDEC published JESD220B UFS 2.0 (update to UFS v1.1 standard published in June 2012). JESD220B Universal Flash Storage v2.0 offers increased link bandwidth for performance improvement, a security features extension and additional power saving features over the UFS v1.1.
On 30 January 2018 JEDEC published version 3.0 of the UFS standard, with a higher 11.6 Gbit/s data rate per lane (1450 MB/s) with the use of MIPI M-PHY v4.1 and UniProSM v1.8. At the MWC 2018, Samsung unveiled embedded UFS (eUFS) v3.0 and uMCP (UFS-based multi-chip package) solutions. [13] [14] [15]
On 30 January 2020 JEDEC published version 3.1 of the UFS standard. [16] UFS 3.1 introduces Write Booster, Deep Sleep, Performance Throttling Notification and Host Performance Booster for faster, more power efficient and cheaper UFS solutions. The Host Performance Booster feature is optional. [17]
In 2022 Samsung announced version 4.0 doubling from 11.6 Gbit/s to 23.2 Gbit/s with the use of MIPI M-PHY v5.0 and UniPro v2.0. UFS 4.0 introduces File Based Optimization. [18]
As of Q2 2024, Zoned UFS (ZUFS) is in development by SK hynix. [19]
In February 2013, semiconductor company Toshiba Memory (now Kioxia) started shipping samples of a 64 GB NAND flash chip, the first chip to support the then new UFS standard. [20]
In April 2015, Samsung's Galaxy S6 family was the first phone to ship with eUFS storage using the UFS 2.0 standard. [21]
On 7 July 2016, Samsung announced its first UFS cards, in 32, 64, 128, and 256 GB storage capacities. [22] The cards were based on the UFS 1.0 Card Extension Standard. The 256 GB version was reported to offer sequential read performance up to 530 MB/s and sequential write performance up to 170 MB/s and random performance of 40,000 read IOPS and 35,000 write IOPS. However, they were apparently not actually released to the public.
On 17 November 2016, Qualcomm announced the Snapdragon 835 SoC with support for UFS 2.1. [23]
On 14 May 2019, OnePlus introduced the OnePlus 7 and OnePlus 7 Pro, the first phones to feature built-in eUFS 3.0 (The Galaxy Fold, originally planned to be the first smartphone to feature UFS 3.0 was ultimately delayed after the OnePlus 7's launch). [24]
The first UFS cards began to be publicly sold in early 2020. According to a Universal Flash Storage Association press release, Samsung planned to transition its products to UFS cards during 2020. [25] Several consumer devices with UFS card slots have been released in 2020.
On 08 December 2022, IQOO announced the IQOO 11 which was the first phone to come with UFS 4.0 Storage. After that other android OEMs started using this storage solution on their flagship to upper mid-range category smartphones. [26]
UFS | Introduced | Bandwidth per lane | Max. number of lanes | Max. total bandwidth | M-PHY version | UniPro version |
---|---|---|---|---|---|---|
1.0 | 2011-02-24 [27] | 300 MB/s | 1 | 300 MB/s | ? | ? |
1.1 | 2012-06-25 [28] | ? | ? | |||
2.0 | 2013-09-18 [29] | 600 MB/s | 2 | 1200 MB/s | 3.0 | 1.6 |
2.1 | 2016-04-04 [30] | |||||
2.2 | 2020-08 [31] | ? | ? | |||
3.0 | 2018-01-30 [32] | 1450 MB/s | 2900 MB/s | 4.1 | 1.8 | |
3.1 | 2020-01-30 [16] | |||||
4.0 | 2022-08-17 [33] | 2900 MB/s | 5800 MB/s | 5.0 | 2.0 | |
UFS Card | Introduced | Bandwidth per lane | Max. number of lanes | Max. total bandwidth | M-PHY version | UniPro version |
---|---|---|---|---|---|---|
1.0 | 2016-03-30 [34] | 600 MB/s | 1 | 600 MB/s | 3.0 | 1.6 |
1.1 | 2018-01-30 [32] | |||||
3.0 | 2020-12-08 [35] | 1200 MB/s | 1200 MB/s | 4.1 | 1.8 | |
On 30 March 2016, JEDEC published version 1.0 of the UFS Card Extension Standard (JESD220-2), which offered many of the features and much of the same functionality as the existing UFS 2.0 embedded device standard, but with additions and modifications for removable cards. [46]
Also in March 2016, JEDEC published version 1.1 of the UFS Unified Memory Extension (JESD220-1A), [47] version 2.1 of the UFS Host Controller Interface (UFSHCI) standard (JESD223C), [48] and version 1.1A of the UFSHCI Unified Memory Extension standard (JESD223-1A). [49]
On January 30, 2018, the UFS Card Extension standard was updated to version 1.1 (JESD220-2A), [50] and the UFSHCI standard was updated to version 3.0 (JESD223D), to align with UFS version 3.0. [51]
A UFS drive's rewrite life cycle affects its lifespan. There is a limit to how many write/erase cycles a flash block can accept before it produces errors or fails altogether. Each write/erase cycle causes a flash memory cell's oxide layer to deteriorate. The reliability of a drive is based on three factors: the age of the drive, total terabytes written over time and drive writes per day. [52] This is typical of flash memory in general.
