Electroless nickel-boron coating (often called NiB coating) is a metal plating process that can create a layer of a nickel-boron alloy on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing nickel salt and a boron-containing reducing agent, such as an alkylamineborane or sodium borohydride. It is a type of electroless nickel plating. A similar process, that uses a hypophosphite as a reducing agent, yields a nickel-phosphorus coating instead.
Unlike electroplating, electroless plating processes in general not require passing an electric current through the bath and the substrate; the reduction of the metal cations in solution to metallic is achieved by purely chemical means, through an autocatalytic reaction. Thus electroless plating creates an even layer of metal regardless of the geometry of the surface – in contrast to electroplating which suffers from uneven current density due to the effect of substrate shape on the electric field at its surface. Moreover, electroless plating can be applied to non-conductive surfaces. [1]
The plating bath usually also contains buffers, complexants, and other control chemicals.
Electroless nickel-boron plating developed as a variant of the similar nickel-phosphorus process, discovered accidentally by Charles Adolphe Wurtz in 1844. [2]
In 1969, Harold Edward Bellis from DuPont filed a patent for a general class of electroless plating processes using sodium borohydride, dimethylamine borane, or sodium hypophosphite, in the presence of thallium salts, thus producing a metal-thallium-boron or metal-thallium-phosphorus; where the metal could be either nickel or cobalt. The boron or phosphorus contents was claimed to be variable from 0.1 to 12%, and that of thallium from 0.5 to 6%. The coatings were claimed to be "an intimate dispersion of hard trinickel boride (Ni3B) or nickel phosphide (Ni3P) in a soft matrix of nickel and thallium". [3]
Several versions of the process were patented by Charles Edward McComas in the following years:
The earliest variants of electroless nickel-boron plating included thallium salts in the plating bath, and actually created nickel-thallium-boron coatings ("Type 1" in the AMS classification). Eventually formulations were devised that were free from the toxic thallium ingredients, resulting in true nickel-boron ("Type 2") coatings. [5]
As-plated grains of amorphous nickel boron deposit in a columnar structure with the columns being perpendicular to the substrate surface and forming a nodular topography on the surface. [10] Coating will contain 2.5–8% boron by weight. [5]
The nodular structure reduces surface-to-surface contact of two mating/sliding surfaces, thus reducing friction and improving heat dissipation. [11] It is also claimed to reduce drag in both gas and liquid flows. [12]
Actual and potential applications of electroless nickel-boron coating include saw blades, [11] ship propellers, [12] down-hole crude oil pumping equipment, bushings, thrust washers and paper guide plates.
Electroplating, also known as electrochemical deposition or electrodeposition, is a process for producing a metal coating on a solid substrate through the reduction of cations of that metal by means of a direct electric current. The part to be coated acts as the cathode of an electrolytic cell; the electrolyte is a solution of a salt whose cation is the metal to be coated, and the anode is usually either a block of that metal, or of some inert conductive material. The current is provided by an external power supply.
Chrome plating is a technique of electroplating a thin layer of chromium onto a metal object. A chrome plated part is called chrome, or is said to have been chromed. The chromium layer can be decorative, provide corrosion resistance, facilitate cleaning, and increase surface hardness. Sometimes a less expensive substitute for chrome, such as nickel, may be used for aesthetic purposes.
Plating is a finishing process in which a metal is deposited on a surface. Plating has been done for hundreds of years; it is also critical for modern technology. Plating is used to decorate objects, for corrosion inhibition, to improve solderability, to harden, to improve wearability, to reduce friction, to improve paint adhesion, to alter conductivity, to improve IR reflectivity, for radiation shielding, and for other purposes. Jewelry typically uses plating to give a silver or gold finish.
Copper electroplating is the process of electroplating a layer of copper onto the surface of a metal object. Copper is used both as a standalone coating and as an undercoat onto which other metals are subsequently plated. The copper layer can be decorative, provide corrosion resistance, increase electrical and thermal conductivity, or improve the adhesion of additional deposits to the substrate.
Gold plating is a method of depositing a thin layer of gold onto the surface of another metal, most often copper or silver, by a chemical or electrochemical (electroplating) process. Plating refers to modern coating methods, such as the ones used in the electronics industry, whereas gilding is the decorative covering of an object with gold, which typically involve more traditional methods and much larger objects.
Metallizing is the general name for the technique of coating metal on the surface of objects. Metallic coatings may be decorative, protective or functional.
Hypophosphorous acid (HPA), or phosphinic acid, is a phosphorus oxyacid and a powerful reducing agent with molecular formula H3PO2. It is a colorless low-melting compound, which is soluble in water, dioxane and alcohols. The formula for this acid is generally written H3PO2, but a more descriptive presentation is HOP(O)H2, which highlights its monoprotic character. Salts derived from this acid are called hypophosphites.
