This article may be too technical for most readers to understand.(February 2023) |
Transient liquid phase diffusion bonding (TLPDB) is a joining process that has been applied for bonding many metallic and ceramic systems which cannot be bonded by conventional fusion welding techniques. The bonding process produces joints with a uniform composition profile, tolerant of surface oxides and geometrical defects. The bonding technique has been exploited in a wide range of applications, from the production and repair of turbine engines in the aerospace industry, [1] [2] [3] to nuclear power plants, [4] [5] and in making connections to integrated circuit dies as a part of the microelectronics industry. [6] [7]
Transient liquid phase diffusion bonding is a process that differs from diffusion bonding. In transient liquid phase diffusion bonding, an element or alloy with a lower melting point in an interlayer diffuses into the lattice and grain boundaries of the substrates at the bonding temperature. Solid state diffusional processes lead to a change of composition at the bond interface and the dissimilar interlayer melts at a lower temperature than the parent materials. Thus, a thin layer of liquid spreads along the interface to form a joint at a lower temperature than the melting point of either of the parent materials. This method differs from brazing in that it is "isothermally solidifying". While holding the temperature above the filler metal melting point, interdiffusion shifts the composition away from eutectic, so solidification occurs at the process temperature. If sufficient interdiffusion occurs, the joint will remain solid and strong well above the original melt process temperature. This is why it is termed "transient liquid phase." The liquid solidifies before cooling.
In this technique it is necessary to select a suitable interlayer by considering its wettability, flow characteristics, high stability to prevent reactions with the base materials, and the ability to form a composition having a remelt temperature higher than the bonding temperature. The joining technique dates back to ancient times. [8] [9] [10] For example, copper oxide painted as an interlayer and covered with tallow or glue to hold gold balls on to a gold article were heated in a reducing flame to form a eutectic alloy alloy at the bond area.
There are many theories on the kinetics of the bonding process but the most common theory divides the process into four main stages. [11] [12] The stages are:
Solder is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics.
Sintering or frittage is the process of compacting and forming a solid mass of material by pressure or heat without melting it to the point of liquefaction. Sintering happens as part of a manufacturing process used with metals, ceramics, plastics, and other materials. The nanoparticles in the sintered material diffuse across the boundaries of the particles, fusing the particles together and creating a solid piece.
A eutectic system or eutectic mixture is a homogeneous mixture that has a melting point lower than those of the constituents. The lowest possible melting point over all of the mixing ratios of the constituents is called the eutectic temperature. On a phase diagram, the eutectic temperature is seen as the eutectic point.
Heat treating is a group of industrial, thermal and metalworking processes used to alter the physical, and sometimes chemical, properties of a material. The most common application is metallurgical. Heat treatments are also used in the manufacture of many other materials, such as glass. Heat treatment involves the use of heating or chilling, normally to extreme temperatures, to achieve the desired result such as hardening or softening of a material. Heat treatment techniques include annealing, case hardening, precipitation strengthening, tempering, carburizing, normalizing and quenching. Although the term heat treatment applies only to processes where the heating and cooling are done for the specific purpose of altering properties intentionally, heating and cooling often occur incidentally during other manufacturing processes such as hot forming or welding.
Thermal analysis is a branch of materials science where the properties of materials are studied as they change with temperature. Several methods are commonly used – these are distinguished from one another by the property which is measured:
In materials science, superplasticity is a state in which solid crystalline material is deformed well beyond its usual breaking point, usually over about 400% during tensile deformation. Such a state is usually achieved at high homologous temperature. Examples of superplastic materials are some fine-grained metals and ceramics. Other non-crystalline materials (amorphous) such as silica glass and polymers also deform similarly, but are not called superplastic, because they are not crystalline; rather, their deformation is often described as Newtonian fluid. Superplastically deformed material gets thinner in a very uniform manner, rather than forming a "neck" that leads to fracture. Also, the formation of microvoids, which is another cause of early fracture, is inhibited. Superplasticity must not be confused with superelasticity.
Brazing is a metal-joining process in which two or more metal items are joined by melting and flowing a filler metal into the joint, with the filler metal having a lower melting point than the adjoining metal.
Aluminium–silicon alloys or Silumin is a general name for a group of lightweight, high-strength aluminium alloys based on an aluminum–silicon system (AlSi) that consist predominantly of aluminum - with silicon as the quantitatively most important alloying element. Pure AlSi alloys cannot be hardened, the commonly used alloys AlSiCu and AlSiMg can be hardened. The hardening mechanism corresponds to that of AlCu and AlMgSi.
Forge welding (FOW), also called fire welding, is a solid-state welding process that joins two pieces of metal by heating them to a high temperature and then hammering them together. It may also consist of heating and forcing the metals together with presses or other means, creating enough pressure to cause plastic deformation at the weld surfaces. The process, although challenging, has been a method of joining metals used since ancient times and is a staple of traditional blacksmithing. Forge welding is versatile, being able to join a host of similar and dissimilar metals. With the invention of electrical welding and gas welding methods during the Industrial Revolution, manual forge-welding has been largely replaced, although automated forge-welding is a common manufacturing process.