Flash memory is an electronic non-volatile computer memory storage medium that can be electrically erased and reprogrammed. The two main types of flash memory, NOR flash and NAND flash, are named for the NOR and NAND logic gates. Both use the same cell design, consisting of floating gate MOSFETs. They differ at the circuit level depending on whether the state of the bit line or word lines is pulled high or low: in NAND flash, the relationship between the bit line and the word lines resembles a NAND gate; in NOR flash, it resembles a NOR gate.
MultiMediaCard, officially abbreviated as MMC, is a memory card standard used for solid-state storage. Unveiled in 1997 by SanDisk and Siemens, MMC is based on a surface-contact low-pin-count serial interface using a single memory stack substrate assembly, and is therefore much smaller than earlier systems based on high-pin-count parallel interfaces using traditional surface-mount assembly such as CompactFlash. Both products were initially introduced using SanDisk NOR-based flash technology.
GDDR4 SDRAM, an abbreviation for Graphics Double Data Rate 4 Synchronous Dynamic Random-Access Memory, is a type of graphics card memory (SGRAM) specified by the JEDEC Semiconductor Memory Standard. It is a rival medium to Rambus's XDR DRAM. GDDR4 is based on DDR3 SDRAM technology and was intended to replace the DDR2-based GDDR3, but it ended up being replaced by GDDR5 within a year.
The transistor count is the number of transistors in an electronic device. It is the most common measure of integrated circuit complexity. The rate at which MOS transistor counts have increased generally follows Moore's law, which observes that transistor count doubles approximately every two years. However, being directly proportional to the area of a die, transistor count does not represent how advanced the corresponding manufacturing technology is. A better indication of this is transistor density which is the ratio of a semiconductor's transistor count to its die area.
A solid-state drive (SSD) is a type of solid-state storage device that uses integrated circuits to store data persistently. It is sometimes called semiconductor storage device, solid-state device, and solid-state disk.
The Open NAND Flash Interface Working Group is a consortium of technology companies working to develop open standards for NAND flash memory and devices that communicate with them. The formation of ONFI was announced at the Intel Developer Forum in March 2006.
In electronics, a multi-level cell (MLC) is a memory cell capable of storing more than a single bit of information, compared to a single-level cell (SLC), which can store only one bit per memory cell. A memory cell typically consists of a single floating-gate MOSFET, thus multi-level cells reduce the number of MOSFETs required to store the same amount of data as single-level cells.
UniPro is a high-speed interface technology for interconnecting integrated circuits in mobile and mobile-influenced electronics. The various versions of the UniPro protocol are created within the MIPI Alliance, an organization that defines specifications targeting mobile and mobile-influenced applications.
Low-Power Double Data Rate (LPDDR), also known as LPDDR SDRAM, is a type of synchronous dynamic random-access memory that consumes less power and is targeted for mobile computers and devices such as mobile phones. Older variants are also known as Mobile DDR, and abbreviated as mDDR.