Electroless deposition (ED) or electroless plating is an autocatalytic process through which metals and metal alloys are deposited onto conductive and nonconductive surfaces. These nonconductive surfaces include plastics, ceramics, and glass etc., which can then become decorative, anti-corrosive, and conductive depending on their final functions. Electroplating, unlike electroless deposition, only deposits on other conductive or semi-conductive materials when an external current is applied. Electroless deposition deposits metals onto 2D and 3D structures such as screws, nanofibers, and carbon nanotubes, unlike other plating methods such as Physical Vapor Deposition ( PVD), Chemical Vapor Deposition (CVD), and electroplating, which are limited to 2D surfaces. Commonly the surface of the substrate is characterized via pXRD, SEM-EDS, and XPS which relay set parameters based their final functionality. These parameters are referred to a Key Performance Indicators crucial for a researcher’ or company's purpose. Electroless deposition continues to rise in importance within the microelectronic industry, oil and gas, and aerospace industry.
Electroless nickel-phosphorus plating, also referred to as E-nickel, is a chemical process that deposits an even layer of nickel-phosphorus alloy on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing nickel salt and a phosphorus-containing reducing agent, usually a hypophosphite salt. It is the most common version of electroless nickel plating and is often referred by that name. A similar process uses a borohydride reducing agent, yielding a nickel-boron coating instead.
A conversion coating is a chemical or electro-chemical treatment applied to manufactured parts that superficially converts the material into a thin adhering coating of an insoluble compound. These coatings are commonly applied to protect the part against corrosion, to improve the adherence of other coatings, for lubrication, or for aesthetic purposes.
Sodium hypophosphite (NaPO2H2, also known as sodium phosphinate) is the sodium salt of hypophosphorous acid and is often encountered as the monohydrate, NaPO2H2·H2O. It is a solid at room temperature, appearing as odorless white crystals. It is soluble in water, and easily absorbs moisture from the air.
Electrogalvanizing is a process in which a layer of zinc is bonded to steel in order to protect against corrosion. The process involves electroplating, running a current of electricity through a saline/zinc solution with a zinc anode and steel conductor. Such Zinc electroplating or Zinc alloy electroplating maintains a dominant position among other electroplating process options, based upon electroplated tonnage per annum. According to the International Zinc Association, more than 5 million tons are used yearly for both hot dip galvanizing and electroplating. The plating of zinc was developed at the beginning of the 20th century. At that time, the electrolyte was cyanide based. A significant innovation occurred in the 1960s, with the introduction of the first acid chloride based electrolyte. The 1980s saw a return to alkaline electrolytes, only this time, without the use of cyanide. The most commonly used electrogalvanized cold rolled steel is SECC, acronym of "Steel, Electrogalvanized, Cold-rolled, Commercial quality". Compared to hot dip galvanizing, electroplated zinc offers these significant advantages:
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes. It consists of an electroless nickel plating, covered with a thin layer of gold, which protects the nickel from oxidation. The gold is typically applied by quick immersion in a solution containing gold salts. Some of the nickel is oxidized to Ni2+ while the gold is reduced to metallic state. A variant of this process adds a thin layer of electroless palladium over the nickel, a process known by the acronym ENEPIG.
Beryllium-aluminum alloy an alloy that consists of 62% beryllium and 38% aluminum, by weight, corresponding approximately to an empirical formula of Be2Al. It was first developed in the 1960s by the Lockheed Missiles and Space Company, who called it Lockalloy, and used as a structural metal in the aerospace industry because of its high specific strength and stiffness. The material was used in the Lockheed YF12 aircraft and LGM-30 Minuteman missile systems. In the 1970s production difficulties limited the material to a few specialized uses and by the mid 1970s Lockalloy was no longer commercially available.
Nickel plating may refer to:
A molded interconnect device (MID) is an injection-molded thermoplastic part with integrated electronic circuit traces. The use of high temperature thermoplastics and their structured metallization opens a new dimension of circuit carrier design to the electronics industry. This technology combines plastic substrate/housing with circuitry into a single part by selective metallization.
The coinage metals comprise those metallic chemical elements and alloys which have been used to mint coins. Historically, most coinage metals are from the three nonradioactive members of group 11 of the periodic table: copper, silver and gold. Copper is usually augmented with tin or other metals to form bronze. Gold, silver and bronze or copper were the principal coinage metals of the ancient world, the medieval period and into the late modern period when the diversity of coinage metals increased. Coins are often made from more than one metal, either using alloys, coatings (cladding/plating) or bimetallic configurations. While coins are primarily made from metal, some non-metallic materials have also been used.
Nickel electroplating is a technique of electroplating a thin layer of nickel onto a metal object. The nickel layer can be decorative, provide corrosion resistance, wear resistance, or used to build up worn or undersized parts for salvage purposes.
COVENTYA Group is an international company which provides specialty chemicals for electroplating, surface finishing and friction control. These chemicals are used in the so-called GMF industry. Surface finishing is used in various industries such construction, sanitary, fashion, luxury goods, electronic or oil industry.
Electroless copper plating is a chemical process that deposits an even layer of copper on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing copper salts and a reducing agent such as formaldehyde.
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