List of Intel Core processors

Last updated

The latest badge promoting the Intel Core branding. Intel Core 2023 logo.png
The latest badge promoting the Intel Core branding.

The following is a list of Intel Core processors. This includes the original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture, as well as Core 2 (Solo/Duo/Quad/Extreme), Core i3, Core i5, Core i7, Core i9, Core M (m3/m5/m7), Core 3, Core 5 and Core 7 branded processors.

Contents

Desktop processors

Release timeline
Desktop processors
2008 Nehalem microarchitecture (1st generation)
2009
2010 Westmere microarchitecture (1st generation)
2011 Sandy Bridge microarchitecture (2nd generation)
2012 Ivy Bridge microarchitecture (3rd generation)
2013 Haswell microarchitecture (4th generation)
2014
2015 Broadwell microarchitecture (5th generation)
Skylake microarchitecture (6th generation)
2016
2017 Kaby Lake microarchitecture (7th generation)
Coffee Lake microarchitecture (8th generation)
2018
2019
2020 Comet Lake microarchitecture (10th generation)
2021 Rocket Lake (11th generation)
2022 Alder Lake (12th generation)
2023 Raptor Lake (13th generation)

Core 2

Front side of an Intel Core 2 Duo T7500 Processor 2 Duo T7500 Processor.jpg
Front side of an Intel Core 2 Duo T7500 Processor

"Allendale" (65 nm, 800 MT/s)

ModelsSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release datePart
number(s)
Release
price (USD)
Core 2 Duo E4300
  • SL9TB (L2)
  • SLA99 (M0)
  • SLA5G
21.8 GHz2 MB 800 MT/s0.85–1.5 V65 W LGA 775 January 2007
  • HH80557PG0332M
  • BX80557E4300
$163
Core 2 Duo E4400
  • SLA3F (L2)
  • SLA98 (M0)
  • SLA5F
22 GHz2 MB800 MT/s10×0.85–1.5 V65 WLGA 775April 2007
  • HH80557PG0412M
  • BX80557E4400
$133
Core 2 Duo E4500
  • SLA95 (M0)
22.2 GHz2 MB800 MT/s11×0.85–1.5 V65 WLGA 775July 2007
  • HH80557PG0492M
  • BX80557E4500
$133
Core 2 Duo E4600
  • SLA94 (M0)
22.4 GHz2 MB800 MT/s12×1.162–1.312 V65 WLGA 775October 2007
  • HH80557PG0562M
  • BX80557E4600
$133
Core 2 Duo E4700
  • SLALT (G0)
22.6 GHz2 MB800 MT/s13×1.162–1.312 V65 WLGA 775March 2008
  • HH80557PG0642M
  • BX80557E4700
$133

^c Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

^d Note: The E4700 uses G0 Stepping which makes it a Conroe CPU.

"Conroe" (65 nm, 1066 MT/s)

ModelsSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release datePart
number(s)
Release
price (USD)
Core 2 Duo E6300
  • SL9SA (B2)
  • SL9TA (L2)
  • SLA2L (?)
  • SLA5E (?)
21.87 GHz2 MB1066 MT/s0.85–1.5 V65 WLGA 775July 2006
  • HH80557PH0362M
  • BX80557E6300
  • BX80557E6300T2
$183
Core 2 Duo E6320
  • SLA4U (B2)
21.87 GHz4 MB1066 MT/s0.85–1.5 V65 WLGA 775April 2007
  • HH80557PH0364M
  • BX80557E6320
$163
Core 2 Duo E6400
  • SL9S9 (B2)
  • SLA5D (?)
  • SL9T9 (L2)
  • SLA97 (M0)
22.13 GHz2 MB1066 MT/s0.85–1.5 V65 WLGA 775July 2006
  • HH80557PH0462M
  • BX80557E6400
$224
Core 2 Duo E6420
  • SLA4T (B2)
22.13 GHz4 MB1066 MT/s0.85–1.5 V65 WLGA 775April 2007
  • HH80557PH0464M
  • BX80557E6420
$183
Core 2 Duo E6600
  • SL9S8 (B2)
  • SL9ZL (B2)
22.4 GHz4 MB1066 MT/s0.85–1.5 V65 WLGA 775July 2006
  • HH80557PH0564M
  • BX80557E6600
$316
Core 2 Duo E6700
  • SL9S7 (B2)
  • SL9ZF (B2)
22.67 GHz4 MB1066 MT/s10×0.85–1.5 V65 WLGA 775July 2006
  • HH80557PH0674M
  • BX80557E6700
$530

^a Note: of the E6000 series processors, only models E6550, E6750, and E6850 support Intel's Trusted Execution Technology (TXT). [1]

^b Note: The L2 Stepping, and models with sSpec SL9ZL, SL9ZF, SLA4U, SLA4T, have better optimizations to lower idle power consumption from 22W to 12W. [2]

^c Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

"Conroe" (65 nm, 1333 MT/s)

ModelsSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release datePart
number(s)
Release
price (USD)
Core 2 Duo E6540
  • SLAA5 (G0)
22.33 GHz4 MB1333 MT/s0.85–1.5 V65 WLGA 775July 2007
  • HH80557PJ0534M
$163
Core 2 Duo E6550
  • SLA9X (G0)
  • SLAAT (?)
22.33 GHz4 MB1333 MT/s0.85–1.5 V65 WLGA 775July 2007
  • HH80557PJ0534MG
  • BX80557E6550
  • BX80557E6550R
$163
Core 2 Duo E6750
  • SLA9V (G0)
  • SLAAR (?)
22.67 GHz4 MB1333 MT/s0.85–1.5 V65 WLGA 775July 2007
  • HH80557PJ0674MG
  • BX80557E6750
  • BX80557E6750R
$183
Core 2 Duo E6850
  • SLA9U (G0)
23 GHz4 MB1333 MT/s0.85–1.5 V65 WLGA 775July 2007
  • HH80557PJ0804MG
  • BX80557E6850
$266

^a Note: of the E6000 series processors, only models E6550, E6750, and E6850 support Intel's Trusted Execution Technology (TXT). [1]

^b Note: The L2 Stepping, and models with sSpec SL9ZL, SL9ZF, SLA4U, SLA4T, have better optimizations to lower idle power consumption from 22W to 12W. [2]

^c Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

"Conroe-CL" (65 nm, 1066 MT/s)

ModelsSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release datePart
number(s)
Release
price (USD)
Core 2 Duo E6305
  • SLAGF
21.87 GHz2 MB 1066 MT/s65 W LGA 771
  • HH80557KH036F
Core 2 Duo E6405
  • SLAGG
22.13 GHz2 MB1066 MT/s65 W LGA 771
  • HH80557KH046F

"Conroe XE" (65 nm)

[3] [4]

These models feature an unlocked clock multiplier

ModelsSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release datePart
number(s)
Release
price (USD)
Core 2 Extreme X6800
  • SL9S5 (B2)
  • QPHV (B1)
22.93 GHz4 MB 1066 MT/s11×0.85–1.5 V
75 W
LGA 775 July 2006
  • HH80557PH0677M
  • BX80557X6800
$999
Core 2 Extreme X6900 [7] [8]
  • QTOM (B2)
  • SL9S4 (B2)
23.2 GHz4 MB 1066 MT/s12×0.85–1.5 V
75 W
LGA 775 N/A
  • HH80557PH0884M
N/A

"Kentsfield" (65 nm)

[9] [10]

ModelsSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release datePart
number(s)
Release
price (USD)
Core 2 Quad Q6400 [12]
  • SL9UN (B3)
42.13 GHz2 × 4 MB 1066 MT/s0.8500–1.500 V
105 W
LGA 775
  • HH80562PH0468M
OEM
Core 2 Quad Q6600
  • SL9UM (B3)
  • SLACR (G0)
42.4 GHz2 × 4 MB1066 MT/s0.8500–1.500 V
  • 105 W
  • 95 W
LGA 775January 2007
  • HH80562PH0568M
  • BX80562Q6600
  • BXC80562Q6600
$851
Core 2 Quad Q6700
  • SLACQ (G0)
42.67 GHz2 × 4 MB1066 MT/s10×0.8500–1.500 V
105 W
LGA 775July 2007
  • HH80562PH0678M
  • BX80562Q6700
  • BXC80562Q6700
$530

"Kentsfield XE" (65 nm)

[13]

These models feature an unlocked clock multiplier

ModelsSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release datePart
number(s)
Release
price (USD)
Core 2 Extreme QX6700
  • SL9UL (B3)
42.67 GHz2 × 4 MB 1066 MT/s10×0.8500–1.500 V
130 W
LGA 775 November 2006
  • HH80562PH0678M
$999
Core 2 Extreme QX6800
  • SL9UK (B3)
  • SLACP (G0)
42.93 GHz2 × 4 MB1066 MT/s11×0.8500–1.500 V
130 W
LGA 775April 2007
  • HH80562PH0778M
  • HH80562XH0778M
$1199
Core 2 Extreme QX6850
  • SLAFN (G0)
43 GHz2 × 4 MB1333 MT/s0.8500–1.500 V
130 W
LGA 775July 2007
  • HH80562XJ0808M
$999

"Wolfdale-3M" (45 nm, 1066 MT/s)

ModelsSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release datePart
number(s)
Release
price (USD)
Core 2 Duo E7200
  • SLAPC (M0)
  • SLAVN (M0)
  • SLB9W (?)
22.53 GHz3 MB 1066 MT/s9.5×0.85–1.3625 V65 W LGA 775 April 2008
  • EU80571PH0613M
  • BX80571E7200
$133
Core 2 Duo E7300
  • SLAPB (M0)
  • SLB9X (R0)
  • SLGA9 (R0)
22.67 GHz3 MB1066 MT/s10×0.85–1.3625 V65 WLGA 775August 2008
  • EU80571PH0673M
  • AT80571PH0673M
  • BX80571E7300
$133
Core 2 Duo E7400
  • SLB9Y (R0)
  • SLGQ8 (R0)
  • SLGW3 (R0, with VT)
22.8 GHz3 MB1066 MT/s10.5×0.85–1.3625 V65 WLGA 775October 2008
  • AT80571PH0723M
  • AT80571PH0723ML
  • BX80571E7400
$133
Core 2 Duo E7500
  • SLB9Z (R0)
  • SLGTE (R0, with VT)
22.93 GHz3 MB1066 MT/s11×0.85–1.3625 V65 WLGA 775January 2009
  • AT80571PH0773M
  • AT80571PH0773ML
  • BX80571E7500
$133
Core 2 Duo E7600
  • SLGTD (R0, with VT)
23.07 GHz3 MB1066 MT/s11.5×0.85–1.3625 V65 WLGA 775May 2009
  • AT80571PH0833ML
  • BX80571E7600
$133

"Wolfdale" (45 nm, 1333 MT/s)

ModelsSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release datePart
number(s)
Release
price (USD)
Core 2 Duo E8190
  • SLAQR (C0)
22.67 GHz6 MB 1333 MT/s0.85–1.3625 V65 W LGA 775 January 2008
  • EU80570PJ0676MN
$163
Core 2 Duo E8200
  • SLAPP (C0)
22.67 GHz6 MB1333 MT/s0.85–1.3625 V65 WLGA 775January 2008
  • EU80570PJ0676M
  • BX80570E8200
$163
Core 2 Duo E8290 [15]
  • SLAQQ (?)
22.83 GHz6 MB1333 MT/s8.5×0.85–1.3625 V65 WLGA 775 ?
  • EU80570PJ0736MN
 ?
Core 2 Duo E8300
  • SLAPJ (C0)
  • SLAPN (C0)
22.83 GHz6 MB1333 MT/s8.5×0.85–1.3625 V65 WLGA 775April 2008
  • EU80570AJ0736M
  • EU80570PJ0736M
$163
Core 2 Duo E8400
  • SLAPL (C0)
  • SLB9J (E0)
23 GHz6 MB1333 MT/s0.85–1.3625 V65 WLGA 775January 2008
  • EU80570PJ0806M
  • AT80570PJ0806M
  • BX80570E8400
$183
Core 2 Duo E8500
  • SLAPK (C0)
  • SLB9K (E0)
23.17 GHz6 MB1333 MT/s9.5×0.85–1.3625 V65 WLGA 775January 2008
  • EU80570PJ0876M
  • AT80570PJ0876M
  • BX80570E8500
$266
Core 2 Duo E8600
  • SLB9L (E0)
23.33 GHz6 MB1333 MT/s10×0.85–1.3625 V65 WLGA 775August 2008
  • AT80570PJ0876M
  • BX80570E8600
$266
Core 2 Duo E8700
  • SLB9E (E0)
23.5 GHz6 MB1333 MT/s10.5×0.85–1.3625 V65 WLGA 775December 2009
  • AT80570PJ1006M(OEM)
NA

a Note: The E8190 and E8290 do not support Intel VT-d.

See also: Versions of the same Wolfdale core in an LGA 771 are available under the Dual-Core Xeon brand.

