Winbond

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Winbond Electronics Corporation
華邦電子公司
Company typeCorporation
Industry Semiconductors
Founded1987;37 years ago (1987)
Headquarters Taichung, Taiwan
Key people
Arthur Yu-Cheng Chiao
(Chairman & CEO)
Tung-Yi Chan
(President)
Products
Website www.winbond.com
A desktop PC Super I/O, based on the Winbond chip Winbond W83977EF-AW 20100419.jpg
A desktop PC Super I/O, based on the Winbond chip
A Winbond controller Winbond W83627EHG-A 20100119.jpg
A Winbond controller

Winbond Electronics Corporation (Chinese :華邦電子公司; pinyin :Huábāng Diànzǐ Gōngsī) is a Taiwan-based corporation founded in 1987. It produces semiconductors and several types of integrated circuits (ICs) including dynamic random-access memory, static random-access memory, serial flash, microcontrollers, and Super I/O chips.

Contents

Winbond is the largest brand-name IC supplier in Taiwan and one of the biggest suppliers of semiconductors worldwide.[ citation needed ]

History

Winbond was established in 1987 in Hsinchu Science Park in Taiwan. [1] [2] Its founder came from the Industrial Technology Research Institute. [3] From 1987 to 1988 J.J Pan and Partners designed and constructed a fabrication plant known as IC Wafer Fab I Plant. This facility would produce 6 inch wafers. It was designed and constructed in 14 months. Later in 1989 to 1992, J.J Pan and Partners built a second fab for Winbond called IC Wafer Fab II Plant. [4]

In 1992 Winbond joined the Precision RISC Organization and licensed HP's PA-RISC architecture to design and manufacture chips for X terminals and printers. [5]

Winbond acquired affiliated chipset maker Symphony Laboratories, of San Jose, California, in October 1995. [6]

Winbond was affected by power cuts caused by the 1999 Jiji earthquake forcing the company to pause manufacturing. [7] By 2002 Winbond had 4,000 employees. [1] In 2004 Winbond was said to have a "continuous-learning culture", having 1,200 training programs for its employees. [8] In August 2004, Infineon announced a deal with Winbond to build a factory to make DRAM. [9]

The computer IC, consumer electronics IC, and logic product foundry divisions of Winbond were spun off as Nuvoton Technology Corporation on 1 July 2008.[ citation needed ]

In 2010 Winbond was manufacturing DDR2 DRAM using technology licensed from Qimonda. [10]

In 2019 Karamba Security partnered with Winbond to make secure embedded flash products. [11] In 2023 Winbond joined the Universal Chiplet Interconnect Express Consortium. [12]

See also

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References

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  4. Pan, Joshua Jih (1999). J.J. Pan and Partners: Selected and Current Works. Images Publishing. pp. 210–211. ISBN   978-1-86470-058-9.
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  6. LaPedus, Mark (October 30, 1995). "Winbond Plays It Out With Symphony". Electronic Buyers' News. CMP Publications: 3 via ProQuest.
  7. Tran, Mark (1999-09-21). "China offers aid after Taiwan quake". The Guardian. ISSN   0261-3077 . Retrieved 2024-05-15.
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  9. Png, Ivan (2013-09-11). Managerial Economics, 4th Edition. Routledge. ISBN   978-1-136-29757-1.
  10. "Winbond's innovative DRAM design and the legacy of Qimonda". EDN. 2010-08-12. Retrieved 2024-05-15.
  11. Lynn, Alex (2019-12-02). "Winbond and Karamba Security partner for embedded cyber security". www.electronicspecifier.com. Retrieved 2024-05-15.
  12. Fowle, Harry (2023-02-17). "Winbond joins UCIe Consortium to support chiplet interface standardisation". www.electronicspecifier.com. Retrieved 2024-05-15.