This article contains content that is written like an advertisement .(January 2016) |
Company type | Société Anonyme – SA (French publicly-traded limited company) |
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| |
ISIN | FR0013227113 |
Founded | 1992 |
Founder | André-Jacques Auberton-Hervé & Jean-Michel Lamure |
Headquarters | |
Key people | Pierre Barnabé (CEO and chairman) |
Products | Innovative semiconductor materials dedicated to three key markets: mobile communications, automotive and smart objects |
Revenue | €1.09 billion (2022–2023) |
€233 million (2022–2023) | |
Owner | Free-float (61.03%) BPI France (10.35%) NSIG Sunrise SARL (10.35%) Blackrock (8.91%) CEA Investment (7.31%) Employees (1.41%) Shin-Etsu Handotai Co., Ltd. (0.63%) Treasury Shares (0.01%) |
Number of employees | 2,044 |
Website | soitec |
Footnotes /references "MarketWatch: Soitec S.A." |
Soitec is an international company based in France, that manufactures substrates used in the creation of semiconductors.
Soitec's semiconductor materials are used to manufacture chips which are used in smartphones, tablets, computers, IT servers, and data centres. Soitec's products are also found in electronic components used in cars, connected objects (Internet of Things), as well as industrial and medical equipment.
Soitec's flagship product is silicon on insulator (SOI). Materials produced by Soitec come in the form of substrates (also called "wafers"). These are produced as ultra-thin disks that are 200 to 300 mm in diameter and are less than 1 mm thick. These wafers are then etched and cut to be used for microchips in electronics.[ citation needed ]
Soitec was founded in 1992 near Grenoble in France by two researchers from CEA Leti, an institute for micro- and nanotechnologies research created by the French Commission for Atomic Energy and Alternative Energies (CEA). The pair developed Smart Cut™ technology to industrialize Silicon-On-Insulator (SOI) wafers, and built their first production unit in Bernin, in the Isère department of France.
Soitec's offering initially targeted the electronics market. At the end of the 2000s, Soitec launched into the solar energy and lighting markets, exploiting new openings for its materials and technologies. In 2015, the company announced that it would be refocusing its efforts on its core business: electronics.
Soitec employs about 2000 people throughout the world and currently has production units in France and in Singapore. The company also has R&D centers and commercial offices in France, the United States (Arizona and California), China, South Korea, Japan and Taiwan.
Historically, Soitec has marketed Silicon on Insulator (SOI) as a high performance material for manufacturing electronic chips for computers, game consoles and servers, as well as the automotive industry. With the explosion of mobile products (tablets, smartphones, etc.) on the consumer electronics market, Soitec has also developed new materials for radio-frequency components, multimedia processors, and power electronics.
With the rapid growth of the Internet of Things, wearables, and other mobile devices, new needs have arisen in terms of performance and energy efficiency of electronic components. For this market, Soitec offers materials that help reduce the energy consumed by chips, improve their information processing speed, and support the needs of high-speed Internet.
In the solar energy market Soitec acquired Concentrix Solar, then manufactured and supplied Concentrator Photovoltaic (CPV) systems from 2009 to 2015. [3] Research to create a new generation of four-junction solar cells led Soitec to set a world record in December 2014 with a cell capable of converting 46% of solar rays into electricity. Soitec announced in January 2015 that it would be leaving the solar market after several important solar plant projects ended. [4] [5]
In the lighting industry, Soitec operates upstream and downstream of the LED value chain.
Upstream, the company uses its expertise in semiconductor materials to develop substrates made from gallium nitride (GaN), the base material used in LEDs.
Downstream, Soitec is developing a range of industrial partnerships to commercialize new professional lighting solutions[ buzzword ] (urban, office and transport infrastructure lighting).
Soitec is developing numerous technologies for its different sectors of activity.
Developed by CEA-Leti in collaboration with Soitec, [6] this technology has been patented by researcher Michel Bruel. [7] It makes possible the transfer of a thin layer of monocristalline material from a donor substrate to another by combining ion implantation and bonding by molecular adhesion. Soitec uses Smart Cut™ technology to mass-produce SOI wafers. Compared with classic bulk silicon, SOI enables a significant reduction in energy leakage in the substrate, and improves the performance of the circuit in which it is used.
The technology involves the transfer of partially or fully processed wafers onto other wafers. It can be adapted to wafer diameters of 150 mm to 300 mm and is compatible with a wide variety of substrates, such as silicon, glass and sapphire.