"Yorkfield-6M" (45 nm)

ModelsSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release datePart
number(s)
Release
price (USD)
Core 2 Quad Q8200
  • SLB5M (M1)
  • SLG9S (R0)
42.33 GHz2 × 2 MB 1333 MT/s0.85–1.3625 V
95 W
LGA 775 August 2008
  • EU80580PJ0534MN
  • AT80580PJ0534MN
$224
Core 2 Quad Q8200S
  • SLG9T (R0)
  • SLGSS (R0, with Intel VT-x)
42.33 GHz2 × 2 MB1333 MT/s0.85–1.3625 V
65 W
LGA 775January 2009
  • AT80580AJ0534MN
  • AT80580AJ0534ML
$245
Core 2 Quad Q8300
  • SLB5W (R0)
  • SLGUR (R0, with Intel VT-x)
42.5 GHz2 × 2 MB1333 MT/s7.5×0.85–1.3625 V
95 W
LGA 775November 2008
  • AT80580PJ0604MN
  • AT80580PJ0604ML
$224
Core 2 Quad Q8400
  • SLGT6 (R0, with Intel VT-x)
42.67 GHz2 × 2 MB1333 MT/s0.85–1.3625 V
95 W
LGA 775April 2009
  • AT80580PJ0674ML
$183
Core 2 Quad Q8400S
  • SLGT7 (R0, with Intel VT-x)
42.67 GHz2 × 2 MB1333 MT/s0.85–1.3625 V
65 W
LGA 775April 2009
  • AT80580AJ0674ML
$245
Core 2 Quad Q9300
  • SLAMX (M0)
  • SLAWE (M1)
42.5 GHz2 × 3 MB1333 MT/s7.5×0.85–1.3625 V
95 W
LGA 775March 2008
  • EU80580PJ0606M
$266
Core 2 Quad Q9400
  • SLB6B (R0)
42.67 GHz2 × 3 MB1333 MT/s0.85–1.3625 V
95 W
LGA 775August 2008
  • AT80580PJ0676M
$266
Core 2 Quad Q9400S
  • SLG9U (R0)
42.67 GHz2 × 3 MB1333 MT/s0.85–1.3625 V
65 W
LGA 775January 2009
  • AT80580AJ0676M
$320
Core 2 Quad Q9500
  • SLGZ4 (R0)
42.83 GHz2 × 3 MB1333 MT/s8.5×0.85–1.3625 V
95 W
LGA 775January 2010
  • AT80580PJ0736ML
$183
Core 2 Quad Q9505
  • SLGYY (R0)
42.83 GHz2 × 3 MB1333 MT/s8.5×0.85–1.3625 V
95 W
LGA 775August 2009
  • AT80580PJ0736MG
$213
Core 2 Quad Q9505S
  • SLGYZ (R0)
42.83 GHz2 × 3 MB1333 MT/s8.5×0.85–1.3625 V
65 W
LGA 775August 2009
  • AT80580AJ0736MG
$277

a Note: Q8200, Q8200S, Q8300 SLB5W does not support Intel VT-x.

b Note: Q8200, Q8200S, Q8300, Q8400, Q8400S, Q9500 does not support Intel VT-d.

c Note: Q8200, Q8200S, Q8300, Q8400, Q8400S does not support TXT.

Yorkfield (45 nm)

ModelsSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release datePart
number(s)
Release
price (USD)
Core 2 Quad Q9450
  • SLAN6 (C0)
  • SLAWR (C1)
42.67 GHz2 × 6 MB 1333 MT/s0.85–1.3625 V
95 W
LGA 775 March 2008
  • EU80569PJ067N
$316
Core 2 Quad Q9550
  • SLAN4 (C0)
  • SLAWQ (C1)
  • SLB8V (E0)
42.83 GHz2 × 6 MB1333 MT/s8.5×0.85–1.3625 V
95 W
LGA 775March 2008
  • EU80569PJ073N
  • AT80569PJ073N
$530
Core 2 Quad Q9550S
  • SLGAE (E0)
42.83 GHz2 × 6 MB1333 MT/s8.5×0.85–1.3625 V
65 W
LGA 775January 2009
  • AT80569AJ073N
$369
Core 2 Quad Q9650
  • SLB8W (E0)
43 GHz2 × 6 MB1333 MT/s0.85–1.3625 V
95 W
LGA 775August 2008
  • AT80569PJ080N
  • BX80569Q9650
$530

"Yorkfield XE" (45 nm)

ModelsSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release datePart
number(s)
Release
price (USD)
Core 2 Extreme QX9650
  • SLAN3 (C0)
  • SLAWN (C1)
43 GHz2 × 6 MB 1333 MT/s0.85–1.3625 V
130 W
LGA 775 November 2007 [20]
  • EU80569XJ080NL
  • BX80569QX9650
$999
Core 2 Extreme QX9750 [22]
  • QJEE (E0)
  • SLBBU (E0)
43.17 GHz2 × 6 MB1333 MT/s9.5×0.85–1.3625 V
130 W
LGA 775N/A
  • AT80569XL087NL
N/A
Core 2 Extreme QX9770
  • SLAN2 (C0)
  • SLAWM (C1)
43.2 GHz2 × 6 MB1600 MT/s0.85–1.3625 V
136 W
LGA 775March 2008
  • EU80569XL088NL
  • BX80569QX9770
$1399
Core 2 Extreme QX9775
  • SLANY (C0)
43.2 GHz2 × 6 MB1600 MT/s0.85–1.35 V
150 W
LGA 771March 2008
  • EU80574XL088N
  • BX80574QX9775
$1499

Core i (1st gen)

Lynnfield

Common features:

  • Socket: LGA 1156.
  • All the CPUs support dual-channel DDR3 RAM at up to 1333  MT/s speed.
  • All CPU models provide 16 lanes of PCIe 2.0.
  • All CPUs feature a DMI 1.0 bus to the chipset (PCH).
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 45 nm.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Smart
Cache
TDP Release
date
MSRP
BaseTurbo
Core i7 880 4 (8)3.063.738 MB95 WMay 2010US $583
875K 2.933.60US $342
870 September 2009US $562
870S 2.6782 WJuly 2010US $351
860 2.803.4695 WSeptember 2009US $284
860S 2.5382 WJanuary 2010US $337
Core i5 760 4 (4)2.803.3395 WJuly 2010US $205
750 2.663.20September 2009US $196
750S 2.4082 WJanuary 2010US $259

Bloomfield

Common features:

  • Socket: LGA 1366.
  • All the CPUs support triple-channel DDR3 RAM, at up to 1066  MT/s speed.
  • PCIe lanes are provided by the northbridge on the motherboard rather than by the CPU.
  • All CPUs feature a QPI bus to the chipset (northbridge).
    • Bus speed is 4.8  GT/s on all the processors except for the Extreme Edition models, which run at 6.4 GT/s.
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 45 nm.
  • Extreme Edition processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Smart
Cache
TDP Release
date
MSRP
BaseTurbo
Core i7 975 Extreme Edition 4 (8)3.333.608 MB130 WJune 2009US $999
965 Extreme Edition 3.203.46November 2008
960 October 2009US $562
950 3.063.33June 2009
940 2.933.20November 2008
930 2.803.06February 2010US $294
920 2.662.93November 2008US $284

Clarkdale

Common features:

  • Socket: LGA 1156.
  • All the CPUs support dual-channel DDR3 RAM, at up to 1333  MT/s speed.
  • All CPU models provide 16 lanes of PCIe 2.0.
  • All CPUs feature a DMI 1.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 32 nm.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
MSRP
BaseTurboModelClock (MHz)
Core i5 680 2 (4)3.603.86 HD Graphics 7334 MB73 WApril 2010US $294
670 3.463.73January 2010US $284
661 3.333.6090087 WUS $196
660 73373 W
655K 3.203.46May 2010US $216
650 January 2010US $176
Core i3 560 3.33August 2010US $138
550 3.20May 2010
540 3.06January 2010US $133
530 2.93US $113

Gulftown

Common features:

  • Socket: LGA 1366.
  • All the CPUs support triple-channel DDR3 RAM, at up to 1066  MT/s speed.
  • PCIe lanes are provided by the northbridge on the motherboard rather than by the CPU.
  • All CPUs feature a QPI bus to the chipset (northbridge).
    • Bus speed is 4.8  GT/s on all the processors except for the X-suffix models, which run at 6.4 GT/s.
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 32 nm.
  • X-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Smart
Cache
TDP Release
date
MSRP
BaseTurbo
Core i7 990X 6 (12)3.463.7312 MB130 WFebruary 2011US $999
980X 3.333.60March 2010
980 June 2011US $583
970 3.203.46July 2010US $885

Core i (2nd gen)

Sandy Bridge-DT

Common features:

  • Socket: LGA 1155.
  • All the CPUs support dual-channel DDR3 RAM, at up to 1333  MT/s speed.
  • All CPU models provide 16 lanes of PCIe 2.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 32 nm.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
  • i3-2120, i5-2400, and i7-2600 are available as embedded processors.
  • The Core i3-2102, once upgraded via Intel Upgrade Service, operates at 3.6 GHz, has 3 MB L3 cache and is recognized as Core i3-2153.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
MSRP
BaseTurboModelClock (MHz)
Core i7 2700K 4 (8)3.53.9 HD 3000 850–13508 MB95 WOctober 2011US $332
2600K 3.43.8January 2011US $317
2600 HD 2000 US $294
2600S 2.865 WUS $306
Core i5 2550K 4 (4)3.46 MB95 WJanuary 2012US $225
2500K 3.33.7HD 3000850–1100January 2011US $216
2500 HD 2000US $205
2500S 2.765 WUS $216
2500T 2.33.3650–125045 W
2450P 3.23.595 WJanuary 2012US $195
2400 3.13.4HD 2000850–1100January 2011US $184
2405S 2.53.3HD 300065 WMay 2011US $205
2400S HD 2000January 2011US $195
2390T 2 (4)2.73.5650–11003 MB35 WFebruary 2011
2380P 4 (4)3.13.46 MB95 WJanuary 2012US $177
2320 3.03.3HD 2000850–1100September 2011
2310 2.93.2May 2011
2300 2.83.1January 2011
Core i3 2130 2 (4)3.4850–11003 MB65 WSeptember 2011US $138
2125 3.3HD 3000US $134
2120 HD 2000February 2011US $138
2120T 2.6650–110035 WUS $127
2105 3.1HD 3000850–110065 WMay 2011US $134
2102 HD 2000Q2 2011US $127
2100 February 2011US $117
2100T 2.5650–110035 WUS $127

Core i (3rd gen)

Ivy Bridge-DT

Common features:

  • Socket: LGA 1155.
  • All the CPUs support dual-channel DDR3 RAM, at up to 1600  MT/s speed.
  • All CPU models provide 16 lanes of PCIe. i5 and up models support it at PCIe 3.0 speeds while i3 models support it at PCIe 2.0 speeds.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 22 nm.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
  • i3-3220, i5-3550S and i7-3770 are available as embedded processors.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
MSRP
BaseTurboModelClock (MHz)
Core i7 3770K 4 (8)3.53.9 HD 4000 650–11508 MB77 WApril 2012US $342
3770 3.4US $305
3770S 3.165 WUS $305
3770T 2.53.745 WUS $294
Core i5 3570K 4 (4)3.43.86 MB77 WUS $225
3570 HD 2500 June 2012US $205
3570S 3.165 W
3570T 2.33.345 WApril 2012
3550 3.33.777 W
3550S 3.065 W
3470 3.23.6650–110077 WJune 2012US $184
3475S 2.9HD 400065 WUS $201
3470S HD 2500US $184
3470T 2 (4)3 MB35 W
3450 4 (4)3.13.56 MB77 WApril 2012
3450S 2.865 W
3350P 3.13.369 WSeptember 2012US $177
3340 HD 2500650–105077 WSeptember 2013US $182
3340S 2.865 W
3330 3.03.277 WSeptember 2012
3335S2.7HD 400065 WUS $194
3330S HD 2500US $177
Core i3 3250 2 (4)3.53 MB55 WJune 2013US $138
3250T 3.035 W
3245 3.4HD 400055 WUS $134
3240 HD 2500September 2012US $138
3240T 2.935 W
3225 3.3HD 400055 WUS $134
3220 HD 2500US $117
3220T 2.835 W
3210 3.255 WJanuary 2013

Sandy Bridge-E

Common features:

  • Socket: LGA 2011.
  • All the CPUs support quad-channel DDR3-1600 RAM.
  • All CPU models provide 40 lanes of PCIe 2.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 32 nm.
  • K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Smart
Cache
TDP Release
date
MSRP
BaseTurbo
Core i7 3970X 6 (12)3.54.015 MB150 WNovember 2012US $999
3960X 3.33.9130 WNovember 2011
3930K 3.23.812 MBUS $583
3820 4 (8)3.63.810 MBFebruary 2012US $294

Core i (4th gen)

Haswell-DT

Common features:

  • Socket: LGA 1150.
  • All the CPUs support dual-channel DDR3 RAM at up to 1600  MT/s speed.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 22 nm.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
  • The following models are available as embedded processors: i3- 4330, 4350T, 4360, i5- 4570S, 4590T, 4590S, i7- 4770S, 4790S.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
MSRP
BaseTurboModelClock (MHz)
Core i7 4790K 4 (8)4.04.4 HD 4600 350–12508 MB88 WJune 2014US $350
4790 3.64.0350–120084 WMay 2014US $312
4790S 3.265 W
4790T 2.73.945 WUS $303
4785T 2.23.235 W
4770K 3.53.9350–125084 WJune 2013US $350
4771 350–1200September 2013US $320
4770 3.4June 2013US $312
4770S 3.165 WUS $305
4770T 2.53.745 WUS $303
4765T 2.03.035 W
Core i5 4690K 4 (4)3.53.96 MB88 WJune 2014US $242
4690 84 WMay 2014US $213
4690S 3.265 W
4690T 2.53.545 W
4670K 3.43.884 WJune 2013US $242
4670 US $213
4670S 3.165 W
4670T 2.33.345 W
4590 3.33.7350–115084 WMay 2014US $192
4590S 3.065 W
4590T 2.03.035 W
4570 3.23.684 WJune 2013
4570S 2.965 W
4570T 2 (4)200–11504 MB35 W
44704 (4)3.33.5350–11006 MB84 WMay 2014OEM
4460 3.23.4US $182
4460S 2.965 W
4460T 1.92.735 WMarch 2014
4440 3.13.384 WSeptember 2013
4440S 2.865 W
4430 3.03.284 WJune 2013
4430S 2.765 W
Core i3 4370 2 (4)3.8350–11504 MB54 WJuly 2014US $149
4370T 3.3200–115035 WMarch 2015US $138
4360 3.7350–115054 WMay 2014US $149
4360T 3.2200–115035 WJuly 2014US $138
4350 3.6350–115054 WMay 2014
4350T 3.1200–115035 W
4340 3.6350–115054 WSeptember 2013US $149
4330 3.5US $138
4330T 3.0200–115035 W
4170 3.7 HD 4400 350–11503 MB54 WMarch 2015US $117
4170T 3.2200–115035 W
4160 3.6350–115054 WJuly 2014
4160T 3.1200–115035 W
4150 3.5350–115054 WMay 2014
4150T 3.0200–115035 W
4130 3.4350–115054 WSeptember 2013US $122
4130T 2.9200–115035 W

