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A capacitive micromachined ultrasonic transducer (CMUT) is a relatively new concept in the field of ultrasonic transducers. Most of the commercial ultrasonic transducers today are based on piezoelectricity. CMUTs are the transducers where the energy transduction is due to change in capacitance. CMUTs are constructed on silicon using micromachining techniques. A cavity is formed in a silicon substrate, and a thin layer suspended on the top of the cavity serves as a membrane on which a metallized layer acts an electrode, together with the silicon substrate which serves as a bottom electrode.
If an AC signal is applied across the biased electrodes, the vibrating membrane will produce ultrasonic waves in the medium of interest. In this way it works as a transmitter. On the other hand, if ultrasonic waves are applied on the membrane of a biased CMUT, it will generate alternating signal as the capacitance of the CMUT is varied. In this way, it works as a receiver of ultrasonic waves. [1]
As CMUTs are micromachined devices, it is easier to construct 2D arrays of transducers using this technology. This means large numbers of CMUTs could be included in a transducer array providing larger bandwidth compared to other transducer technologies. To achieve a high frequency operation using CMUTs is easier due to its smaller dimensions. [2] The frequency of operation depends on the cell size (cavity of membrane), and on the stiffness of the material used as a membrane. As it is built on silicon, the integration of electronics would be easier for the CMUTs compared to other transducer technologies. The properties to use in high frequency with large bandwidth makes it a good choice to use as a transducer in medical imaging, especially in an intravascular ultrasound (IVUS). Because of its broader bandwidth, it could be used in second-harmonic imaging. Also some experiments have been performed to use CMUTs as hydrophones.
Surface micromachining is the traditional way of manufacturing CMUTs. [3] The major limitations of this method include complicated manufacturing process for constructing and sealing etch/drainage channels of the sacrificial material; the need for sacrificial-release channels reduces the available space for transducers, thereby reducing the achievable sound generation capability; limited control of layers' thickness during the manufacturing process; limited cavity thickness due to residues of fluid inside the cell cavity, which can cause stiction between the upper and lower parts of the cell, if the cell is not thick enough. [3]
Wafer bonding is the most popular method. In this method, a CMUT is built from two separate wafers, which are later bonded to achieve cells with cavities.
Fusion-bonding of wafers. [4] [5] [6] [7]
Multi-user MUMPS (polyMUMPS) process. CMUTs manufactured in the multi-user MUMPS were reported to have reduced performance, such as relatively low resonating frequency. [8]
In anodic bonding, wafers are sealed at high temperature and in the presence of electric field. [9]
In this method the manufacturing is performed in reverse order, compared to the traditional way. [10] [11] The structural membrane is in silicon-nitride LPCVD, but the entire process is low-temperature, so it is CMOS-compatible. There are no etch-hole on the radiating surface of the device. The connection pads are on the back of the device, without using of through VIAs in the silicon, and the silicon substrate is completely removed. A custom acoustic backing is used to improve acoustic performances of the device. The process uses few masks (7–8). [12]
As mentioned earlier, one of the significant advantages of CMUTs over piezoelectric transducers is the ability to integrate CMUTs with electrical circuits, using existing manufacturing methods.
CMUT performance is benchmarked using pitch-catch and pulse-echo experiments, and operation uniformity is tested in air and in immersion. In a pitch-catch experiment, the transducer is benchmarked using a hydrophone, and in a pulse-echo experiment, the transducer is used both for transmitting and receiving, while comparing the measured signal to the hydrophone response.
The CMUT-on-CMOS technology and the flip-chip process allows tight integration of CMUTs with front-end electronics, which is necessary for miniature medical imaging devices, such as IVUS.
MEMS is the technology of microscopic devices incorporating both electronic and moving parts. MEMS are made up of components between 1 and 100 micrometres in size, and MEMS devices generally range in size from 20 micrometres to a millimetre, although components arranged in arrays can be more than 1000 mm2. They usually consist of a central unit that processes data and several components that interact with the surroundings.
Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips that are present in everyday electronic devices. It is a multiple-step photolithographic and physio-chemical process during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.
Silicon on sapphire (SOS) is a hetero-epitaxial process for metal–oxide–semiconductor (MOS) integrated circuit (IC) manufacturing that consists of a thin layer of silicon grown on a sapphire wafer. SOS is part of the silicon-on-insulator (SOI) family of CMOS technologies.
Surface micromachining builds microstructures by deposition and etching structural layers over a substrate. This is different from Bulk micromachining, in which a silicon substrate wafer is selectively etched to produce structures.
A thin-film bulk acoustic resonator is a device consisting of a piezoelectric material manufactured by thin film methods between two conductive – typically metallic – electrodes and acoustically isolated from the surrounding medium. The operation is based on the piezoelectricity of the piezolayer between the electrodes.
Acoustic waves emitted by ultrasonics transducer crystals exhibit a property known as self-focusing. Note that this is distinct from the electronically controlled focusing employed in diagnostic ultrasound devices which employ arrays of transducers. The self-focusing effect exists even for a single crystal.
A hybrid silicon laser is a semiconductor laser fabricated from both silicon and group III-V semiconductor materials. The hybrid silicon laser was developed to address the lack of a silicon laser to enable fabrication of low-cost, mass-producible silicon optical devices. The hybrid approach takes advantage of the light-emitting properties of III-V semiconductor materials combined with the process maturity of silicon to fabricate electrically driven lasers on a silicon wafer that can be integrated with other silicon photonic devices.
D. Jackson Coleman is a professor of clinical ophthalmology at NewYork-Presbyterian Hospital at The Edward S. Harkness Eye Institute of Columbia University. He is the former John Milton McLean Professor of Ophthalmology and chairman emeritus at Weill Cornell Medical Center where he served as chairman from 1979 to 2006. His specialties are retinal diseases and ultrasound, working with patients at Columbia University Medical Center. Coleman is also engaged in research involving ultrasound, which he has pursued throughout his career with colleague Ronald Silverman in the Department of Ophthalmology at the Columbia University Medical Center.
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