Arteris

Last updated
Arteris, Inc.
Company type Public
Industry
Founded2004;20 years ago (2004)
Headquarters Campbell, California, United States
Key people
K. Charles Janac (CEO)
ProductsNetwork-on-Chip interconnect IP
RevenueUS $50.4 million (2022) [1]
Number of employees
250 (2023)
Website www.arteris.com

Arteris, Inc. is a multinational technology firm headquartered in Campbell, California. [2] It develops the Network-on-Chip (NoC) on-chip interconnect IP and System-on-Chip (SoC) integration automation software used to create semiconductor designs for a variety of devices, particularly in automotive electronics, artificial intelligence/machine learning and consumer markets. [3] [4] The company specializes in the development and distribution of Network-on-Chip (NoC) interconnect Intellectual Property (IP) and SoC integration automation products used in the development of systems-on-chip.

Contents

It is best known for its flagship product, Arteris FlexNoC, which by 2022 has shipped in over 3 billion devices. The company offers a cache coherent interconnect IP product line called Ncore as well as a last level cache called CodaCache. [5] [6] As a result of its acquisition of Magillem Design Services and Semifore, the company also offers a suite of IEEE-1685 IP-XACT and SystemRDL standards-based SoC Integration automation software products.

History

Arteris was founded in 2004 by Philippe Boucard and two other engineering executives who had worked together at T.Sqware, a startup that was acquired by Globespan. [7] [8] [9] Company executives wished to address problems with existing monolithic bus and crossbar interconnect technologies, such as wire and routing congestion, increased heat and power consumption, failed timing closure, and increased die area. [4] [10] The firm’s leadership sought and received venture capital totaling $44.1 million for the creation of its new technology from investors, including ARM Holdings, Crescendo Ventures, DoCoMo Capital, Qualcomm, Synopsys, TVM Capital, and Ventech. [11] [12]

By 2006, Arteris developed the first commercially available NoC IP product, called NoC Solution, followed in 2009 by a more advanced product, FlexNoC. [4] [13] [14] The products used “packetization and a distributed network of small interconnect elements to address congestion, timing, power and performance issues.” [4] [15] Arteris marketed FlexNoC as an improvement on traditional SoCs interconnect fabrics, citing its reduction in gate count by 30 percent, reduction of wires by 50 percent, and a more compact chip floor as compared to a functionally equivalent hybrid bus or crossbar. [2] [10] [16]

Designers of SoCs began to take advantage of the technology’s increased design efficiency, flexibility, and a significant reduction in production costs. [16] [17] [18] [19] By 2012, the company had over 40 semiconductor customers, including Qualcomm, Samsung, Texas Instruments, Toshiba, and LG Electronics, with 200 million SoCs being produced with Arteris IP. [4] The company’s volume is projected to grow to over 1 billion units per year by 2015. [4]

In October 2013, Qualcomm Technologies, Inc. acquired the FlexNoC network-on-chip product portfolio, but Arteris retained existing customer contracts and to continue licensing FlexNoC and modifying the source code for customer support. Qualcomm will provide engineering deliverables for the FlexNoC product line and updates to Arteris. Qualcomm does not maintain any ownership interest in Arteris. [20] [21]

In September 2014, Arteris launched the Arteris FlexNoC Resilience Package, which added functional safety mechanisms to the FlexNoC interconnect IP useful for ISO 26262 and IEC 61508 standards compliance. [22]

In May 2016, Arteris released its first version of the Ncore Cache Coherent Interconnect IP product with optional support for functional safety. [23]

Arteris presented the Ncore Cache Coherent Interconnect IP version 3 and the optional Ncore Resilience Package for functional safety at the Linley Processor Conference in October 2017. [24]

In 2020, Arteris acquired Magillem Design Services, adding a suite of IP-XACT-based products for automating the creation of systems-on-chip and their associated software and firmware, verification and simulation platforms, and specifications and customer documentation. [25] [26]

In 2021, Arteris announced the pricing of its initial public offering (IPO), listing under Nasdaq:AIP. [27] [28]

In 2023, Arteris acquired Semifore, a provider of Hardware-Software Interface technology, to accelerate system-on-chip development and integration automation. [29]