Haswell-H

Common features:

  • Socket: BGA 1364 (soldered).
  • All the CPUs support dual-channel DDR3 RAM, at up to 1600  MT/s speed.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • In addition to the Smart Cache (L3 cache), Haswell-H CPUs also contain 128 MB of eDRAM acting as L4 cache.
  • Fabrication process: 22 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 4770R 4 (8)3.23.9 Iris Pro 5200 200–13006 MB65 WJune 2013
Core i5 4670R 4 (4)3.03.74 MB
4570R 2.73.2200–1150

Ivy Bridge-E

Common features:

  • Socket: LGA 2011.
  • All the CPUs support quad-channel DDR3-1866 RAM.
  • All CPU models provide 40 lanes of PCIe 3.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 22 nm.
  • K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Smart
Cache
TDP Release
date
MSRP
BaseTurbo
Core i7 4960X 6 (12)3.64.015 MB130 WSeptember 2013US $990
4930K 3.43.912 MBUS $555
4820K 4 (8)3.710 MBUS $310

Core i (5th gen)

Broadwell-H

Common features:

  • Socket: LGA 1150 for C-suffix processors, BGA 1364 soldered for R-suffix.
  • All the CPUs support dual-channel DDR3 RAM. C-suffix processors support it at speeds up to 1600  MT/s, while R-suffix support it at 1866 MT/s.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • In addition to the Smart Cache (L3 cache), Broadwell-H CPUs also contain 128 MB of eDRAM acting as L4 cache.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
MSRP
BaseTurboModelClock (MHz)
Core i7 5775R 4 (8)3.33.8 Iris Pro 6200 300–11506 MB65 WJune 2015OEM
5775C 3.7US $366
Core i5 5675R 4 (4)3.13.6300–11004 MBOEM
5675C US $276
5575R 2.83.3300–1050OEM

Haswell-E

Common features:

  • Socket: LGA 2011-3.
  • All the CPUs support quad-channel DDR4-2133 RAM.
  • i7-5820K provides 28 lanes of PCIe 3.0; i7-5930K and 5960X provide 40 lanes of PCIe 3.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 22 nm.
  • K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Smart
Cache
TDP Release
date
MSRP
BaseTurbo
Core i7 5960X 8 (16)3.03.520 MB140 WAugust 2014US $999
5930K 6 (12)3.53.715 MBUS $583
5820K 3.33.6US $389

Core i (6th gen)

Skylake-S

Common features:

  • Socket: LGA 1151.
  • All the CPUs support dual-channel DDR4-2133 or DDR3L-1600 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
MSRP
BaseTurboModelClock (MHz)
Core i7 6700K 4 (8)4.04.2 HD 530 350–11508 MB91 WAugust 2015US $339
6700 3.44.065 WSeptember 2015US $303
6700T 2.83.6350–110035 W
Core i5 6600K 4 (4)3.53.9350–11506 MB91 WAugust 2015US $243
6600 3.365 WSeptember 2015US $213
6600T 2.73.5350–110035 W
6500 3.23.6350–105065 WUS $192
6500T 2.53.1350–110035 W
6402P 2.83.4 HD 510 350–95065 WDecember 2015US $182
6400 2.73.3HD 530September 2015
6400T 2.22.835 W
Core i3 6320 2 (4)3.9350–11504 MB51 WUS $148
6300 3.8US $139
6300T 3.3350–95035 WUS $138
6100 3.7350–10503 MB51 WUS $117
6100T 3.2350–95035 W
6098P 3.6HD 510350–105054 WDecember 2015

Skylake-H

Common features:

  • Socket: BGA 1440 (soldered).
  • All the CPUs support dual-channel DDR4-2133 or DDR3L-1600 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • In addition to the Smart Cache (L3 cache), Skylake-H CPUs also contain 128 MB of eDRAM acting as L4 cache.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 6785R 4 (8)3.33.9 Iris Pro 580 350–11508 MB65 WMay 2016
Core i5 6685R 4 (4)3.23.86 MB
6585R 2.83.6350–1100

Broadwell-E

Common features:

  • Socket: LGA 2011-3.
  • All the CPUs support quad-channel DDR4-2400 RAM.
  • i7-6800K provides 28 lanes of PCIe 3.0; all other models provide 40 lanes of PCIe 3.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Smart
Cache
TDP Release
date
MSRP
BaseTurbo
Core i7 6950X 10 (20)3.03.525 MB140 WMay 2016US $1723
6900K 8 (16)3.23.720 MBUS $1089
6850K 6 (12)3.63.815 MBUS $617
6800K 3.4US $434

Core i (7th gen)

Kaby Lake-S

Common features:

  • Socket: LGA 1151.
  • All the CPUs support dual-channel DDR4-2400 or DDR3L-1600 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
MSRP
BaseTurboModelClock (MHz)
Core i7 7700K 4 (8)4.24.5 HD 630 350–11508 MB91 WJanuary 2017US $339
7700 3.64.265 WUS $303
7700T 2.93.835 W
Core i5 7600K 4 (4)3.84.26 MB91 WUS $242
7600 3.54.165 WUS $213
7600T 2.83.7350–110035 W
7500 3.43.865 WUS $192
7500T 2.73.335 W
7400 3.03.5350–100065 WUS $182
7400T 2.43.035 W
Core i3 7350K 2 (4)4.2350–11504 MB60 WUS $168
7320 4.151 WUS $157
7300 4.0US $147
7300T 3.5350–110035 W
7100 3.93 MB51 WUS $117
7100T 3.435 W

Skylake-X

Common features:

  • Socket: LGA 2066.
  • All the CPUs support quad-channel DDR4-2400 RAM. Models i7-7820X and above support it up to 2666  MT/s speeds.
  • i7 models provide 28 lanes of PCIe 3.0; i9 models provide 44 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Smart
Cache
TDP Release
date
MSRP
BaseTurbo
2.0
Turbo
3.0
Core i9 7980XE 18 (36)2.64.24.424.75 MB165 WSeptember 2017US $1999
7960X 16 (32)2.822 MBUS $1699
7940X 14 (28)3.14.319.25 MBUS $1399
7920X 12 (24)2.916.5 MB140 WAugust 2017US $1199
7900X 10 (20)3.34.513.75 MBJune 2017US $989
Core i7 7820X 8 (16)3.611 MBUS $599
7800X 6 (12)3.54.08.25 MBUS $389

Kaby Lake-X

Common features:

  • Socket: LGA 2066.
  • All the CPUs support dual-channel DDR4-2666 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • X-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Smart
Cache
TDP Release
date
MSRP
BaseTurbo
Core i7 7740X 4 (8)4.34.58 MB112 WJune 2017US $339
Core i5 7640X 4 (4)4.04.26 MBUS $242

Core i (8th gen)

Coffee Lake-S

Common features:

  • Socket: LGA 1151-2.
  • All the CPUs support dual-channel DDR4 RAM at up to 2400  MT/s speed. Models i5 and up support it at up to 2666 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
MSRP
BaseTurboModelClock (MHz)
Core i7 8086K 6 (12)4.05.0 UHD 630 350–120012 MB95 WJune 2018US $425
8700K 3.74.7October 2017US $359
8700 3.24.665 WUS $303
8700T 2.44.035 WApril 2018
Core i5 8600K 6 (6)3.64.3350–11509 MB95 WOctober 2017US $257
8600 3.165 WApril 2018US $213
8600T 2.33.735 W
8500 3.04.1350–110065 WUS $192
8500T 2.13.535 W
8400 2.84.0350–105065 WOctober 2017US $182
8400T 1.73.335 WApril 2018
Core i3 8350K 4 (4)4.0350–11508 MB91 WOctober 2017US $168
8300 3.762 WApril 2018US $138
8300T 3.2350–110035 W
8100 3.66 MB65 WOctober 2017US $117
8100FJanuary 2019
8100T 3.1UHD 630350–110035 WApril 2018

Core i (9th gen)

Coffee Lake-R

Common features:

  • Socket: LGA 1151-2.
  • All the CPUs support dual-channel DDR4 RAM at up to 2400  MT/s speed. Models i5 and up support it at up to 2666 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
  • i9-9900KS has all-core boost clock of 5.0 GHz.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
MSRP
BaseTurboModelClock (MHz)
Core i9 9900KS 8 (16)4.05.0 UHD 630 350–120016 MB127 WOctober 2019US $524
9900K 3.695 WOctober 2018US $488
9900KF January 2019US $463
9900 3.1UHD 630350–120065 WApril 2019US $439
9900T 2.14.435 W
Core i7 9700K 8 (8)3.64.912 MB95 WOctober 2018US $374
9700KF January 2019
9700 3.04.7UHD 630350–120065 WApril 2019US $323
9700F
9700T 2.04.3UHD 630350–120035 W
Core i5 9600K 6 (6)3.74.6350–11509 MB95 WOctober 2018US $262
9600KF January 2019US $263
9600 3.1UHD 630350–115065 WApril 2019US $213
9600T 2.33.935 W
9500 3.04.2350–110065 WUS $192
9500F
9500T 2.23.7UHD 630350–110035 W
9400 2.94.1350–105065 WJanuary 2019US $182
9400F
9400T 1.83.4UHD 630350–105035 WApril 2019
Core i3 9350K 4 (4)4.04.6350–11508 MB91 WUS $173
9350KF January 2019
9320 3.74.4UHD 630350–115062 WApril 2019US $154
9300 4.3US $143
9300T 3.23.8350–110035 W
9100 3.64.26 MB65 WUS $122
9100F
9100T 3.13.7UHD 630350–110035 W

Skylake-X (9xxx)

Common features:

  • Socket: LGA 2066.
  • All the CPUs support quad-channel DDR4-2666 RAM.
  • All CPU models provide 44 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Smart
Cache
TDP Release
date
MSRP
BaseTurbo
2.0
Turbo
3.0
Core i99990XE [23] 14 (28)4.05.05.019.25 MB255 WJanuary 2019OEM
9980XE 18 (36)3.04.44.524.75 MB165 WQ4 2018US $1979
9960X 16 (32)3.122 MBUS $1684
9940X 14 (28)3.319.25 MBUS $1387
9920X 12 (24)3.5US $1189
9900X 10 (20)US $989
9820X 3.34.14.216.5 MBUS $889
Core i7 9800X 8 (16)3.84.44.5November 2018US $589

Core i (10th gen)

Comet Lake-S

Common features:

  • Socket: LGA 1200.
  • All the CPUs support dual-channel DDR4 RAM at up to 2666  MT/s speed. Models i7 and up support it at up to 2933 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
  • i9 and i7 models support Turbo Boost 3.0, while i5 and i3 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
MSRP
BaseTurboTVBModelClock (MHz)
Core i9 10900K 10 (20)3.75.25.3 UHD 630 350–120020 MB125 WApril 2020US $488
10900KF US $472
10910 3.65.0UHD 630350–1200Q3 2020OEM
10900 2.85.15.265 WApril 2020US $439
10900F US $422
10900T 1.94.6UHD 630350–120035 WUS $439
10850K 3.65.15.2125 WJuly 2020US $453
Core i7 10700K 8 (16)3.85.116 MBMay 2020US $374
10700KF US $349
10700 2.94.8UHD 630350–120065 WUS $323
10700F US $298
10700T 2.04.5UHD 630350–120035 WUS $325
Core i5 10600K 6 (12)4.14.812 MB125 WApril 2020US $262
10600KF US $237
10600 3.3UHD 630350–120065 WUS $213
10600T 2.44.035 W
10500 3.14.5350–115065 WUS $192
10500T 2.33.835 W
10400 2.94.3350–110065 WUS $182
10400F US $157
10400T 2.03.6UHD 630350–110035 WUS $182
Core i3 10320 4 (8)3.84.6350–11508 MB65 WUS $154
10300 3.74.4US $143
10300T 3.03.9350–110035 W
10100 3.64.36 MB65 WUS $122
10100F October 2020US $97
10100T 3.03.8UHD 630350–110035 WApril 2020US $122

Comet Lake-S (refresh)

Released on the same day as the 11th gen Rocket Lake-S desktop processors.