The Samsung Infuse 4G was an Android smartphone that was released by Samsung in May 2011. It has a 1.2 GHz Hummingbird processor with 8–16 GB internal Flash memory, a 4.5 inch 480×800 pixel Super AMOLED Plus capacitive touchscreen display, an 8-megapixel camera and a 1.3-megapixel front-facing camera.
The Samsung Exynos, formerly Hummingbird (Korean: 엑시노스), is a series of ARM-based system-on-chips developed by Samsung Electronics' System LSI division and manufactured by Samsung Foundry. It is a continuation of Samsung's earlier S3C, S5L and S5P line of SoCs.
HiSilicon is a Chinese fabless semiconductor company based in Shenzhen, Guangdong province and wholly owned by Huawei. HiSilicon purchases licenses for CPU designs from ARM Holdings, including the ARM Cortex-A9 MPCore, ARM Cortex-M3, ARM Cortex-A7 MPCore, ARM Cortex-A15 MPCore, ARM Cortex-A53, ARM Cortex-A57 and also for their Mali graphics cores. HiSilicon has also purchased licenses from Vivante Corporation for their GC4000 graphics core.
High Bandwidth Memory (HBM) is a computer memory interface for 3D-stacked synchronous dynamic random-access memory (SDRAM) initially from Samsung, AMD and SK Hynix. It is used in conjunction with high-performance graphics accelerators, network devices, high-performance datacenter AI ASICs, as on-package cache in CPUs and on-package RAM in upcoming CPUs, and FPGAs and in some supercomputers. The first HBM memory chip was produced by SK Hynix in 2013, and the first devices to use HBM were the AMD Fiji GPUs in 2015.
Graphics Double Data Rate 6 Synchronous Dynamic Random-Access Memory is a type of synchronous graphics random-access memory (SGRAM) with a high bandwidth, "double data rate" interface, designed for use in graphics cards, game consoles, and high-performance computing. It is a type of GDDR SDRAM, and is the successor to GDDR5. Just like GDDR5X it uses QDR in reference to the write command clock (WCK) and ODR in reference to the command clock (CK).
M-PHY is a high speed data communications physical layer protocol standard developed by the MIPI Alliance, PHY Working group, and targeted at the needs of mobile multimedia devices. The specification's details are proprietary to MIPI member organizations, but a substantial body of knowledge can be assembled from open sources. A number of industry standard settings bodies have incorporated M-PHY into their specifications including Mobile PCI Express, Universal Flash Storage, and as the physical layer for SuperSpeed InterChip USB.
The ARM Cortex-A76 is a central processing unit implementing the ARMv8.2-A 64-bit instruction set designed by ARM Holdings' Austin design centre. ARM states a 25% and 35% increase in integer and floating point performance, respectively, over a Cortex-A75 of the previous generation.
The ARM Cortex-A77 is a central processing unit implementing the ARMv8.2-A 64-bit instruction set designed by ARM Holdings' Austin design centre. ARM announced an increase of 23% and 35% in integer and floating point performance, respectively. Memory bandwidth increased 15% relative to the A76.
The ARM Cortex-A78 is a central processing unit implementing the ARMv8.2-A 64-bit instruction set designed by ARM Ltd.'s Austin centre.
The Samsung Galaxy A33 5G is a mid-range Android-based smartphone developed and manufactured by Samsung Electronics as a part of its Galaxy A series. The phone was announced on 17 March 2022 at the Galaxy Unpacked event alongside the Galaxy A53 5G and Galaxy A73 5G.
Graphics Double Data Rate 7 Synchronous Dynamic Random-Access Memory is a type of synchronous graphics random-access memory (SGRAM) specified by the JEDEC Semiconductor Memory Standard, with a high bandwidth, "double data rate" interface, designed for use in graphics cards, game consoles, and high-performance computing. It is a type of GDDR SDRAM, and is the successor to GDDR6.
"UFS Cards will play a critical role[...]" said Hangu Sohn, vice president of NAND Memory Planning at Samsung Electronics. "Moreover, with a royalty-free form factor and open standard design, we expect to see a rapid transition to these cards in 2020."