Smart Stacking™ technology is used for back-side illuminated image sensors, where it improves sensitivity and enables a smaller pixel size, as well as in smartphone radio-frequency circuits. It also opens new doors to 3D integration.
Soitec has epitaxy expertise in III-IV materials across the following fields: molecular beam epitaxy, metal organic vapor phase epitaxy and hydride vapor phase epitaxy. The company manufactures wafers of gallium arsenide (GaAs) and gallium nitride (GaN) for developing and manufacturing compound semiconductor systems.
These materials are used in Wi-Fi and high-frequency electronic devices (mobile telecommunications, infrastructure networks, satellite communications, fiber optic networks and radar detection), as well as in energy management and optoelectronic systems, such as LEDs.
Soitec has carried out three capital increases:
Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips. It is a multiple-step photolithographic and physico-chemical process during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.
In electronics, a wafer is a thin slice of semiconductor, such as a crystalline silicon, used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells.
STMicroelectronics NV is a multinational corporation and technology company of French-Italian origin. Incorporated in the Netherlands, its headquarters are in Plan-les-Ouates, Switzerland and it is listed on the New York Stock Exchange, the Euronext Paris and the Borsa Italiana in Milan. ST is the largest European semiconductor contract manufacturing and design company. The company resulted from the merger of two government-owned semiconductor companies in 1987: Thomson Semiconducteurs of France and SGS Microelettronica of Italy.
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In semiconductor manufacturing, silicon on insulator (SOI) technology is fabrication of silicon semiconductor devices in a layered silicon–insulator–silicon substrate, to reduce parasitic capacitance within the device, thereby improving performance. SOI-based devices differ from conventional silicon-built devices in that the silicon junction is above an electrical insulator, typically silicon dioxide or sapphire. The choice of insulator depends largely on intended application, with sapphire being used for high-performance radio frequency (RF) and radiation-sensitive applications, and silicon dioxide for diminished short-channel effects in other microelectronics devices. The insulating layer and topmost silicon layer also vary widely with application.
An epitaxial wafer is a wafer of semiconducting material made by epitaxial growth (epitaxy) for use in photonics, microelectronics, spintronics, or photovoltaics. The epi layer may be the same material as the substrate, typically monocrystaline silicon, or it may be a silicon dioxide (SoI) or a more exotic material with specific desirable qualities. The purpose of epitaxy is to perfect the crystal structure over the bare substrate below and improve the wafer surface's electrical characteristics, making it suitable for highly complex microprocessors and memory devices.
Smart cut is a technological process that enables the transfer of very fine layers of crystalline silicon material onto a mechanical support. It was invented by Michel Bruel of CEA-Leti, and was protected by US patent 5374564. The application of this technological procedure is mainly in the production of silicon-on-insulator (SOI) wafer substrates.
ASM is a Dutch headquartered multinational corporation that specializes in the design, manufacturing, sales and service of semiconductor wafer processing equipment for the fabrication of semiconductor devices. ASM's products are used by semiconductor manufacturers in front-end wafer processing in their semiconductor fabrication plants. ASM's technologies include atomic layer deposition, epitaxy, chemical vapor deposition and diffusion.
SunEdison, Inc. is a renewable energy company headquartered in the U.S. In addition to developing, building, owning, and operating solar power plants and wind energy plants, it also manufactures high-purity polysilicon, monocrystalline silicon ingots, silicon wafers, solar modules, solar energy systems, and solar module racking systems. Originally a silicon-wafer manufacturer established in 1959 as the Monsanto Electronic Materials Company, the company was sold by Monsanto in 1989.
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CEA-Leti is a research institute for electronics and information technologies, based in Grenoble, France. It is one of the world's largest organizations for applied research in microelectronics and nanotechnology. It is located within the CEA Grenoble center of the French Alternative Energies and Atomic Energy Commission (CEA).
Tower Semiconductor Ltd. is an Israeli company that manufactures integrated circuits using specialty process technologies, including SiGe, BiCMOS, Silicon Photonics, SOI, mixed-signal and RFCMOS, CMOS image sensors, non-imaging sensors, power management (BCD), and non-volatile memory (NVM) as well as MEMS capabilities. Tower Semiconductor also owns 51% of TPSCo, an enterprise with Nuvoton Technology Corporation Japan (NTCJ).
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