Common features:

  • Socket: LGA 1200.
  • All the CPUs support dual-channel DDR4-2666 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • All models support Turbo Boost 2.0.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
MSRP
BaseTurboModelClock (MHz)
Core i5 10505 6 (12)3.24.6 UHD 630 350–120012 MB65 WMarch 2021US $192
Core i3 10325 4 (8)3.94.7350–11508 MBUS $154
10305 3.84.5US $143
10305T 3.04.0350–110035 W
10105 3.74.46 MB65 WUS $122
10105F US $97
10105T 3.03.9UHD 630350–110035 WUS $122

Cascade Lake-X (10xxx)

Common features:

  • Socket: LGA 2066.
  • All the CPUs support quad-channel DDR4-2933 RAM.
  • All CPU models provide 48 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Smart
Cache
TDP Release
date
MSRP
BaseTurbo
2.0
Turbo
3.0
Core i9 10980XE 18 (36)3.04.64.824.75 MB165 WOctober 2019US $979
10940X 14 (28)3.319.25 MBUS $784
10920X 12 (24)3.5US $689
10900X 10 (20)3.74.54.7US $590

Core i (11th gen)

Rocket Lake-S

Common features:

  • Socket: LGA 1200.
  • All the CPUs support dual-channel DDR4-3200 RAM. The Core i9 K/KF processors enable a 1:1 ratio of DRAM to memory controller by default at DDR4-3200, whereas the Core i9 non K/KF and all other CPUs listed below enable a 2:1 ratio of DRAM to memory controller by default at DDR4-3200 and a 1:1 ratio by default at DDR4-2933. [24]
  • All CPU models provide 20 lanes of PCIe 4.0.
  • All CPUs feature a DMI 3.0 8-lane bus to the chipset (PCH).
  • L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
  • L2 cache: 512 KB per core.
  • Fabrication process: 14 nm.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
  • i9 and i7 models support Turbo Boost 3.0, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
MSRP
BaseTurboTVBModelClock (MHz)
Core i9 11900K 8 (16)3.55.25.3 UHD 750 350–130016 MB125 WMarch 2021US $539
11900KF US $513
11900 2.55.15.2UHD 750350–130065 WUS $439
11900F US $422
11900T 1.54.9UHD 750350–130035 WUS $439
Core i7 11700K 3.65.0125 WUS $399
11700KF US $374
11700 2.54.9UHD 750350–130065 WUS $323
11700F US $298
11700T 1.44.6UHD 750350–130035 WUS $323
Core i5 11600K 6 (12)3.94.912 MB125 WUS $262
11600KF US $237
11600 2.84.8UHD 750350–130065 WUS $213
11600T 1.74.135 W
11500 2.74.665 WUS $192
11500T 1.53.9350–120035 W
11400 2.64.4 UHD 730 350–130065 WUS $182
11400F US $157
11400T 1.33.7UHD 730350–120035 WUS $182

Tiger Lake-B

Common features:

  • Socket: BGA 1787 (soldered).
  • All the CPUs support dual-channel DDR4-3200 RAM.
  • All CPU models provide 20 lanes of PCIe 4.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
  • L2 cache: 1.25 MB per core.
  • Fabrication process: 10 nm.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
  • These CPUs were sold to OEMs only.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i9 11900KB 8 (16)3.34.9 UHD Graphics
(32 EU)
350–145024 MB55–65 WMay 2021
Core i7 11700B 3.24.8
Core i5 11500B 6 (12)3.34.612 MB65 W
Core i3 11100B 4 (8)3.64.4UHD Graphics
(16 EU)
350–1400

Core i (12th gen)

Alder Lake-S

Common features:

  • Socket: LGA 1700.
  • All the CPUs support dual-channel DDR4-3200 or DDR5-4800 RAM.
  • All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 1.25 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores)
  • Fabrication process: Intel 7.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
  • i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.
Processor
branding
ModelP-core (performance)E-core (efficiency)Integrated GPU Smart
Cache
TDP Release
date
MSRP
Cores
(Threads)
Clock rate (GHz)Cores
(Threads)
Clock rate (GHz)ModelClock (MHz)BaseMax.
Turbo
BaseTurboTVBBaseTurbo
Core i9 12900KS 8 (16)3.45.35.58 (8)2.54.0 UHD 770 300–155030 MB150 W241 WApril 2022US $739
12900K 3.25.22.43.9125 WNovember 2021US $589
12900KF US $564
12900 2.45.11.83.8UHD 770300–155065 W202 WJanuary 2022US $489
12900F US $464
12900T 1.44.91.03.6UHD 770300–155035 W106 WUS $489
Core i7 12700K 3.65.04 (4)2.73.8300–150025 MB125 W190 WNovember 2021US $409
12700KF US $384
12700 2.14.91.63.6UHD 770300–150065 W180 WJanuary 2022US $339
12700F US $314
12700T 1.44.71.03.4UHD 770300–150035 W106 WUS $339
Core i5 12600K 6 (12)3.74.92.83.6300–145020 MB125 W150 WNovember 2021US $289
12600KF US $264
12600 3.34.8UHD 770300–145018 MB65 W117 WJanuary 2022US $223
12600T 2.14.635 W74 W
12500 3.065 W117 WUS $202
12500T 2.04.435 W74 W
12490F [25] 3.04.620 MB65 W117 WFebruary 2022CN ¥1599
12400 2.54.4UHD 770300–145018 MBJanuary 2022US $202
12400F US $192
12400T 1.84.2 UHD 730 350–145035 W74 WUS $202
Core i3 12300 4 (8)3.54.412 MB60 W89 WUS $143
12300T 2.34.235 W69 W
12100 3.34.3300–140060 W89 WUS $122
12100F 58 WUS $97
12100T 2.24.1UHD 730300–140035 W69 WUS $122

Core i (13th gen)

Raptor Lake-S

Common features:

  • Socket: LGA 1700.
  • All the CPUs support dual-channel DDR4-3200 or DDR5-5600 RAM.
  • All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core on i5-13600K/KF and above models, 1.25 MB per core on 13600 and below models.
    • E-cores: 4 MB per E-core cluster on i5-13600K/KF and above models, 2 MB per cluster on 13600 and below models (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
  • i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.
Processor
branding
ModelP-core (performance)E-core (efficiency)Integrated GPU Smart
Cache
TDP Release
date
MSRP
Cores
(Threads)
Clock rate (GHz)Cores
(Threads)
Clock rate (GHz)ModelClock (MHz)BaseMax.
Turbo
BaseTurboTVBBaseTurbo
Core i9 13900KS 8 (16)3.25.86.016 (16)2.44.3 UHD 770 300–165036 MB150 W253 WJanuary 2023US $689
13900K 3.05.75.82.2125 WOctober 2022US $589
13900KF US $564
13900 2.05.55.61.54.2UHD 770300–165065 W219 WJanuary 2023US $549
13900F US $524
13900T 1.15.30.83.9UHD 770300–165035 W106 WUS $549
Core i7 13790F 2.15.28 (8)1.54.133 MB65 W219 WFebruary 2023CN ¥2999
13700K 3.45.42.54.2UHD 770300–160030 MB125 W253 WOctober 2022US $409
13700KF US $384
13700 2.15.21.54.1UHD 770300–160065 W219 WJanuary 2023
13700F US $359
13700T 1.44.91.03.6UHD 770300–160035 W106 WUS $384
Core i5 13600K 6 (12)3.55.12.63.9300–150024 MB125 W181 WOctober 2022US $319
13600KF US $294
13600 2.75.02.03.7UHD 770300–155065 W154 WJanuary 2023US $255
13600T 1.84.81.33.435 W92 W
13500 2.51.83.565 W154 WUS $232
13500T 1.64.61.23.235 W92 W
13490F 2.54.84 (4)1.83.565 W148 WFebruary 2023CN ¥1599
13400 4.63.3 UHD 730 300–155020 MB65 W154 WJanuary 2023US $221
13400F 148 WUS $196
13400T 1.34.41.03.0UHD 730300–155035 W82 WUS $221
Core i3 13100 4 (8)3.44.5300–150012 MB60 W89 WUS $134
13100F US $109
13100T 2.54.2UHD 730300–150035 W69 WUS $134

Core i (14th gen)

Raptor Lake-S Refresh

Common features:

  • Socket: LGA 1700.
  • All the CPUs support dual-channel DDR4-3200 or DDR5-5600 RAM.
  • All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core.
    • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
  • K-suffix processors have an unlocked multiplier and can be overclocked.
  • i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.
Processor
branding
ModelP-core (performance)E-core (efficiency)Integrated GPU Smart
Cache
TDP Release
date
MSRP
Cores
(Threads)
Clock rate (GHz)Cores
(Threads)
Clock rate (GHz)ModelClock (MHz)BaseMax.
Turbo
BaseTurboTVBBaseTurbo
Core i9 14900KS 8 (16)3.25.96.216 (16)2.44.5 UHD 770 300–165036 MB150 W253 WMarch 2024US $689
14900K 5.86.04.4125 WOctober 2023US $589
14900KF US $564
14900 2.05.65.81.54.3UHD 770300–165065 W219 WJanuary 2024US $549
14900F US $524
14900T 1.15.50.93.7UHD 770300–165035 W106 WUS $549
Core i7 14790F 2.15.48 (8)1.54.265 W219 WChina only
14700K 3.45.612 (12)2.54.3UHD 770300–160033 MB125 W253 WOctober 2023US $409
14700KF US $384
14700 2.15.41.54.2UHD 770300–160065 W219 WJanuary 2024
14700F US $359
14700T 1.35.20.93.7UHD 770300–160035 W106 WUS $384
Core i5 14600K 6 (12)3.55.38 (8)2.64.0300–155024 MB125 W181 WOctober 2023US $319
14600KF US $294
14600 2.75.22.03.9UHD 770300–155065 W154 WJanuary 2024US $255
14600T 1.85.11.33.635 W92 W
14500 2.65.01.93.765 W154 WUS $232
14500T 1.74.81.23.435 W92 W
14490F 2.84.94 (4)2.13.765 W148 WChina only
14400 2.54.71.83.5 UHD 730 300–155020 MBUS $221
14400F US $196
14400T 1.54.51.13.2UHD 730300–155035 W82 WUS $221
Core i3 14100 4 (8)3.54.7300–150012 MB60 W110 WUS $134
14100F US $109
14100T 2.74.4UHD 730300–50035 W69 WUS $134

Mobile processors

Release timeline
Mobile processors
2009 Nehalem microarchitecture (1st generation)
2010 Westmere microarchitecture (1st generation)
2011 Sandy Bridge microarchitecture (2nd generation)
2012 Ivy Bridge microarchitecture (3rd generation)
2013 Haswell microarchitecture (4th generation)
2014
2015 Broadwell microarchitecture (5th generation)
Skylake microarchitecture (6th generation)
2016
2017 Kaby Lake microarchitecture (7th/8th generation)
2018 Coffee Lake microarchitecture (8th generation)
2019 Comet Lake microarchitecture (10th generation)
Ice Lake (10th generation)
2020 Tiger Lake (11th generation)
2021
2022 Alder Lake (12th generation)
2023 Raptor Lake (13th generation)

Core

Yonah

Model Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release dateRelease
price (USD)


Core Solo U1300 1.07 GHz2 MB 533 MT/s0.95–1.05 V
5.5 W
April 2006$241
Core Solo U1400 1.2 GHz2 MB533 MT/s0.95–1.05 V
5.5 W
Socket 479/FC-μBGAApril 2006$262
Core Solo U1500 1.33 GHz2 MB533 MT/s10×0.85–1.1 V
5.5 W
Socket 479/FC-μBGAJanuary 2007$262
Core Duo U2400 1.07 GHz2 MB 533 MT/s0.8–1.1 V
9 W
Socket 479/FC-μBGA June 2006$262
Core Duo U2500 1.2 GHz2 MB533 MT/s0.8–1.1 V
9 W
Socket 479/FC-μBGAJune 2006$289


Core Duo L2300 1.5 GHz2 MB 667 MT/s0.762–1.212 V
15 W
Socket 479/FC-μBGA January 2006$284
Core Duo L2400 1.67 GHz2 MB667 MT/s10×0.762–1.212 V
15 W
Socket 479/FC-μBGAJanuary 2006$316
Core Duo L2500 1.83 GHz2 MB667 MT/s11×0.762–1.212 V
15 W
Socket 479/FC-μBGASeptember 2006$316


Core Solo T12001.5 GHz2 MB 667 MT/s0.7625–1.3 V
27 W
Socket M July 2006
Core Solo T1250 1.73 GHz2 MB533 MT/s13×0.7625–1.3 V
31 W
Socket M
Core Solo T1300 1.67 GHz2 MB667 MT/s10×0.7625–1.3 V
27 W
  • Socket 479/FC-μBGA
  • Socket 479/FC-μBGA
  • Socket M
  • Socket M
January 2006$209
Core Solo T1350 1.87 GHz2 MB533 MT/s14×0.7625–1.3 V
31 W
Socket MJuly 2006
Core Solo T1400 1.83 GHz2 MB667 MT/s11×0.7625–1.3 V
27 W
  • Socket 479/FC-μBGA
  • Socket 479/FC-μBGA
  • Socket M
  • Socket M
May 2006$209
Core Solo T15002 GHz2 MB667 MT/s12×0.7625–1.3 V
27 W
  • Socket 479/FC-μBGA
  • Socket M
August 2006
Core Duo T2050 1.6 GHz2 MB 533 MT/s12×0.762–1.3 V
31 W
Socket M May 2006$140
Core Duo T2250 1.73 GHz2 MB533 MT/s13×0.762–1.3 V
31 W
Socket MMay 2006OEM
Core Duo T2300 1.67 GHz2 MB667 MT/s10×0.762–1.3 V
31 W
January 2006$241
Core Duo T2300E 1.67 GHz2 MB667 MT/s10×0.762–1.3 V
31 W
  • Socket M
  • Socket M
  • μFCBGA-479
  • μFCBGA-479
May 2006$209
Core Duo T2350 1.87 GHz2 MB533 MT/s14×0.762–1.3 V
31 W
Socket MOEM
Core Duo T2400 1.83 GHz2 MB667 MT/s11×0.762–1.3 V
  • 31 W
  • 31 W
  • 27 W
  • 27 W
  • Socket M
  • Socket M
  • Socket 479/FC-μBGA
  • Socket 479/FC-μBGA
January 2006$294
Core Duo T2450 2 GHz2 MB533 MT/s15×0.762–1.3 V
31 W
Socket MOEM
Core Duo T2500 2 GHz2 MB667 MT/s12×0.762–1.3 V
31 W
  • Socket M
  • Socket M
  • Socket 479/FC-μBGA
  • Socket 479/FC-μBGA
January 2006$423
Core Duo T2600 2.17 GHz2 MB667 MT/s13×0.762–1.3 V
31 W
  • Socket M
  • Socket M
  • Socket 479/FC-μBGA
  • Socket 479/FC-μBGA
January 2006$637
Core Duo T2700 2.33 GHz2 MB667 MT/s14×0.762–1.3 V
31 W
  • Socket M
  • Socket 479/FC-μBGA
June 2006$637

