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An integrated circuit (IC), also known as a microchip or simply chip, is a small electronic device made up of multiple interconnected electronic components such as transistors, resistors, and capacitors. These components are etched onto a small piece of semiconductor material, usually silicon. Integrated circuits are used in a wide range of electronic devices, including computers, smartphones, and televisions, to perform various functions such as processing and storing information. They have greatly impacted the field of electronics by enabling device miniaturization and enhanced functionality.
A system on a chip or system-on-chip is an integrated circuit that integrates most or all components of a computer or electronic system. These components usually include an on-chip central processing unit (CPU), memory interfaces, input/output devices and interfaces, and secondary storage interfaces, often alongside other components such as radio modems and a graphics processing unit (GPU) – all on a single substrate or microchip. SoCs may contain digital and also analog, mixed-signal and often radio frequency signal processing functions.
An application-specific integrated circuit is an integrated circuit (IC) chip customized for a particular use, rather than intended for general-purpose use, such as a chip designed to run in a digital voice recorder or a high-efficiency video codec. Application-specific standard product chips are intermediate between ASICs and industry standard integrated circuits like the 7400 series or the 4000 series. ASIC chips are typically fabricated using metal–oxide–semiconductor (MOS) technology, as MOS integrated circuit chips.
Xilinx, Inc. was an American technology and semiconductor company that primarily supplied programmable logic devices. The company is renowned for inventing the first commercially viable field-programmable gate array (FPGA). It also pioneered the first fabless manufacturing model.
Hardware acceleration is the use of computer hardware designed to perform specific functions more efficiently when compared to software running on a general-purpose central processing unit (CPU). Any transformation of data that can be calculated in software running on a generic CPU can also be calculated in custom-made hardware, or in some mix of both.
A hybrid integrated circuit (HIC), hybrid microcircuit, hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices and passive components, bonded to a substrate or printed circuit board (PCB). A PCB having components on a Printed wiring board (PWB) is not considered a true hybrid circuit according to the definition of MIL-PRF-38534.
A multi-chip module (MCM) is generically an electronic assembly where multiple integrated circuits, semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach.
Integrated circuit design, semiconductor design, chip design or IC design, is a sub-field of electronics engineering, encompassing the particular logic and circuit design techniques required to design integrated circuits, or ICs. ICs consist of miniaturized electronic components built into an electrical network on a monolithic semiconductor substrate by photolithography.
A system in a package (SiP) or system-in-package is a number of integrated circuits (ICs) enclosed in one chip carrier package or encompassing an IC package substrate that may include passive components and perform the functions of an entire system. The ICs may be stacked using package on package, placed side by side, and/or embedded in the substrate. The SiP performs all or most of the functions of an electronic system, and is typically used when designing components for mobile phones, digital music players, etc. Dies containing integrated circuits may be stacked vertically on the package substrate. They are internally connected by fine wires that are bonded to the package substrate. Alternatively, with a flip chip technology, solder bumps are used to join stacked chips together and to the package substrate, or even both techniques can be used in a single package. SiPs are like systems on a chip (SoCs) but less tightly integrated and not on a single semiconductor die.
Multi-project chip (MPC), and multi-project wafer (MPW) semiconductor manufacturing arrangements allow customers to share tooling and microelectronics wafer fabrication cost between several designs or projects.
IP-XACT, also known as IEEE 1685, is an XML format that defines and describes individual, re-usable electronic circuit designs to facilitate their use in creating integrated circuits. IP-XACT was created by the SPIRIT Consortium as a standard to enable automated configuration and integration through tools and evolving into an IEEE standard.
In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection (via) that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits. Compared to alternatives such as package-on-package, the interconnect and device density is substantially higher, and the length of the connections becomes shorter.
A three-dimensional integrated circuit is a MOS integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
The quality intellectual property metric (QIP) is an international standard, developed by Virtual Socket Interface Alliance (VSIA) for measuring Intellectual Property (IP) or Silicon intellectual property (SIP) quality and examining the practices used to design, integrate and support the SIP. SIP hardening is required to facilitate the reuse of IP in integrated circuit design.