Licensees

Arteris claims to have had 200 licensees of its products since its inception in 2004 with over 600 chip designs created with its IP products, with deployments in over 3 billion chips. [30] [31]

These licensees include top-20 semiconductor makers Samsung Electronics, NXP, Texas Instruments, STMicroelectronics, Renesas Electronics, and multiple divisions of Intel composed of acquired companies Mobileye, Altera, and Movidius. [32] [33] [34] [35] [36] [37] [38] [39] [40]

Arteris has also signed many licensees creating electronics for autonomous vehicles and electric vehicles. Arteris IP is in multiple generations of Intel Mobileye's EyeQ series of Advanced Driver-Assistance Systems (ADAS) as well as automotive systems from Bosch, NXP, STMicroelectronics and many others. [38] [41] [42] [43] [33] [36]

Other publicly announced licensees of Arteris products include Baidu, SK Telecom, Canaan Creative, Bitmain, Aeva, Hailo, Black Sesame Technologies, Kyocera, Displaylink, Hailo, Hyundai Mobis, Microchip, SiMa.ai, Socionext, Tenstorrent. [44] [45] [46] [47] [48]

Products

Arteris offers system IP for the acceleration of system-on-chip (SoC) development across today’s electronic systems. Arteris network-on-chip (NoC) interconnect IP and SoC integration automation software enable higher product performance with lower power consumption and faster time to market, delivering better SoC economics so its customers vs legacy silicon fabrics or manual effort.

Semiconductor IP

IP products based on Network-on-chip technology include:

Optional packages for the above products include:

SoC Integration Automation

Software products to accelerated system-on-chip integration, based on the IEEE 1685 IP-XACT standard include:

Related Research Articles

<span class="mw-page-title-main">System on a chip</span> Micro-electronic component

A system on a chip or system-on-chip is an integrated circuit that integrates most or all components of a computer or other electronic system. These components almost always include on-chip central processing unit (CPU), memory interfaces, input/output devices and interfaces, and secondary storage interfaces, often alongside other components such as radio modems and a graphics processing unit (GPU) – all on a single substrate or microchip. SoCs may contain digital and also analog, mixed-signal and often radio frequency signal processing functions.

XScale is a microarchitecture for central processing units initially designed by Intel implementing the ARM architecture instruction set. XScale comprises several distinct families: IXP, IXC, IOP, PXA and CE, with some later models designed as system-on-a-chip (SoC). Intel sold the PXA family to Marvell Technology Group in June 2006. Marvell then extended the brand to include processors with other microarchitectures, like Arm's Cortex.

The Arm Advanced Microcontroller Bus Architecture (AMBA) is an open-standard, on-chip interconnect specification for the connection and management of functional blocks in system-on-a-chip (SoC) designs. It facilitates development of multi-processor designs with large numbers of controllers and components with a bus architecture. Since its inception, the scope of AMBA has, despite its name, gone far beyond microcontroller devices. Today, AMBA is widely used on a range of ASIC and SoC parts including applications processors used in modern portable mobile devices like smartphones. AMBA is a registered trademark of Arm Ltd.

<span class="mw-page-title-main">Network on a chip</span> Electronic communication subsystem on an integrated circuit

A network on a chip or network-on-chip is a network-based communications subsystem on an integrated circuit ("microchip"), most typically between modules in a system on a chip (SoC). The modules on the IC are typically semiconductor IP cores schematizing various functions of the computer system, and are designed to be modular in the sense of network science. The network on chip is a router-based packet switching network between SoC modules.

Adreno is a series of graphics processing unit (GPU) semiconductor intellectual property cores developed by Qualcomm and used in many of their SoCs.

<span class="mw-page-title-main">MediaTek</span> Taiwanese fabless semiconductor company

MediaTek Inc. is a Taiwanese fabless semiconductor company that provides chips for wireless communications, high-definition television, handheld mobile devices like smartphones and tablet computers, navigation systems, consumer multimedia products and digital subscriber line services as well as optical disc drives.