Core 2

Inside of old Sony VAIO laptop (VGN-C140G) Laptop-intel-core2duo-t5500.jpg
Inside of old Sony VAIO laptop (VGN-C140G)

"Merom-L" (65 nm)

ModelsSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release datePart
number(s)
Release
price (USD)
ultra-low voltage
Core 2 Solo ULV U2100
  • SLAGM (A1)
11.07 GHz1 MB 533 MT/s0.86–0.975 V
5.5 W
Micro-FCBGA September 2007
  • LE80537UE0041M
$241
Core 2 Solo ULV U2200
  • SLAGL (A1)
11.2 GHz1 MB533 MT/s0.86–0.975 V
5.5 W
Micro-FCBGASeptember 2007
  • LE80537UE0091M
$262

"Merom", "Merom-2M" (standard-voltage, 65 nm)

ModelsSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release datePart
number(s)
Release
price (USD)
Core 2 Duo T5200
  • SL9VP (B2)
21.6 GHz2 MB 533 MT/s12×0.95–1.175 V
34 W
Socket M October 2006
  • LF80537GE0252M
OEM
Core 2 Duo T5250
  • SLA9S (M0)
21.5 GHz2 MB667 MT/s0.95–1.175 V
35 W
Socket P Q2 2007
  • LF80537GF0212M
OEM
Core 2 Duo T5270
  • SLALK (M0)
21.4 GHz2 MB800 MT/s0.95–1.175 V
35 W
Socket POctober 2007
  • LF80537GG0172M
OEM
Core 2 Duo T5300
  • SL9WE (L2)
21.73 GHz2 MB533 MT/s13×0.95–1.175 V
34 W
Socket MQ1 2007
  • LF80537GE0302M
OEM
Core 2 Duo T5450
  • SLA4F (M0)
21.67 GHz2 MB667 MT/s10×0.95–1.175 V
35 W
Socket PQ2 2007
  • LF80537GF0282MT
OEM
Core 2 Duo T5470
  • SLAEB (M0)
21.6 GHz2 MB800 MT/s0.95–1.175 V
35 W
Socket PJuly 2007
  • LF80537GG0252M
OEM
Core 2 Duo T5500
  • SL9SH (B2)
  • SLGFK (G2)
  • SL9U4 (L2)
21.67 GHz2 MB667 MT/s10×0.95–1.175 V
34 W
Socket MAugust 28, 2006
  • LF80537GF0282M
$209
Core 2 Duo T5500
  • SL9SQ (B2)
  • SL9U8 (L2)
21.67 GHz2 MB667 MT/s10×0.95–1.175 V
34 W
BGA479August 2006
  • LE80537GF0282M
$209
Core 2 Duo T5550
  • SLA4E (M0)
21.83 GHz2 MB667 MT/s11×0.95–1.175 V
35 W
Socket PJanuary 2008
  • LF80537GF0342MT
OEM
Core 2 Duo T5600
  • SL9SG (B2)
  • SL9U3 (L2)
21.83 GHz2 MB667 MT/s11×0.95–1.175 V
34 W
Socket MAugust 2006
  • LF80537GF0342M
$241
Core 2 Duo T5600
  • SL9SP (B2)
  • SL9U7 (L2)
21.83 GHz2 MB667 MT/s11×0.95–1.175 V
34 W
BGA479August 2006
  • LE80537GF0342M
$241
Core 2 Duo T5670
  • SLAJ5 (M0)
21.8 GHz2 MB800 MT/s0.95–1.175 V
35 W
Socket PQ2 2008
  • LF80537GG0332MN
OEM
Core 2 Duo T5750
  • SLA4D (M0)
22 GHz2 MB667 MT/s12×0.95–1.175 V
35 W
Socket PJanuary 2008
  • LF80537GF0412M
OEM
Core 2 Duo T5800
  • SLB6E (M0)
22 GHz2 MB800 MT/s10×0.95–1.175 V
35 W
Socket PQ4 2008
  • LF80537GG041F
OEM
Core 2 Duo T5850 [27]
  • SLA4C (M0)
22.17 GHz2 MB667 MT/s13×0.95–1.175 V
35 W
Socket PQ4 2008
  • LF80537GF0482M
OEM
Core 2 Duo T5870
  • SLAZR (M0)
22 GHz2 MB800 MT/s10×0.95–1.175 V
35 W
Socket P2008
  • LF80537GG0412MN
OEM
Core 2 Duo T5900 [29]
  • SLB6D (M0)
22.2 GHz2 MB800 MT/s11×0.95–1.175 V
35 W
Socket PJuly 2008
  • LF80537GG049F
OEM
Core 2 Duo T7100
  • SLA4A (M0)
21.8 GHz2 MB800 MT/s0.95–1.175 V
35 W
  • Socket P
May 2007
  • LF80537GG0332M
$209
Core 2 Duo T7100
  • SLA3U (M1)
21.8 GHz2 MB800 MT/s0.95–1.175 V
35 W
  • FCBGA6
May 2007
  • LE80537GG0332M
$209
Core 2 Duo T7200
  • SL9SF (B2)
22 GHz4 MB667 MT/s12×0.95–1.175 V
34 W
  • Socket M
August 2006
  • LF80537GF0414M
$294
Core 2 Duo T7200
  • SL9SL (B2)
22 GHz4 MB667 MT/s12×0.95–1.175 V
34 W
  • FCBGA6
August 2006
  • LE80537GF0414M
$294
Core 2 Duo T7250
  • SLA49 (M0)
  • SLAXH (M0)
22 GHz2 MB800 MT/s10×0.95–1.175 V
35 W
  • Socket P
September 2007
  • LF80537GG0412M
$290
Core 2 Duo T7250
  • SLA3T (M1)
22 GHz2 MB800 MT/s10×0.95–1.175 V
35 W
  • FCBGA6
September 2007
  • LE80537GG0412M
$290
Core 2 Duo T7300
  • SLAMD (G0)
  • SLA45 (E1)
22 GHz4 MB800 MT/s10×0.95–1.175 V
35 W
  • Socket P
May 2007
  • LF80537GG0414M
  • LF80537GG0414M
$241
Core 2 Duo T7300
  • SLA3P (E1)
  • SLAMF (G0)
22 GHz4 MB800 MT/s10×0.95–1.175 V
35 W
  • FCBGA6
May 2007
  • LE80537GG0414M
$241
Core 2 Duo T7400
  • SL9SE (B2)
  • SLGFJ (G2)
22.17 GHz4 MB667 MT/s13×0.95–1.175 V
34 W
  • Socket M
August 2006
  • LF80537GF0484M
$423
Core 2 Duo T7400
  • SL9SK (B2)
  • SLGFV (G2)
22.17 GHz4 MB667 MT/s13×0.95–1.175 V
34 W
  • FCBGA6
August 2006
  • LE80537GF0484M
$423
Core 2 Duo T7500
  • SLA44 (E1)
  • SLAF8 (G0)
22.2 GHz4 MB800 MT/s11×0.95–1.175 V
35 W
  • Socket P
May 2007
  • LF80537GG0494M
$316
Core 2 Duo T7500
  • SLA3N (E1)
  • SLADM (G0)
22.2 GHz4 MB800 MT/s11×0.95–1.175 V
35 W
  • FCBGA6
May 2007
  • LE80537GG0494M
$316
Core 2 Duo T7600
  • SL9SD (B2)
22.33 GHz4 MB667 MT/s14×0.95–1.175 V
34 W
  • Socket M
August 2006
  • LF80537GF0534M
$637
Core 2 Duo T7600
  • SL9SJ (B2)
22.33 GHz4 MB667 MT/s14×0.95–1.175 V
34 W
  • FCBGA6
August 2006
  • LE80537GF0534M
$637
Core 2 Duo T7600G [31]
  • SL9U5 (B2)
22.33 GHz4 MB667 MT/s14×0.95–1.175 V
34 W
  • Socket M
December 2006
  • LF80537GF0534MU
Core 2 Duo T7700
  • SLA43 (E1)
  • SLAF7 (G0)
22.4 GHz4 MB800 MT/s12×0.95–1.175 V
35 W
  • Socket P
May 2007
  • LF80537GG0564M
$530
Core 2 Duo T7700
  • SLA3M (E1)
  • SLADL (G0)
22.4 GHz4 MB800 MT/s12×0.95–1.175 V
35 W
  • FCBGA6
May 2007
  • LE80537GG0564M
$530
Core 2 Duo T7800
  • SLAF6 (G0)
22.6 GHz4 MB800 MT/s13×0.95–1.175 V
35 W
  • Socket P
September 2007
  • LF80537GG0644ML
$530
Core 2 Duo T7800
  • SLA75 (G0)
22.6 GHz4 MB800 MT/s13×0.95–1.175 V
35 W
  • FCBGA6
September 2007
  • LE80537GG0644M
$530

See also: Versions of the same Merom-2M core with half the L2 cache disabled are available under the Pentium Dual-Core brand.

"Merom" (low-voltage, 65 nm)

ModelsSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release datePart
number(s)
Release
price (USD)
Core 2 Duo SL7100 [33]
  • SLAJD
  • SLAT4
21.2 GHz4 MB 800 MT/s
12 W
μFC-BGA 956
  • SY80537LG0094M
OEM
Core 2 Duo L7200
  • SL9SN (B2)
21.33 GHz4 MB667 MT/s0.9–1.2 V
17 W
FCBGA6Q1 2007
  • LE80537LF0144M
$284
Core 2 Duo L7300
  • SLA3S (E1)
21.4 GHz4 MB800 MT/s0.9–1.1 V
17 W
FCBGA6May 2007
  • LE80537LG0174M
$284
Core 2 Duo L7400
  • SL9SM (B2)
  • SLGFX (G2)
21.5 GHz4 MB667 MT/s0.9–1.2 V
17 W
FCBGA6Q1 2007
  • LE80537LF0214M
$316
Core 2 Duo L7500
  • SLA3R (E1)
  • SLAET (G0)
21.6 GHz4 MB800 MT/s0.9–1.1 V
17 W
FCBGA6May 2007
  • LE80537LG0254M
$316
Core 2 Duo SP7500 [34] [ failed verification ] [35]
  • SLAT2
  • SLAEV
21.6 GHz4 MB800 MT/s1.0–1.25 V
20 W
μFC-BGA 956
  • SY80537GG0254M
OEM
Core 2 Duo L7700
  • SLAES (G0)
21.8 GHz4 MB800 MT/s0.9–1.1 V
17 W
FCBGA6September 2007
  • LE80537LG0334M
$316
Core 2 Duo SP7700 [34] [ failed verification ]
  • SLALQ
  • SLALR
  • SLASZ
21.8 GHz4 MB800 MT/s1.0–1.25 V
20 W
μFC-BGA 956
  • SY80537GG0334M
  • SY80537GG0334ML
OEM

"Merom-2M" (ultra-low-voltage, 65 nm)

ModelsSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release datePart
number(s)
Release
price (USD)
Core 2 Duo U7500
  • SLA2V (L2)
  • SLAUT (M0)
21.07 GHz2 MB 533 MT/s0.8–0.975 V
10 W
FCBGA6 (Socket M)April 2007
  • LE80537UE0042M
$262
Core 2 Duo U7500
  • SLV3X (M0)
21.07 GHz2 MB533 MT/s0.8–0.975 V
10 W
FCBGA6 (Socket P)February 2008
  • LE80537UE0042ML
$262
Core 2 Duo U7600
  • SLA2U (L2)
  • SLAUS (M0)
21.2 GHz2 MB533 MT/s0.8–0.975 V
10 W
FCBGA6 (Socket M)April 2007
  • LE80537UE0092M
$289
Core 2 Duo U7600
  • SLV3W (M0)
21.2 GHz2 MB533 MT/s0.8–0.975 V
10 W
FCBGA6 (Socket P)April 2007
  • LE80537UE0092ML
$289
Core 2 Duo U7700
  • SLA6X (L2)
  • SLAUR (M0)
21.33 GHz2 MB533 MT/s10×0.8–0.975 V
10 W
FCBGA6 (Socket M)December 2007
  • LE80537UE0142M
$289
Core 2 Duo U7700
  • SLV3V (M0)
21.33 GHz2 MB533 MT/s10×0.8–0.975 V
10 W
FCBGA6 (Socket P)February 2008
  • LE80537UE0142ML
$289

"Merom XE" (65 nm)

These models feature an unlocked clock multiplier

ModelsSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release datePart
number(s)
Release
price (USD)
Core 2 Extreme X7800
  • SLA6Z (E1)
22.6 GHz4 MB 800 MT/s13×1.0375–1.3 V
44 W
Socket P July 2007
  • LF80537GG0644M
$851
Core 2 Extreme X7900
  • SLA33 (E1)
  • SLAF4 (G0)
22.8 GHz4 MB800 MT/s14×1.0375–1.3 V
44 W
Socket PAugust 2007
  • LF80537GG0724M
$851

"Penryn-L" (45 nm)

ModelsSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release datePart
number(s)
Release
price (USD)
Small Form Factor, ultra-low voltage
Core 2 Solo SU3300
  • SLGAR (M0)
  • SLGAJ (R0)
11.2 GHz3 MB 800 MT/s1.05–1.15 V
5.5 W
μFC-BGA 956 May 2008
  • AV80585UG0093M
$262
Core 2 Solo SU3500
  • SLGFM (R0)
11.4 GHz3 MB800 MT/s1.05–1.15 V
5.5 W
μFC-BGA 956Q2 2009
  • AV80585UG0173M
$262