Integrated passive devices (IPDs), also known as integrated passive components (IPCs) or embedded passive components (EPC), are electronic components where resistors (R), capacitors (C), inductors (L)/coils/chokes, microstriplines, impedance matching elements, baluns or any combinations of them are integrated in the same package or on the same substrate. Sometimes integrated passives can also be called as embedded passives, and still the difference between integrated and embedded passives is technically unclear. In both cases passives are realized in between dielectric layers or on the same substrate.
Global Unichip Corporation (GUC) is a worldwide fabless ASIC design service company, with its headquarters located in the Hsinchu Science Park in Hsinchu, Taiwan.
Arteris, Inc. is a multinational technology firm headquartered in Campbell, California. It develops the Network-on-Chip (NoC) on-chip interconnect IP and System-on-Chip (SoC) integration automation software used to create semiconductor designs for a variety of devices, particularly in automotive electronics, artificial intelligence/machine learning and consumer markets. The company specializes in the development and distribution of Network-on-Chip (NoC) interconnect Intellectual Property (IP) and SoC integration automation products used in the development of systems-on-chip.
A 2.5D integrated circuit is an advanced packaging technique that combines multiple integrated circuit dies in a single package without stacking them into a three-dimensional integrated circuit (3D-IC) with through-silicon vias (TSVs). The term "2.5D" originated when 3D-ICs with TSVs were quite new and still very difficult. Chip designers realized that many of the advantages of 3D integration could be approximated by placing bare dies side by side on an interposer instead of stacking them vertically. If the pitch is very fine and the interconnect very short, the assembly can be packaged as a single component with better size, weight, and power characteristics than a comparable 2D circuit board assembly. This half-way 3D integration was facetiously named "2.5D" and the name stuck. Since then, 2.5D has proven to be far more than just "half-way to 3D." Some benefits:
Glossary of microelectronics manufacturing terms
Advanced packaging is the aggregation and interconnection of components before traditional integrated circuit packaging where a single die is packaged. Advanced packaging allows multiple devices, including electrical, mechanical, or semiconductor devices, to be merged and packaged as a single electronic device. Advanced packaging uses processes and techniques that are typically performed at semiconductor fabrication facilities, unlike traditional integrated circuit packaging, which does not. Advanced packaging thus sits between fabrication and traditional packaging -- or, in other terminology, between BEoL and post-fab. Advanced packaging includes multi-chip modules, 3D ICs, 2.5D ICs, heterogeneous integration, fan-out wafer-level packaging, system-in-package, quilt packaging, combining logic (processors) and memory in a single package, die stacking, wafer bonding/stacking, several chiplets or dies in a package, combinations of these techniques, and others. 2.5D and 3D ICs are also called 2.5D or 3D packages.
References
- ↑ Brookes (25 July 2021). "What Is a Chiplet?". How-To Geek. Retrieved 28 December 2021.
- ↑ "Chiplet". WikiChip. Retrieved 28 December 2021.
- ↑ Semi Engineering "Chiplets" Retrieved 5 December 2022
- ↑ Don Scansen, EE Times "Chiplets: A Short History Retrieved 5 December 2022
- ↑ Keeler. "Common Heterogeneous Integration and IP Reuse Strategies (CHIPS)". DARPA. Retrieved 28 December 2021.
- ↑ Kenyon (6 April 2021). "Heterogeneous Integration and the Evolution of IC Packaging". EE Times Europe. Retrieved 28 December 2021.
- ↑ Bertin, Claude L.; Su, Lo-Soun; Van Horn, Jody (2001). "Known Good die (KGD)". Area Array Interconnection Handbook. SpringerLink. pp. 149–200. doi:10.1007/978-1-4615-1389-6_4. ISBN 978-1-4613-5529-8 . Retrieved 7 October 2022.
- ↑ "Waiting for Chiplet Standards". 25 March 2021.
- ↑ "Is UCIe Really Universal?". 22 November 2022.
- ↑ "UCIe Goes Back to the Drawing Board". 22 February 2024.
- ↑ Patterson, D.A. (March 2006). "RAMP: Research accelerator for multiple processors - a community vision for a shared experimental parallel HW/SW platform". 2006 IEEE International Symposium on Performance Analysis of Systems and Software. pp. 1–. doi:10.1109/ISPASS.2006.1620784. ISBN 1-4244-0186-0.
- ↑ Wawrzynek, John (2015-05-01). "Accelerating Science Driven System Design With RAMP". UCB. doi:10.2172/1186854. OSTI 1186854.