IP-XACT, also known as IEEE 1685, is an XML format that defines and describes individual, re-usable electronic circuit designs to facilitate their use in creating integrated circuits. IP-XACT was created by the SPIRIT Consortium as a standard to enable automated configuration and integration through tools and evolving into an IEEE standard.

A three-dimensional integrated circuit is a MOS integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.

<span class="mw-page-title-main">Qualcomm Snapdragon</span> Suite of system-on-a-chip (SoC) semiconductor products

Snapdragon is a suite of system on a chip (SoC) semiconductor products for mobile devices designed and marketed by Qualcomm Technologies Inc. The Snapdragon's central processing unit (CPU) uses the ARM architecture. As such, Qualcomm often refers to the Snapdragon as a "mobile platform". Snapdragon semiconductors are embedded in devices of various systems, including vehicles, Android, Windows Phone and netbooks. In addition to the processors, the Snapdragon line includes modems, Wi-Fi chips and mobile charging products.

<span class="mw-page-title-main">Arm Holdings</span> British multinational semiconductor and software design company

Arm Holdings plc is a British semiconductor and software design company based in Cambridge, England, whose primary business is the design of central processing unit (CPU) cores that implement the ARM architecture family of instruction sets. It also designs other chips, provides software development tools under the DS-5, RealView and Keil brands, and provides systems and platforms, system-on-a-chip (SoC) infrastructure and software. As a "holding" company, it also holds shares of other companies. Since 2016, it has been majority owned by Japanese conglomerate SoftBank Group.

Vivante Corporation was a fabless semiconductor company headquartered in Sunnyvale, California, with an R&D center in Shanghai, China. The company was founded in 2004 as GiQuila and focused on the portable gaming market. The company's first product was a DirectX-compatible graphics processing unit (GPU) capable of playing PC games. In 2007, GiQuila changed its name to Vivante and shifted the direction of the company to the design and licensing of embedded graphics processing unit designs. The company licensed its Mobile Visual Reality to semiconductor solution providers, serving embedded computing markets for mobile gaming, high-definition home entertainment, image processing, and automotive display and entertainment.

<span class="mw-page-title-main">Integrated Device Technology</span> U.S. semiconductor manufacturer

Integrated Device Technology, Inc. (IDT), was an American semiconductor company headquartered in San Jose, California. The company designed, manufactured, and marketed low-power, high-performance mixed-signal semiconductor products for the advanced communications, computing, and consumer industries. The company marketed its products primarily to original equipment manufacturers (OEMs). Founded in 1980, the company began as a provider of complementary metal-oxide semiconductors (CMOS) for the communications business segment and computing business segments. The company focused on three major areas: communications infrastructure, high-performance computing, and advanced power management. Between 2018 and 2019, IDT was acquired by Renesas Electronics.

Hexagon is the brand name for a family of digital signal processor (DSP) products by Qualcomm. Hexagon is also known as QDSP6, standing for “sixth generation digital signal processor.” According to Qualcomm, the Hexagon architecture is designed to deliver performance with low power over a variety of applications.

<span class="mw-page-title-main">Allwinner Technology</span> Fabless semiconductor company

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<span class="mw-page-title-main">Imageon</span>

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<span class="mw-page-title-main">Intel Quark</span> Line of CPUs designed for small size and low power consumption

Intel Quark is a line of 32-bit x86 SoCs and microcontrollers by Intel, designed for small size and low power consumption, and targeted at new markets including wearable devices. The line was introduced at Intel Developer Forum in 2013, and discontinued in January 2019.

Heterogeneous computing refers to systems that use more than one kind of processor or core. These systems gain performance or energy efficiency not just by adding the same type of processors, but by adding dissimilar coprocessors, usually incorporating specialized processing capabilities to handle particular tasks.

Compute Express Link (CXL) is an open standard for high-speed, high capacity central processing unit (CPU)-to-device and CPU-to-memory connections, designed for high performance data center computers. CXL is built on the serial PCI Express (PCIe) physical and electrical interface and includes PCIe-based block input/output protocol (CXL.io) and new cache-coherent protocols for accessing system memory (CXL.cache) and device memory (CXL.mem). The serial communication and pooling capabilities allows CXL memory to overcome performance and socket packaging limitations of common DIMM memory when implementing high storage capacities.

References

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