"Penryn" (Apple iMac specific, 45 nm)

  • Die size: 107 mm2
  • The 2008 20" iMac used the E8135 and E8335 CPUs at a lower than specified clock frequency, explaining why the same model is used at different frequencies. This list shows the frequencies used by Apple.
  • Steppings: C0, E0
ModelsSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release datePart
number(s)
Release
price (USD)
Core 2 Duo E8135
  • SLAQA (C0)
22.4 GHz6 MB 1066 MT/s
44 W
Socket P April 2008
  • FF80576E8135
  • FF80576GH0676M
Core 2 Duo E8135
  • SLG8W (E0)
22.67 GHz6 MB1066 MT/s10×
44 W
Socket PMarch 2009
  • AW80576GH0676M
  • AW80576E8135
Core 2 Duo E8135
  • SLGED (E0)
22.67 GHz6 MB1066 MT/s10×
35 W
Socket PMarch 2009
  • AW80576GH0676M
Core 2 Duo E8235
  • SLAQB (C0)
22.8 GHz6 MB1066 MT/s10.5×
44 W
Socket PApril 2008
  • FF80576GH0726M
Core 2 Duo E8335
  • SLAQC (C0)
22.93 GHz6 MB1066 MT/s11×
44 W
Socket PApril 2008
  • FF80576GH0776M
Core 2 Duo E8335
  • SLGEB (E0)
22.93 GHz6 MB1066 MT/s11×1.0500–1.2250 V
35 W
Socket PMarch 2009
  • AW80576GH0776M
Core 2 Duo E8435
  • SLAQD (C0)
23.07 GHz6 MB1066 MT/s11.5×1.0500–1.2375 V
55 W
Socket PApril 2008
  • FF80576GH0836M
Core 2 Duo E8435
  • SLGEA (E0)
23.07 GHz6 MB1066 MT/s11.5×
44 W
Socket PMarch 2009
  • AW80576GH0836M

"Penryn", "Penryn-3M" (standard-voltage, 45 nm)

Note that models T8100, T8300, T9300, T9500 are Penryn processors designed for Santa Rosa Refresh platforms with maximum FSB of 800 MT/s, whereas the rest of the Penryn processors are designed for Montevina platforms that can go up to maximum FSB of 1066 MT/s.

Penryn processors support Dynamic Front Side Bus Throttling between 400–800MT/s.

ModelsSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release datePart
number(s)
Release
price (USD)
Core 2 Duo T6400
  • SLGJ4 (R0)
22 GHz2 MB 800 MT/s10×1.00–1.250 V
35 W
January 2009
  • AW80577GG0412MA
OEM
Core 2 Duo T6500
  • SLGF4 (R0)
22.1 GHz2 MB800 MT/s10.5×1.00–1.250 V
35 W
Socket PJanuary 2009
  • AW80577GG0452ML
  • AW80577GG0452MA
OEM
Core 2 Duo T6570
  • SLGLL (R0)
22.1 GHz2 MB800 MT/s10.5×1.00–1.250 V
35 W
Socket PQ3 2009
  • AW80577GG0452MH
OEM
Core 2 Duo T6600
  • SLGJ9 (R0)
  • SLGF5 (R0)
22.2 GHz2 MB800 MT/s11×1.00–1.250 V
35 W
Socket PJanuary 2009
  • AW80577GG0492MA
  • AW80577GG0492ML
OEM
Core 2 Duo T6670
  • SLGLK (R0)
  • SLGLJ (R0)
22.2 GHz2 MB800 MT/s11×1.00–1.250 V
35 W
Socket PQ3 2009
  • AW80577GG0492MH
OEM
Core 2 Duo T6900
  • SLGHZ (?)
22.5 GHz2 MB800 MT/s12.5×1.00–1.250 V
35 W
Socket P ?
  • AW80577GG0602MA
OEM
Core 2 Duo T6970
  • SLGLJ (R0)
22.5 GHz2 MB800 MT/s12.5×1.00–1.250 V
35 W
Socket P ?
  • AW80577GG0602MH
OEM
Core 2 Duo T8100
  • SLAP9 (M0)
  • SLAVJ (M0)
  • SLAYP (M0)
  • SLAYZ (C0)
  • SLAUU (C0)
22.1 GHz3 MB800 MT/s10.5×1.000–1.250 V
35 W
Socket PJanuary 2008
  • FF80577GG0453M (M0)
  • FF80577GG0453MN
  • FF80576GG0453M (C0)
  • BX80577T8100
$209
Core 2 Duo T8100
  • SLAPS (M0)
  • SLAXG (M0)
  • SLAPT (C0)
  • SLAZD (C0)
22.1 GHz3 MB800 MT/s10.5×1.000–1.250 V
35 W
FCBGA6January 2008
  • EC80577GG0453M (M0)
  • EC80576GG0453M (C0)
$209
Core 2 Duo T8300
  • SLAPA (M0)
  • SLAYQ (M0)
22.4 GHz3 MB800 MT/s12×1.00–1.250 V
35 W
Socket PJanuary 2008
  • FF80577GG0563M
  • BX80577T8300
$241
Core 2 Duo T8300
  • SLAPR (M0)
  • SLAPU (C0)
  • SLAZC (C0)
22.4 GHz3 MB800 MT/s12×1.00–1.250 V
35 W
FCBGA6January 2008
  • EC80577GG0563M (M0)
  • EC80576GG0563M (C0)
$241
Core 2 Duo T9300
  • SLAQG (C0)
  • SLAYY (C0)
22.5 GHz6 MB800 MT/s12.5×1.000–1.250 V
35 W
Socket PJanuary 2008
  • FF80576GG0606M
$316
Core 2 Duo T9300
  • SLAPV (C0)
  • SLAZB (C0)
22.5 GHz6 MB800 MT/s12.5×1.000–1.250 V
35 W
FCBGA6January 2008
  • EC80576GG0606M
$316
Core 2 Duo T9400
  • SLB46 (C0)
  • SLB4D (C0)
  • SLGE5 (E0)
22.53 GHz6 MB1066 MT/s9.5×1.050–1.162 V
35 W
Socket PJuly 2008
  • AW80576GH0616M
$316
Core 2 Duo T9400
  • SL3BX (C0)
  • SLGEK (E0)
22.53 GHz6 MB1066 MT/s9.5×1.050–1.162 V
35 W
FCBGA6July 2008
  • AV80576GH0616M
$316
Core 2 Duo T9500
  • SLAQH (C0)
  • SLAYX (C0)
22.6 GHz6 MB800 MT/s13×1.000–1.250 V
35 W
Socket PJanuary 2008
  • FF80576GG0646M
$530
Core 2 Duo T9500
  • SLAPW (C0)
  • SLAZA (C0)
  • SLB49 (C0)
  • SLB4A (C0)
22.6 GHz6 MB800 MT/s13×1.000–1.250 V
35 W
FCBGA6January 2008
  • EC80576GG0646M
  • AV80576SH0616M
$530
Core 2 Duo T9550
  • SLGE4 (E0)
22.67 GHz6 MB1066 MT/s10×1.050–1.212 V
35 W
Socket PDecember 2008
  • AW80576GH0676MG
$316
Core 2 Duo T9550
  • SLGEL (E0)
22.67 GHz6 MB1066 MT/s10×1.050–1.212 V
35 W
FCBGA6December 2008
  • AV80576GH0676MG
$316
Core 2 Duo T9600
  • SLB47 (C0)
  • SLG8N (C0)
  • SLG9F (E0)
22.8 GHz6 MB1066 MT/s10.5×1.050–1.162 V
35 W
Socket PJuly 2008
  • AW80576GH0726M
$530
Core 2 Duo T9600
  • SLB43 (C0)
  • SLGEM (E0)
22.8 GHz6 MB1066 MT/s10.5×1.050–1.162 V
35 W
FCBGA6July 2008
  • AV80576GH0726M
$530
Core 2 Duo T9800
  • SLGES (E0)
22.93 GHz6 MB1066 MT/s11×1.050–1.212 V
35 W
Socket PDecember 2008
  • AW80576GH0776MG
$530
Core 2 Duo T9800
  • SLGEP (E0)
22.93 GHz6 MB1066 MT/s11×1.050–1.212 V
35 W
FCBGA6December 2008
  • AV80576GH0776MG
$530
Core 2 Duo T9900
  • SLGEE (E0)
23.07 GHz6 MB1066 MT/s11.5×1.050–1.2125 V
35 W
Socket PApril 2009
  • AW80576GH0836MG
$530
Core 2 Duo T9900
  • SLGKH (E0)
23.07 GHz6 MB1066 MT/s11.5×1.050–1.2125 V
35 W
FCBGA6April 2009
  • AV80576GH0836MG
$530

"Penryn", "Penryn-3M" (medium-voltage, 45 nm)

ModelsSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release datePart
number(s)
Release
price (USD)
Core 2 Duo P7350
  • SLB44 (C0)
  • SLB53 (M0)
22 GHz3 MB 1066 MT/s7.5×1.00–1.250 V
25 W
Socket PMid 2008
  • AW80576GH0413M
  • AW80577SH0413M
OEM
Core 2 Duo P7350
  • SLG8E (C0)
  • SLGE3 (R0)
22 GHz3 MB 1066 MT/s7.5×1.00–1.250 V
25 W
FC-BGA478Mid 2008OEM
Core 2 Duo P7370
  • SLG8X (R0)
  • SLGF9 (R0)
22 GHz3 MB1066 MT/s7.5×1.00–1.250 V
25 W
Socket PJanuary 2009
  • AW80577SH0413M
  • AW80577SH0413ML
OEM
Core 2 Duo P7450
  • SLB45 (C0)
  • SLGF7 (R0)
  • SLB54 (M0)
  • SLB56 (M0)
22.13 GHz3 MB1066 MT/s1.00–1.250 V
25 W
Socket PJanuary 2009
  • AW80577SH0463M
  • AW80576GH0463M (C0)
OEM
Core 2 Duo P7450
  • SLGFF (C0)
22.13 GHz3 MB1066 MT/s1.00–1.250 V
25 W
FC-BGA478January 2009
  • AW80577P7450M (C0)
OEM
Core 2 Duo P7550
  • SLGF8 (R0)
22.27 GHz3 MB1066 MT/s8.5×1.00–1.250 V
25 W
Socket PJune 2009
  • AW80577SH0513MA
OEM
Core 2 Duo P7570
  • SLGLW (R0)
22.27 GHz3 MB1066 MT/s8.5×1.00–1.250 V
25 W
Socket PQ3 2009
  • AW80577SH0513ML
OEM
Core 2 Duo P8400
  • SLB3R (M0)
  • SLB3Q (M0)
  • SLB52 (M0)
  • SLG8Z (M0)
  • SLGCC (R0)
  • SLGCQ (R0)
  • SLGCF (R0)
  • SLGFC (R0)
  • SLGCL (R0)
22.27 GHz3 MB1066 MT/s8.5×1.00–1.250 V
25 W
Socket PJune 13, 2008 [43]
  • AW80577SH0513M
  • AW80577SH0513MN
  • BX80577P8400
$209
Core 2 Duo P8400
  • SLB4M (M0)
22.27 GHz3 MB1066 MT/s8.5×1.00–1.250 V
25 W
FC-BGA478June 2008
  • AV80577SH0513M
$209
Core 2 Duo P8600
  • SLB3S (M0)
  • SLGA4 (M0)
  • SLGFD (R0)
22.4 GHz3 MB1066 MT/s1.00–1.250 V
25 W
Socket PJune 2008 [44]
  • AW80577SH0563M
  • BX80577P8600
$241
Core 2 Duo P8600
  • SLB4N (M0)
  • SLGDZ (R0)
22.4 GHz3 MB1066 MT/s1.00–1.250 V
25 W
FC-BGA478June 2008
  • AV80577SH0563M
$241
Core 2 Duo P8700
  • SLGFE (R0)
22.53 GHz3 MB1066 MT/s9.5×1.00–1.250 V
25 W
Socket PDecember 2008
  • AW80577SH0613MG
  • BX80577P8700
$241
Core 2 Duo P8700
  • SLGFG (R0)
22.53 GHz3 MB1066 MT/s9.5×1.00–1.250 V
25 W
FC-BGA478December 2008
  • AV80577SH0613MG
$241
Core 2 Duo P8800
  • SLGLR (R0)
22.67 GHz3 MB1066 MT/s10×1.00–1.250 V
25 W
Socket PQ2 2009
  • AW80577SH0673MG
  • BX80577P8800
$241
Core 2 Duo P8800
  • SLGLA (E0)
22.67 GHz3 MB1066 MT/s10×1.00–1.250 V
25 W
FC-BGA478Q2 2009
  • AV80577SH0673MG
$241
Core 2 Duo P9500
  • SLB4E (C0)
  • SLGE8 (E0)
22.53 GHz6 MB1066 MT/s9.5×1.05–1.162 V
25 W
Socket PJuly 2008
  • AW80576SH0616M
  • AV80576SH0616M
$348
Core 2 Duo P9600
  • SLGE6 (E0)
22.67 GHz6 MB1066 MT/s10×1.05–1.212 V
25 W
Socket PDecember 2008
  • AW80576SH0676MG
$348
Core 2 Duo P9700
  • SLGQS (E0)
22.8 GHz6 MB1066 MT/s10.5×1.012–1.175 V
28 W
Socket PJune 2009
  • AW80576SH0726MG
$348

"Penryn" (medium-voltage, 45 nm, Small Form Factor)

ModelsSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release datePart
number(s)
Release
price (USD)
Core 2 Duo SP9300
  • SLB63 (C0)
22.27 GHz6 MB 1066 MT/s8.5×0.900–1.225 V
25 W
μFC-BGA 956 July 2008
  • AV80576SH0516M
$284
Core 2 Duo SP9400
  • SLB64 (C0)
  • SLGHG (C0)
  • SLGAA (E0)
22.4 GHz6 MB1066 MT/s0.900–1.225 V
25 W
μFC-BGA 956July 2008
  • AV80576SH0566M
$284
Core 2 Duo SP9600
  • SLGER (E0)
22.53 GHz6 MB1066 MT/s9.5×0.900–1.225 V
25 W
μFC-BGA 956Q1 2009
  • AV80576SH0516M
  • AV80576SH0616M
$316

"Penryn" (low-voltage, 45 nm, Small Form Factor)

ModelsSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release datePart
number(s)
Release
price (USD)
Core 2 Duo SL9300
  • SLB65 (C0)
  • SLGHC (C0)
  • SLGAG (E0)
21.6 GHz6 MB 1066 MT/s1.050–1.150 V
17 W
μFC-BGA 956 September 2008
  • AV80576LH0256M
$284
Core 2 Duo SL9380
  • SLGA2 (C0)
  • SLGAD (E0)
21.8 GHz6 MB800 MT/s1.050–1.150 V
17 W
μFC-BGA 956September 2008
  • AV80576LG0336M
$316
Core 2 Duo SL9400
  • SLB66 (C0)
  • SLGHD (C0)
  • SLGAB (E0)
21.87 GHz6 MB1066 MT/s1.050–1.150 V
17 W
μFC-BGA 956September 2008
  • AV80576LH0366M
$316
Core 2 Duo SL9600
  • SLGEQ (E0)
22.13 GHz6 MB1066 MT/s1.050–1.150 V
17 W
μFC-BGA 956Q1'09
  • AV80576LH0466M
$316

"Penryn-3M" (ultra-low-voltage, 45 nm, Small Form Factor)

ModelsSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release datePart
number(s)
Release
price (USD)
Core 2 Duo SU7300
  • SLGS6 (R0)
  • SLGYV (R0)
21.3 GHz3 MB 800 MT/s6.5×1.05–1.15 V10 W μFC-BGA 956 September 2009
  • AV80577UG0133M
  • AV80577UG0133ML
$289
Core 2 Duo SU9300
  • SLB5Q (M0)
  • SLGAL (R0)
21.2 GHz3 MB800 MT/s1.05–1.15 V10 WμFC-BGA 956September 2008
  • AV80577UG0093M
$262
Core 2 Duo SU9400
  • SLB5V (M0)
  • SLGHN (M0)
  • SLGAK (R0)
21.4 GHz3 MB800 MT/s1.05–1.15 V10 WμFC-BGA 956September 2008
  • AV80577UG0173M
$289
Core 2 Duo SU9600
  • SLGEX (R0)
  • SLGFN (R0)
21.6 GHz3 MB800 MT/s1.05–1.15 V10 WμFC-BGA 956Q1 2009
  • AV80577UG0253M
$289

"Penryn XE" (45 nm)

ModelsSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release datePart
number(s)
Release
price (USD)
Core 2 Extreme X9000
  • SLAQJ (C0)
  • SLAZ3 (C0)
22.8 GHz6 MB 800 MT/s14×1.062–1.150 V
44 W
Socket P January 2008
  • FF80576ZG0726M
$851
Core 2 Extreme X9100
  • SLB48 (C0)
  • SLG8M (C0)
  • SLGE7 (E0)
23.07 GHz6 MB1066 MT/s11.5×1.062–1.150 V
44 W
Socket PJuly 2008
  • AW80576GH0836M
$851

"Penryn QC" (45 nm)

ModelsSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release datePart
number(s)
Release
price (USD)
Core 2 Quad Q9000
  • SLGEJ (E0)
42 GHz2 × 3 MB1066 MT/s7.5×1.050–1.175 V
45 W
Socket P December 2008
  • AW80581GH0416M
  • BX80581Q9000
$348
Core 2 Quad Q9100
  • SLB5G (E0)
42.27 GHz2 × 6 MB1066 MT/s8.5×1.050–1.175 V
45 W
Socket PAugust 2008
  • AW80581GH051003
$851

"Penryn QC XE" (45 nm)

ModelsSpec
number
Cores Clock rate L2
cache
FSB Mult. Voltage TDP Socket Release datePart
number(s)
Release
price (USD)
Core 2 Extreme QX9300
  • SLB5J (E0)
42.53 GHz2 × 6 MiB 1066 MT/s9.5×1.050–1.175 V
45 W
Socket P August 2008
  • AW80581ZH061003
$1038

Core i (1st gen)

Clarksfield

Common features:

  • Socket: G1.
  • All the CPUs support dual-channel DDR3-1333 RAM.
  • All CPU models provide 16 lanes of PCIe 2.0.
  • All CPUs feature a DMI 1.0 bus to the chipset (PCH).
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 45 nm.
  • XM-suffix processors have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Smart
Cache
TDP Release
date
BaseTurbo
Core i7 940XM 4 (8)2.133.338 MB55 WJune 2010
920XM 2.003.20September 2009
840QM 1.8645 WJune 2010
820QM 1.733.06September 2009
740QM 2.936 MBJune 2010
720QM 1.602.80September 2009

Arrandale

Common features:

  • Socket: All models (except i3-380M) are available in BGA-1288; M-suffix (excluding UM- and LM-suffix) models are also available as Socket G1.
  • All the CPUs support dual-channel DDR3 RAM. All models support it at 800 MT/s speeds while M- and LM-suffix models support up to 1066 MT/s speeds.
  • All CPU models provide 16 lanes of PCIe 2.0.
  • All CPUs feature a DMI 1.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 32 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 680UM 2 (4)1.462.53 HD Graphics 166–5004 MB18 WSeptember 2010
660LM 2.263.06266–56625 W
660UM 1.332.40166–50018 WMay 2010
640M 2.803.46500–76635 WSeptember 2010
640LM 2.132.93266–56625 WJanuary 2010
640UM 1.202.27166–50018 W
620M 2.663.33500–76635 W
620LM 2.002.80266–56625 W
620UM 1.062.13166–50018 W
Core i5 580M 2.663.33500–7663 MB35 WSeptember 2010
560M 3.20
560UM 1.332.13166–50018 W
540M 2.533.07500–76635 WJanuary 2010
540UM 1.202.00166–50018 WMay 2010
520M 2.402.93500–76635 WJanuary 2010
520UM 1.071.87166–50018 W
480M 2.662.93500–76635 WJanuary 2011
470UM 1.331.86166–50018 WOctober 2010
460M 2.532.80500–76635 WSeptember 2010
450M 2.402.66June 2010
430M 2.262.53January 2010
430UM 1.201.73166–50018 WMay 2010
Core i3 390M 2.66500–66735 WJanuary 2011
380M 2.53September 2010
380UM 1.33166–50018 WOctober 2010
370M 2.40500–66735 WJune 2010
350M 2.26January 2010
330M 2.13
330UM 1.20166–50018 WMay 2010

Core i (2nd gen)

Sandy Bridge-M

Common features:

  • Socket: G2, BGA 1023 (dual-core models), BGA 1224 (quad-core models).
  • All the CPUs support dual-channel DDR3 RAM. All models support it at 1333 MT/s speeds while i7-2720QM and above support up to 1600 MT/s speeds.
  • All CPU models provide 16 lanes of PCIe 2.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 32 nm.
  • XM-suffix models have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 2960XM 4 (8)2.73.7 HD 3000 650–13008 MB55 WSeptember 2011
2920XM 2.53.5January 2011
2860QM 3.645 WSeptember 2011
2820QM 2.33.4January 2011
2760QM 2.43.56 MBSeptember 2011
2720QM 2.23.3January 2011
2675QM 3.1650–1200October 2011
2670QM 650–1100
2635QM 2.02.9650–1200January 2011
2630QM 650–1100
2677M 2 (4)1.82.9350–12004 MB17 WJune 2011
2657M 1.62.7350–1000February 2011
2640M 2.83.5650–130035 WSeptember 2011
2649M 2.33.2500–110025 WFebruary 2011
2637M 1.72.8350–120017 WJune 2011
2620M 2.73.4650–130035 WFebruary 2011
2629M 2.13.0500–110025 W
2617M 1.52.6350–95017 W
Core i5 2557M 1.72.7350–12003 MBJune 2011
2540M 2.63.3650–130035 WFebruary 2011
2537M 1.42.3350–90017 W
2520M 2.53.2650–130035 W
2467M 1.62.3350–115017 WJune 2011
2450M 2.53.1650–130035 WJanuary 2012
2435M 2.43.0September 2011
2430M 650–1200October 2011
2415M 2.32.9650–1300Q1 2011
2410M 650–1200February 2011
Core i3 2370M 2.4650–1150January 2012
2377M 1.5350–100017 WSeptember 2012
2375M Q1 2013
2367M 1.4October 2011
2365M September 2012
2350M 2.3650–115035 WOctober 2011
2357M 1.3350–95017 WJune 2011
2348M 2.3650–115035 WJanuary 2013
2332M [45] 2.2650–1100September 2011
2330M June 2011
2328M September 2012
2312M 2.1Q2 2011
2310M February 2011
2308M [46] Q3 2012

Core i (3rd gen)

Ivy Bridge

Common features:

  • Socket: G2, BGA 1023 (dual-core models), BGA 1224 (quad-core models).
  • All the CPUs support dual-channel DDR3 or DDR3L RAM, at up to 1600 MT/s speed.
  • All CPU models provide 16 lanes of PCIe, except Y-suffix models which do not have PCIe support. i5 and i7 M-, QM- and XM-suffix models support it at PCIe 3.0 speeds, while all other models support it at PCIe 2.0 speeds.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 22 nm.
  • XM-suffix models have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 3940XM 4 (8)3.03.9 HD 4000 650–13508 MB55 WSeptember 2012
3920XM 2.93.8650–1300April 2012
3840QM 2.845 WSeptember 2012
3820QM 2.73.7650–1250April 2012
3740QM 650–13006 MBSeptember 2012
3720QM 2.63.6650–1250April 2012
3635QM 2.43.4650–1200September 2012
3630QM 650–1150
3632QM 2.23.235 WOctober 2012
3615QM 2.33.3650–120045 WApril 2012
3610QM 650–1100
3612QM 2.13.135 W
3687U 2 (4)2.13.3350–12004 MB17 WJanuary 2013
3689Y 1.52.6350–85013 W
3667U 2.03.2350–115017 WJune 2012
3540M 3.03.7650–130035 WJanuary 2013
3537U 2.03.1350–120017 W
3520M 2.93.6650–125035 WJune 2012
3517U 1.93.0350–115017 W
Core i5 3437U 2.9650–12003 MBJanuary 2013
3439Y 1.52.3350–85013 W
3427U 1.82.8350–115017 WJune 2012
3380M 2.93.6650–125035 WJanuary 2013
3360M 2.83.5650–1200June 2012
3340M 2.73.4650–1250January 2013
3337U 1.82.7350–110017 W
3339Y 1.52.0350–85013 W
3320M 2.63.3650–120035 WJune 2012
3317U 1.72.6350–105017 W
3230M 2.63.2650–110035 WJanuary 2013
3210M 2.53.1June 2012
Core i3 3227U 1.9350–110017 WJanuary 2013
3229Y 1.4350–85013 W
3217U 1.8350–105017 WJune 2012
3130M 2.6650–110035 WJanuary 2013
3120M 2.5September 2012
3110M 2.4650–1000June 2012

Core i (4th gen)

Haswell-MB

Common features:

  • Socket: G3.
  • All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
  • All CPU models provide 16 lanes of PCIe. i5 and i7 models support it at PCIe 3.0 speeds, while i3 models support it at PCIe 2.0 speeds.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 22 nm.
  • MX-suffix models have an unlocked multiplier and can be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 4940MX 4 (8)3.14.0 HD 4600 400–13508 MB57 WFebruary 2014
4930MX 3.03.9June 2013
4910MQ 2.9400–130047 WFebruary 2014
4900MQ 2.83.8June 2013
4810MQ 6 MBFebruary 2014
4800MQ 2.73.7June 2013
4710MQ 2.53.5400–1150April 2014
4712MQ 2.33.337 W
4700MQ 2.43.447 WJune 2013
4702MQ 2.23.237 W
4610M 2 (4)3.03.7400–13004 MBFebruary 2014
4600M 2.93.6September 2013
Core i5 4340M 400–12503 MBFebruary 2014
4330M 2.83.5September 2013
4310M 2.73.4February 2014
4300M 2.63.3September 2013
4210M 3.2400–1150April 2014
4200M 2.53.1September 2013
Core i3 4110M 2.6400–1100April 2014
4100M 2.5September 2013
4010M [47] Q3 2014
4000M 2.4September 2013

Haswell-ULT

Common features:

  • Socket: BGA 1168.
  • All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed.
  • All CPU models provide 12 lanes of PCIe 2.0 except i3-4xx5U models, which provide 10 lanes of PCIe 2.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 22 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 4650U 2 (4)1.73.3 HD 5000 200–11004 MB15 WJune 2013
4600U 2.1 HD 4400 September 2013
4578U 3.03.5 Iris 5100 200–120028 WJuly 2014
4558U 2.83.3June 2013
4550U 1.53.0HD 5000200–110015 W
4510U 2.03.1HD 4400April 2014
4500U 1.83.0June 2013
Core i5 4360U 1.5HD 50003 MBFebruary 2014
4350U 1.42.9June 2013
4310U 2.03.0HD 4400February 2014
4308U 2.83.3Iris 5100200–120028 WJuly 2014
4300U 1.92.9HD 4400200–110015 WSeptember 2013
4288U 2.63.1Iris 5100200–120028 WJune 2013
4278U 200–1100July 2014
4260U 1.42.7HD 5000200–100015 WApril 2014
4258U 2.42.9Iris 5100200–110028 WJune 2013
4250U 1.32.6HD 5000200–100015 W
4210U 1.72.7HD 4400April 2014
4200U 1.62.6June 2013
Core i3 4158U 2.0Iris 5100200–110028 W
4120U HD 4400200–100015 WApril 2014
4100U 1.8June 2013
4030U 1.9April 2014
4025U 200–950
4010U 1.7200–1000June 2013
4005U 200–950September 2013

