In meteorology, an anemometer is a device that measures wind speed and direction. It is a common instrument used in weather stations. The earliest known description of an anemometer was by Italian architect and author Leon Battista Alberti (1404–1472) in 1450.
Welding is a fabrication process that joins materials, usually metals or thermoplastics, primarily by using high temperature to melt the parts together and allow them to cool, causing fusion. Common alternative methods include solvent welding using chemicals to melt materials being bonded without heat, and solid-state welding processes which bond without melting, such as pressure, cold welding, and diffusion bonding.
A brake is a mechanical device that inhibits motion by absorbing energy from a moving system. It is used for slowing or stopping a moving vehicle, wheel, axle, or to prevent its motion, most often accomplished by means of friction.
Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. Wire bonding can be used at frequencies above 100 GHz.
Ball bonding is a type of wire bonding, and is the most common way to make the electrical interconnections between a bare silicon die and the lead frame of the package it is placed in during semiconductor device fabrication.
In the oil and gas industry, the term wireline usually refers to the use of multi-conductor, single conductor or slickline cable, or "wireline", as a conveyance for the acquisition of subsurface petrophysical and geophysical data and the delivery of well construction services such as pipe recovery, perforating, plug setting and well cleaning and fishing. The subsurface geophysical and petrophysical information results in the description and analysis of subsurface geology, reservoir properties and production characteristics.
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Department, Utica, New York. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry, it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and fine wires are welded onto the chip pads and lead frame contacts to interconnect the chip pads to external circuitry.
Ultrasonic welding is an industrial process whereby high-frequency ultrasonic acoustic vibrations are locally applied to work pieces being held together under pressure to create a solid-state weld. It is commonly used for plastics and metals, and especially for joining dissimilar materials. In ultrasonic welding, there are no connective bolts, nails, soldering materials, or adhesives necessary to bind the materials together. When used to join metals, the temperature stays well below the melting point of the involved materials, preventing any unwanted properties which may arise from high temperature exposure of the metal.
Plastic welding is welding for semi-finished plastic materials, and is described in ISO 472 as a process of uniting softened surfaces of materials, generally with the aid of heat. Welding of thermoplastics is accomplished in three sequential stages, namely surface preparation, application of heat and pressure, and cooling. Numerous welding methods have been developed for the joining of semi-finished plastic materials. Based on the mechanism of heat generation at the welding interface, welding methods for thermoplastics can be classified as external and internal heating methods, as shown in Fig 1.
Electric resistance welding (ERW) is a welding process in which metal parts in contact are permanently joined by heating them with an electric current, melting the metal at the joint. Electric resistance welding is widely used, for example, in manufacture of steel pipe and in assembly of bodies for automobiles. The electric current can be supplied to electrodes that also apply clamping pressure, or may be induced by an external magnetic field. The electric resistance welding process can be further classified by the geometry of the weld and the method of applying pressure to the joint: spot welding, seam welding, flash welding, projection welding, for example. Some factors influencing heat or welding temperatures are the proportions of the workpieces, the metal coating or the lack of coating, the electrode materials, electrode geometry, electrode pressing force, electric current and length of welding time. Small pools of molten metal are formed at the point of most electrical resistance as an electric current is passed through the metal. In general, resistance welding methods are efficient and cause little pollution, but their applications are limited to relatively thin materials.
A heat sealer is a machine used to seal products, packaging, and other thermoplastic materials using heat. This can be with uniform thermoplastic monolayers or with materials having several layers, at least one being thermoplastic. Heat sealing can join two similar materials together or can join dissimilar materials, one of which has a thermoplastic layer.
In chemistry, the study of sonochemistry is concerned with understanding the effect of ultrasound in forming acoustic cavitation in liquids, resulting in the initiation or enhancement of the chemical activity in the solution. Therefore, the chemical effects of ultrasound do not come from a direct interaction of the ultrasonic sound wave with the molecules in the solution.
Thermal spraying techniques are coating processes in which melted materials are sprayed onto a surface. The "feedstock" is heated by electrical or chemical means.
Hot plate welding, also called heated tool welding, is a thermal welding technique for joining thermoplastics. A heated tool is placed against or near the two surfaces to be joined in order to melt them. Then, the heat source is removed, and the surfaces are brought together under pressure. Hot plate welding has relatively long cycle times, ranging from 10 seconds to minutes, compared to vibration or ultrasonic welding. However, its simplicity and ability to produce strong joints in almost all thermoplastics make it widely used in mass production and for large structures, like large-diameter plastic pipes. Different inspection techniques are implemented in order to identify various discontinuities or cracks.
Soldering is a process of joining two metal surfaces together using a filler metal called solder. The soldering process involves heating the surfaces to be joined and melting the solder, which is then allowed to cool and solidify, creating a strong and durable joint.
Thermosonic bonding is widely used to wire bond silicon integrated circuits into computers. Alexander Coucoulas was named "Father of Thermosonic Bonding" by George Harman, the world's foremost authority on wire bonding, where he referenced Coucoulas's leading edge publications in his book, Wire Bonding In Microelectronics. Owing to the well proven reliability of thermosonic bonds, it is extensively used to connect the central processing units (CPUs), which are encapsulated silicon integrated circuits that serve as the "brains" of today's computers.
Alexander Coucoulas is an American inventor, research engineer, and author. He was named "father of thermosonic bonding" by George Harman, the world's foremost authority on wire bonding, where he referenced Coucoulas's leading edge publications in his book, Wire Bonding In Microelectronics. A thermosonic bond is formed using a set of parameters which include ultrasonic, thermal and mechanical (force) energies.
Advanced thermoplastic composites (ACM) have a high strength fibres held together by a thermoplastic matrix. Advanced thermoplastic composites are becoming more widely used in the aerospace, marine, automotive and energy industry. This is due to the decreasing cost and superior strength to weight ratios, over metallic parts. Advance thermoplastic composite have excellent damage tolerance, corrosion resistant, high fracture toughness, high impact resistance, good fatigue resistance, low storage cost, and infinite shelf life. Thermoplastic composites also have the ability to be formed and reformed, repaired and fusion welded.
A green data center, or sustainable data center, is a service facility which utilizes energy-efficient technologies. They do not contain obsolete systems, and take advantage of newer, more efficient technologies.
Solvent bonding is one of several methods of adhesive bonding for joining plastics. Application of a solvent to a thermoplastic material softens the polymer, and with applied pressure this results in polymer chain interdiffusion at the bonding junction. When the solvent evaporates, this leaves a fully consolidated bond-line. An advantage to solvent bonding versus other polymer joining methods is that bonding generally occurs below the glass transition temperature of the polymer.
