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Company type | Corporation |
---|---|
Industry | Semiconductors |
Founded | 1987 |
Headquarters | Taichung, Taiwan |
Key people | Arthur Yu-Cheng Chiao (Chairman & CEO) Tung-Yi Chan (President) |
Products |
|
Website | www |
Winbond Electronics Corporation (Chinese :華邦電子公司; pinyin :Huábāng Diànzǐ Gōngsī) is a Taiwan-based corporation founded in 1987. It produces semiconductors and several types of integrated circuits (ICs) including dynamic random-access memory, static random-access memory, serial flash, microcontrollers, and Super I/O chips.
Winbond is the largest brand-name IC supplier in Taiwan and one of the biggest suppliers of semiconductors worldwide.[ citation needed ]
Winbond was established in 1987 in Hsinchu Science Park in Taiwan. [1] [2] Its founder came from the Industrial Technology Research Institute. [3] From 1987 to 1988 J.J Pan and Partners designed and constructed a fabrication plant known as IC Wafer Fab I Plant. This facility would produce 6 inch wafers. It was designed and constructed in 14 months. Later in 1989 to 1992, J.J Pan and Partners built a second fab for Winbond called IC Wafer Fab II Plant. [4]
In 1992 Winbond joined the Precision RISC Organization and licensed HP's PA-RISC architecture to design and manufacture chips for X terminals and printers. [5]
Winbond acquired affiliated chipset maker Symphony Laboratories, of San Jose, California, in October 1995. [6]
Winbond was affected by power cuts caused by the 1999 Jiji earthquake forcing the company to pause manufacturing. [7] By 2002 Winbond had 4,000 employees. [1] In 2004 Winbond was said to have a "continuous-learning culture", having 1,200 training programs for its employees. [8] In August 2004, Infineon announced a deal with Winbond to build a factory to make DRAM. [9]
The computer IC, consumer electronics IC, and logic product foundry divisions of Winbond were spun off as Nuvoton Technology Corporation on 1 July 2008.[ citation needed ]
In 2010 Winbond was manufacturing DDR2 DRAM using technology licensed from Qimonda. [10]
In 2019 Karamba Security partnered with Winbond to make secure embedded flash products. [11] In 2023 Winbond joined the Universal Chiplet Interconnect Express Consortium. [12]
Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips. It is a multiple-step photolithographic and physico-chemical process during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.
STMicroelectronics NV is a European multinational semiconductor contract manufacturing and design company. It is the largest of such companies in Europe. It was founded in 1987 from the merger of two state-owned semiconductor corporations: Thomson Semiconducteurs of France and SGS Microelettronica of Italy. The company is incorporated in the Netherlands and headquartered in Plan-les-Ouates, Switzerland. Its shares are traded on Euronext Paris, the Borsa Italiana and the New York Stock Exchange.
Taiwan Semiconductor Manufacturing Company Limited is a Taiwanese multinational semiconductor contract manufacturing and design company. It is the world's most valuable semiconductor company, the world's largest dedicated independent ("pure-play") semiconductor foundry, and its country's largest company, with headquarters and main operations located in the Hsinchu Science Park in Hsinchu, Taiwan. Although the central government of Taiwan is the largest individual shareholder, the majority of TSMC is owned by foreign investors. In 2023, the company was ranked 44th in the Forbes Global 2000. Taiwan's exports of integrated circuits amounted to $184 billion in 2022, accounted for nearly 25 percent of Taiwan's GDP. TSMC constitutes about 30 percent of the Taiwan Stock Exchange's main index.
Micron Technology, Inc. is an American producer of computer memory and computer data storage including dynamic random-access memory, flash memory, and solid-state drives (SSDs). It is headquartered in Boise, Idaho. Micron's consumer products, including the Ballistix line of memory modules, are marketed under the Crucial brand. Micron and Intel together created IM Flash Technologies, which produced NAND flash memory. It owned Lexar between 2006 and 2017. Micron is the only U.S.-based manufacturer of memory.
The foundry model is a microelectronics engineering and manufacturing business model consisting of a semiconductor fabrication plant, or foundry, and an integrated circuit design operation, each belonging to separate companies or subsidiaries.
Fabless manufacturing is the design and sale of hardware devices and semiconductor chips while outsourcing their fabrication to a specialized manufacturer called a semiconductor foundry. These foundries are typically, but not exclusively, located in the United States, China, and Taiwan. Fabless companies can benefit from lower capital costs while concentrating their research and development resources on the end market. Some fabless companies and pure play foundries may offer integrated-circuit design services to third parties.
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In the microelectronics industry, a semiconductor fabrication plant is a factory for semiconductor device fabrication.
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A three-dimensional integrated circuit is a MOS integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
Nuvoton Technology Corporation is a Taiwanese semiconductor company established in 2008. It originated as a wholly owned subsidiary of Winbond Electronics Corp. before becoming an independent entity. It became a public company in September 2010 on the Taiwan Stock Exchange (TWSE).
GlobalFoundries Inc. is a multinational semiconductor contract manufacturing and design company incorporated in the Cayman Islands and headquartered in Malta, New York. Created by the divestiture of the manufacturing arm of AMD, the company was privately owned by Mubadala Investment Company, a sovereign wealth fund of the United Arab Emirates, until an initial public offering (IPO) in October 2021.
The Inmos microprocessor factory, also known as the Inmos factory, previously known as Newport Wafer Fab, now known as Nexperia Newport, is a semiconductor fabrication plant for Inmos built in Newport, Wales, UK in 1980. It has gone through numerous changes in ownership. Since March 2024, the factory has been owned by Vishay Intertechnology.
Vanguard International Semiconductor Corporation (VIS) is a Taiwanese specialized IC foundry service provider, founded in December 1994 in Hsinchu Science Park by Morris Chang. In March 1998, VIS became a listed company on the Taiwan Over-The-Counter Stock Exchange (OTC) with the main shareholders TSMC, National Development Fund, Executive Yuan and other institutional investors.
ChangXin Memory Technologies is a Chinese semiconductor integrated device manufacturer headquartered in Hefei, Anhui, specializing in the production of DRAM memory.
Glossary of microelectronics manufacturing terms
Hua Hong Semiconductor Limited is a publicly listed Chinese pure-play semiconductor foundry company based in Shanghai, established in 1996 as part of China's national efforts to boost its IC industry. Currently, Hua Hong's most advanced node is achieved by its subsidiary Shanghai Huali (HLMC), which can manufacture 28/22-nm process.
The Chinese semiconductor industry, including integrated circuit design and manufacturing, forms a major part of mainland China's information technology industry.