An intermetallic is a type of metallic alloy that forms an ordered solid-state compound between two or more metallic elements. Intermetallics are generally hard and brittle, with good high-temperature mechanical properties. They can be classified as stoichiometric or nonstoichiometic intermetallic compounds.
Microstructure is the very small scale structure of a material, defined as the structure of a prepared surface of material as revealed by an optical microscope above 25× magnification. The microstructure of a material can strongly influence physical properties such as strength, toughness, ductility, hardness, corrosion resistance, high/low temperature behaviour or wear resistance. These properties in turn govern the application of these materials in industrial practice.
Coring happens when a heated alloy, such as a Cu-Ni system, cools in non-equilibrium conditions. The center of each grain, which is the first part to freeze, is rich in the high-melting element, whereas the concentration of the low-melting element increases with position from this region to the grain boundary. This is termed a 'cored structure', which gives rise to less than the optimal properties. The distribution of the two elements within the grains is nonuniform, a phenomenon termed 'segregation'; that is, concentration gradients are established across the grains.
An amorphous brazing foil (ABF) is a form of eutectic amorphous metal that serves as a filler metal in brazing operations. ABFs are composed of various transition metals, including nickel, iron, and copper, blended with metalloids like silicon, boron, and phosphorus. By precisely managing the concentration of these metalloids to achieve or approach the eutectic point, these alloys can undergo rapid solidification to form a ductile, amorphous foil. This process allows the ABF to effectively bond materials in the brazing process, providing a strong and seamless joint.
The vapor–liquid–solid method (VLS) is a mechanism for the growth of one-dimensional structures, such as nanowires, from chemical vapor deposition. The growth of a crystal through direct adsorption of a gas phase on to a solid surface is generally very slow. The VLS mechanism circumvents this by introducing a catalytic liquid alloy phase which can rapidly adsorb a vapor to supersaturation levels, and from which crystal growth can subsequently occur from nucleated seeds at the liquid–solid interface. The physical characteristics of nanowires grown in this manner depend, in a controllable way, upon the size and physical properties of the liquid alloy.
Soldering is a process of joining two metal surfaces together using a filler metal called solder. The soldering process involves heating the surfaces to be joined and melting the solder, which is then allowed to cool and solidify, creating a strong and durable joint.
Eutectic bonding, also referred to as eutectic soldering, describes a wafer bonding technique with an intermediate metal layer that can produce a eutectic system. Those eutectic metals are alloys that transform directly from solid to liquid state, or vice versa from liquid to solid state, at a specific composition and temperature without passing a two-phase equilibrium, i.e. liquid and solid state. The fact that the eutectic temperature can be much lower than the melting temperature of the two or more pure elements can be important in eutectic bonding.
The elements bismuth and indium have relatively low melting points when compared to other metals, and their alloy bismuth–indium (Bi–In) is classified as a fusible alloy. It has a melting point lower than the eutectic point of the tin–lead alloy. The most common application of the Bi-In alloy is as a low temperature solder, which can also contain, besides bismuth and indium, lead, cadmium, and tin.
Diffusion bonding or diffusion welding is a solid-state welding technique used in metalworking, capable of joining similar and dissimilar metals. It operates on the principle of solid-state diffusion, wherein the atoms of two solid, metallic surfaces intersperse themselves over time. This is typically accomplished at an elevated temperature, approximately 50-75% of the absolute melting temperature of the materials. A weak bond can also be achieved at room temperature. Diffusion bonding is usually implemented by applying high pressure, in conjunction with necessarily high temperature, to the materials to be welded; the technique is most commonly used to weld "sandwiches" of alternating layers of thin metal foil, and metal wires or filaments. Currently, the diffusion bonding method is widely used in the joining of high-strength and refractory metals within the aerospace and nuclear industries.
Liquid phase sintering is a sintering technique that uses a liquid phase to accelerate the interparticle bonding of the solid phase. In addition to rapid initial particle rearrangement due to capillary forces, mass transport through liquid is generally orders of magnitude faster than through solid, enhancing the diffusional mechanisms that drive densification. The liquid phase can be obtained either through mixing different powders—melting one component or forming a eutectic—or by sintering at a temperature between the liquidus and solidus. Additionally, since the softer phase is generally the first to melt, the resulting microstructure typically consists of hard particles in a ductile matrix, increasing the toughness of an otherwise brittle component. However, liquid phase sintering is inherently less predictable than solid phase sintering due to the complexity added by the presence of additional phases and rapid solidification rates. Activated sintering is the solid-state analog to the process of liquid phase sintering.
While chemically pure materials have a single melting point, chemical mixtures often partially melt at the solidus temperature (TS or Tsol), and fully melt at the higher liquidus temperature (TL or Tliq). The solidus is always less than or equal to the liquidus, but they need not coincide. If a gap exists between the solidus and liquidus it is called the freezing range, and within that gap, the substance consists of a mixture of solid and liquid phases (like a slurry). Such is the case, for example, with the olivine (forsterite-fayalite) system, which is common in Earth's mantle.
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