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An integrated circuit, also known as a microchip, chip or IC, is a small electronic device made up of multiple interconnected electronic components such as transistors, resistors, and capacitors. These components are etched onto a small piece of semiconductor material, usually silicon. Integrated circuits are used in a wide range of electronic devices, including computers, smartphones, and televisions, to perform various functions such as processing and storing information. They have greatly impacted the field of electronics by enabling device miniaturization and enhanced functionality.
A system on a chip or system-on-chip is an integrated circuit that integrates most or all components of a computer or other electronic system. These components almost always include on-chip central processing unit (CPU), memory interfaces, input/output devices and interfaces, and secondary storage interfaces, often alongside other components such as radio modems and a graphics processing unit (GPU) – all on a single substrate or microchip. SoCs may contain digital and also analog, mixed-signal and often radio frequency signal processing functions.
Xilinx, Inc. was an American technology and semiconductor company that primarily supplied programmable logic devices. The company is known for inventing the first commercially viable field-programmable gate array (FPGA). It also created the first fabless manufacturing model.
A multi-chip module (MCM) is generically an electronic assembly where multiple integrated circuits, semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach.
Integrated circuit design, semiconductor design, chip design or IC design, is a sub-field of electronics engineering, encompassing the particular logic and circuit design techniques required to design integrated circuits, or ICs. ICs consist of miniaturized electronic components built into an electrical network on a monolithic semiconductor substrate by photolithography.
A network on a chip or network-on-chip is a network-based communications subsystem on an integrated circuit ("microchip"), most typically between modules in a system on a chip (SoC). The modules on the IC are typically semiconductor IP cores schematizing various functions of the computer system, and are designed to be modular in the sense of network science. The network on chip is a router-based packet switching network between SoC modules.
A system in a package (SiP) or system-in-package is a number of integrated circuits (ICs) enclosed in one chip carrier package or encompassing an IC package substrate that may include passive components and perform the functions of an entire system. The ICs may be stacked using package on package, placed side by side, and/or embedded in the substrate. The SiP performs all or most of the functions of an electronic system, and is typically used when designing components for mobile phones, digital music players, etc. Dies containing integrated circuits may be stacked vertically on the package substrate. They are internally connected by fine wires that are bonded to the package substrate. Alternatively, with a flip chip technology, solder bumps are used to join stacked chips together and to the package substrate, or even both techniques can be used in a single package. SiPs are like systems on a chip (SoCs) but less tightly integrated and not on a single semiconductor die.
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Cadence Design Systems, Inc., is a multinational technology and computational software company. Headquartered in San Jose, California, Cadence was formed in 1988 through the merger of SDA Systems and ECAD. Initially specialized in electronic design automation (EDA) software for the semiconductor industry, currently the company makes software and hardware for designing products such as integrated circuits, systems on chips (SoCs), printed circuit boards, and pharmaceutical drugs, also licensing intellectual property for the electronics, aerospace, defense and automotive industries, among others.
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An interposer is an electrical interface routing between one socket or connection to another. The purpose of an interposer is to spread a connection to a wider pitch or to reroute a connection to a different connection.
A three-dimensional integrated circuit is a MOS integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
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Integrated passive devices (IPDs), also known as integrated passive components (IPCs) or embedded passive components (EPC), are electronic components where resistors (R), capacitors (C), inductors (L)/coils/chokes, microstriplines, impedance matching elements, baluns or any combinations of them are integrated in the same package or on the same substrate. Sometimes integrated passives can also be called as embedded passives, and still the difference between integrated and embedded passives is technically unclear. In both cases passives are realized in between dielectric layers or on the same substrate.
Arteris, Inc. is a multinational technology firm headquartered in Campbell, California. It develops the Network-on-Chip (NoC) on-chip interconnect IP and System-on-Chip (SoC) integration automation software used to create semiconductor designs for a variety of devices, particularly in automotive electronics, artificial intelligence/machine learning and consumer markets. The company specializes in the development and distribution of Network-on-Chip (NoC) interconnect Intellectual Property (IP) and SoC integration automation products used in the development of systems-on-chip.
AMD Instinct is AMD's brand of professional GPUs. It replaced AMD's FirePro S brand in 2016. Compared to the Radeon brand of mainstream consumer/gamer products, the instinct product line is intended to accelerate deep learning, artificial neural network, and high-performance computing/GPGPU applications.
A 2.5D integrated circuit is an advanced packaging technique that combines multiple integrated circuit dies in a single package without stacking them into a three-dimensional integrated circuit (3D-IC) with through-silicon vias (TSVs). The term "2.5D" originated when 3D-ICs with TSVs were quite new and still very difficult. Chip designers realized that many of the advantages of 3D integration could be approximated by placing bare dies side by side on an interposer instead of stacking them vertically. If the pitch is very fine and the interconnect very short, the assembly can be packaged as a single component with better size, weight, and power characteristics than a comparable 2D circuit board assembly. This half-way 3D integration was facetiously named "2.5D" and the name stuck. Since then, 2.5D has proven to be far more than just "half-way to 3D." Some benefits:
Glossary of microelectronics manufacturing terms
Advanced packaging is the aggregation and interconnection of components before traditional integrated circuit packaging where a single die is packaged. Advanced packaging allows multiple devices to be merged and packaged as a single electronic device. Unlike traditional integrated circuit packaging, advanced packaging employs processes and techniques that are typically performed at semiconductor fabrication facilities. Advanced packaging thus sits between fabrication and traditional packaging -- or, in other terminology, between BEoL and post-fab. Advanced packaging includes multi-chip modules, 3D ICs, 2.5D ICs, heterogeneous integration, fan-out wafer-level packaging, system-in-package, quilt packaging, combining logic (processors) and memory in a single package, die stacking, several chiplets or dies in a package, combinations of these techniques, and others. 2.5D and 3D ICs are also called 2.5D or 3D packages.
References
- ↑ Brookes (25 July 2021). "What Is a Chiplet?". How-To Geek. Retrieved 28 December 2021.
- ↑ "Chiplet". WikiChip. Retrieved 28 December 2021.
- ↑ Semi Engineering "Chiplets" Retrieved 5 December 2022
- ↑ Don Scansen, EE Times "Chiplets: A Short History Retrieved 5 December 2022
- ↑ Keeler. "Common Heterogeneous Integration and IP Reuse Strategies (CHIPS)". DARPA. Retrieved 28 December 2021.
- ↑ Kenyon (6 April 2021). "Heterogeneous Integration and the Evolution of IC Packaging". EE Times Europe. Retrieved 28 December 2021.
- ↑ Bertin, Claude L.; Su, Lo-Soun; Van Horn, Jody (2001). "Known Good die (KGD)". Area Array Interconnection Handbook. SpringerLink. pp. 149–200. doi:10.1007/978-1-4615-1389-6_4. ISBN 978-1-4613-5529-8 . Retrieved 7 October 2022.
- ↑ "Waiting for Chiplet Standards". 25 March 2021.
- ↑ "Is UCIe Really Universal?". 22 November 2022.
- ↑ "UCIe Goes Back to the Drawing Board". 22 February 2024.
- ↑ Patterson, D.A. (March 2006). "RAMP: Research accelerator for multiple processors - a community vision for a shared experimental parallel HW/SW platform". 2006 IEEE International Symposium on Performance Analysis of Systems and Software. pp. 1–. doi:10.1109/ISPASS.2006.1620784. ISBN 1-4244-0186-0.
- ↑ Wawrzynek, John (2015-05-01). "Accelerating Science Driven System Design With RAMP". UCB. doi:10.2172/1186854. OSTI 1186854.