Haswell-ULX

Common features:

  • Socket: BGA 1168.
  • All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed.
  • All CPU models provide 12 lanes of PCIe 2.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 22 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 4610Y 2 (4)1.72.9 HD 4200 200–8504 MB11.5 WSeptember 2013
Core i5 4302Y 1.62.33 MB
4300Y
4220Y 2.0April 2014
4210Y 1.51.9September 2013
4202Y 1.62.0
4200Y 1.41.9June 2013
Core i3 4030Y 1.6April 2014
4020Y 1.5September 2013
4012Y
4010Y 1.3June 2013

Haswell-H

Common features:

  • Socket: BGA 1364.
  • All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Models with Iris Pro 5200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
  • Fabrication process: 22 nm.
  • i7-4950HQ comes with an unlocked multiplier, allowing for users to overclock it beyond the factory set clock speed.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 4980HQ 4 (8)2.84.0 Iris Pro 5200 200–13006 MB47 WJuly 2014
4960HQ 2.63.8September 2013
4950HQ 2.43.6June 2013
4870HQ 2.53.7200–1200July 2014
4860HQ 2.43.6February 2014
4850HQ 2.33.5June 2013
4770HQ 2.23.4July 2014
4760HQ 2.13.3April 2014
4750HQ 2.03.2June 2013
4720HQ 2.63.6 HD 4600 400–1200January 2015
4722HQ 2.43.4400–115037 W
4710HQ 2.53.5400–120047 WApril 2014
4712HQ 2.33.3400–115037 W
4700HQ 2.43.4400–120047 WJune 2013
4702HQ 2.23.2400–115037 W
Core i5 4210H 2 (4)2.93.53 MB47 WJuly 2014
4200H 2.83.4September 2013

Core i (5th gen)

Broadwell-U

Common features:

  • Socket: BGA 1168.
  • All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1600 MT/s speed. Models i5-5350U or above, along with all ix-5xx7 models, support LPDDR3 up to 1866 MT/s speed.
  • All CPU models provide 12 lanes of PCIe 2.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 5650U 2 (4)2.23.2 HD 6000 300–10004 MB15 WJanuary 2015
5600U 2.6 HD 5500 300–950
5557U 3.13.4 Iris 6100 300–110028 W
5550U 2.03.0HD 6000300–100015 W
5500U 2.4HD 5500300–950
Core i5 5350U 1.82.9HD 6000300–10003 MB
5300U 2.3HD 5500300–900
5287U 2.93.3Iris 6100300–110028 W
5257U 2.73.1300–1050
5250U 1.62.7HD 6000300–100015 W
5200U 2.2HD 5500300–900
Core i3 5157U 2.5Iris 6100300–100028 W
5020U 2.2HD 5500300–90015 WMarch 2015
5015U 2.1300–850
5010U 300–900January 2015
5005U 2.0300–850

Broadwell-H

Common features:

  • Socket: BGA 1364.
  • All the CPUs support dual-channel DDR3L or LPDDR3 RAM, at up to 1866 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Models with Iris Pro 6200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 5950HQ 4 (8)2.93.7 Iris Pro 6200 300–11506 MB47 WJune 2015
5850HQ 2.73.6300–1100
5750HQ 2.53.4300–1050
5700HQ 2.73.5 HD 5600
Core i5 5350H 2 (4)3.1Iris Pro 62004 MB

Core M (5th gen)

Broadwell-Y

Common features:

  • Socket: BGA 1234.
  • All the CPUs support dual-channel DDR3L, DDR3L-RS or LPDDR3 RAM, at up to 1600 MT/s speed.
  • All CPU models provide 12 lanes of PCIe 2.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core M 5Y71 2 (4)1.22.9 HD 5300 300–9004 MB4.5 WOctober 2014
5Y70 1.12.6100–850September 2014
5Y51 300–900October 2014
5Y31 0.92.4300–850
5Y10c 0.82.0300–800
5Y10a 100–800September 2014
5Y10

Core i (6th gen)

Skylake-U

Common features:

  • Socket: BGA 1356.
  • All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
  • All CPU models provide 12 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 6660U 2 (4)2.43.4 Iris 540 300–10504 MB15 WMarch 2016
6650U 2.2September 2015
6600U 2.6 HD 520
6567U 3.33.6 Iris 550 300–110028 W
6560U 2.23.2Iris 540300–105015 W
6500U 2.53.1HD 520
6498DU HD 510 December 2015
Core i5 6360U 2.0Iris 540300–10003 MBSeptember 2015
6300U 2.43.0HD 520
6287U 3.13.5Iris 550300–11004 MB28 W
6267U 2.93.3300–1050
6260U 1.82.9Iris 540300–95015 W
6200U 2.32.8HD 520300–10003 MB
6198DU HD 510December 2015
Core i3 6167U 2.7Iris 55028 W
6157U 2.4September 2016
6100U 2.3HD 52015 WSeptember 2015
6006U 2.0300–900November 2016

Skylake-H

Common features:

  • Socket: BGA 1440.
  • All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Models with Iris Pro 580 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
  • Fabrication process: 14 nm.
  • K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 6970HQ 4 (8)2.83.7 Iris Pro 580 350–10508 MB45 WJanuary 2016
6920HQ 2.93.8 HD 530 September 2015
6870HQ 2.73.6Iris Pro 580350–1000January 2016
6820HQ HD 530350–1050September 2015
6820HK
6770HQ 2.63.5Iris Pro 580350–9506 MBJanuary 2016
6700HQ HD 530350–1050September 2015
Core i5 6440HQ 4 (4)350–950
6350HQ 2.33.2Iris Pro 580350–900February 2016
6300HQ HD 530350–950September 2015
Core i3 6100H 2 (4)2.7350–9003 MB35 W

Core M (6th gen)

Skylake-Y

Common features:

  • Socket: BGA 1515.
  • All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM.
  • All CPU models provide 10 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core m7 6Y75 2 (4)1.23.1 HD 515 300–10004 MB4.5 WSeptember 2015
Core m5 6Y57 1.12.8300–900
6Y54 2.7
Core m3 6Y30 0.92.2300–850

Core i (7th gen)

Kaby Lake-U

Common features:

  • Socket: BGA 1356.
  • All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
  • All CPU models provide 12 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 7660U 2 (4)2.54.0 Iris Plus 640 300–11004 MB15 WJanuary 2017
7600U 2.83.9 HD 620 300–1150
7567U 3.54.0 Iris Plus 650 28 W
7560U 2.43.8Iris Plus 640300–105015 W
7500U 2.73.5HD 620September 2016
Core i5 7360U 2.33.6Iris Plus 640300–1000January 2017
7300U 2.63.5HD 620300–11003 MB
7287U 3.33.7Iris Plus 6504 MB28 W
7267U 3.13.5300–1050
7260U 2.23.4Iris Plus 640300–95015 W
7200U 2.53.1HD 620300–10003 MBSeptember 2016
Core i3 7167U 2.8Iris Plus 65028 WJanuary 2017
7130U 2.7HD 62015 WJune 2017
7100U 2.4September 2016
7020U 2.3Q2 2018

Kaby Lake-H

Common features:

  • Socket: BGA 1440.
  • All the CPUs support dual-channel DDR4-2400, DDR3L-1600 or LPDDR3-2133 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 7920HQ 4 (8)3.14.1 HD 630 350–11008 MB45 WJanuary 2017
7820HK 2.93.9
7820HQ
7700HQ 2.83.86 MB
Core i5 7440HQ 4 (4)300–1000
7300HQ 2.53.5
Core i3 7100H 2 (4)3.0300–9503 MB35 W

Kaby Lake-Y

Common features:

  • Socket: BGA 1515.
  • All the CPUs support dual-channel LPDDR3-1866 or DDR3L-1600 RAM.
  • All CPU models provide 10 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 7Y75 2 (4)1.33.6 HD 615 300–10504 MB4.5 WSeptember 2016
Core i5 7Y57 1.23.3300–950January 2017
7Y54 3.2September 2016

Core M (7th gen)

Kaby Lake-Y

Core m5 and Core m7 models were rebranded as Core i5 and Core i7.

Common features:

  • Socket: BGA 1515.
  • All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM.
  • All CPU models provide 10 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core m3 7Y32 2 (4)1.13.0 HD 615 300–9004 MB4.5 WApril 2017
7Y30 1.02.6September 2016

Core i (8th gen)

Coffee Lake-U

Common features:

  • Socket: BGA 1528.
  • All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 8569U 4 (8)2.84.7 Iris Plus 655 300–12008 MB28 WMay 2019
8559U 2.74.5April 2019
8557U 1.7 Iris Plus 645 300–115015 WJuly 2019
Core i5 8279U 2.44.1Iris Plus 6556 MB28 WMay 2019
8269U 2.64.2300–1100April 2018
8260U 1.63.9 UHD 620 15 WQ4 2019
8259U 2.33.8Iris Plus 655300–105028 WApril 2018
8257U 1.43.9Iris Plus 64515 WJuly 2019
Core i3 8140U 2 (4)2.1UHD 620300–10004 MB15 WQ4 2019
8109U 3.03.6Iris Plus 655300–105028 WApril 2018

Coffee Lake-H

Common features:

  • Socket: BGA 1440.
  • All the CPUs support dual-channel DDR4-2666 RAM. Models i5-8300H and above also support LPDDR3-2133 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i9 8950HK 6 (12)2.94.8 UHD 630 350–120012 MB45 WApril 2018
Core i7 8850H 2.64.3350–11509 MB
8750H 2.24.1350–1100
Core i5 8400H 4 (8)2.54.28 MB
8300H 2.34.0350–1000
Core i3 8100H 4 (4)3.06 MBJuly 2018

Coffee Lake-B

Common features:

  • Socket: BGA 1440.
  • All the CPUs support dual-channel DDR4-2666 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 8700B 6 (12)3.24.6 UHD 630 350–120012 MB65 WApril 2018
Core i5 8500B 6 (6)3.04.1350–11009 MB
8400B 2.84.0350–1050
Core i3 8100B 4 (4)3.66 MBQ3 2018

Kaby Lake Refresh

Common features:

  • Socket: BGA 1356.
  • All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
  • All CPU models provide 12 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 8650U 4 (8)1.94.2 UHD 620 300–11508 MB15 WAugust 2017
8550U 1.84.0
Core i5 8350U 1.73.6300–11006 MB
8250U 1.63.4
Core i3 8130U 2 (4)2.2300–10004 MBFebruary 2018

Kaby Lake-G

Common features:

  • Socket: BGA 2270.
  • All the CPUs support dual-channel DDR4-2400 RAM.
  • All CPU models provide 8 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • Kaby Lake-G CPUs have an embedded discrete Radeon RX Vega M GPU as listed in the table below, which have HBM2 VRAM also embedded on the CPU package.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Embedded dGPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)ModelClock (MHz)
Core i7 8809G 4 (8)3.14.2 HD 630 350–1100 RX Vega M GH 1063–11908 MB100 WFebruary 2018
8709G 4.1
8706G RX Vega M GL 931–101165 W
8705G
Core i5 8305G 2.83.2350–10006 MB

Amber Lake-Y

Common features:

  • Socket: BGA 1515.
  • All the CPUs support dual-channel LPDDR3-1866 or DDR3L-1600 RAM.
  • All CPU models provide 10 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 8500Y 2 (4)1.54.2 UHD 615 300–10504 MB5 WAugust 2018
Core i5 8310Y 1.63.9 UHD 617 7 WQ1 2019
8210Y 3.6October 2018
8200Y 1.33.9UHD 615300–9505 WAugust 2018

Whiskey Lake-U

Common features:

  • Socket: BGA 1528.
  • All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 8665U 4 (8)1.94.8 UHD 620 300–11508 MB15 WApril 2019
8565U 1.84.6August 2018
Core i5 8365U 1.64.1300–11006 MBApril 2019
8265U 3.9August 2018
Core i3 8145U 2 (4)2.1300–10004 MB

Cannon Lake-U

Common features:

  • Socket: BGA 1528.
  • All the CPUs support dual-channel DDR4-2400 or LPDDR4(x)-2400 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 10 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i3 8121U 2 (4)2.23.24 MB15 WMay 2018

Core M (8th gen)

Amber Lake-Y

Core m5 and Core m7 models were rebranded as Core i5 and Core i7.

Common features:

  • Socket: BGA 1515.
  • All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM.
  • All CPU models provide 10 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core m3 8100Y 2 (4)1.13.4 UHD 615 300–9004 MB5 WAugust 2018

Core i (9th gen)

Coffee Lake-H (refresh)

Common features:

  • Socket: BGA 1440.
  • All the CPUs support dual-channel DDR4-2666 or LPDDR3-2133 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i9 9980HK 8 (16)2.45.0 UHD 630 350–125016 MB45 WApril 2019
9880H 2.34.8350–1200
Core i7 9850H 6 (12)2.64.6350–115012 MB
9750H 4.5
9750HF
Core i5 9400H 4 (8)2.54.3UHD 630350–11008 MB
9300H 2.44.1350–1050
9300HF

Core i (10th gen)

Comet Lake-U

Common features:

  • Socket: BGA 1528.
  • All the CPUs support dual-channel DDR4-2666, LPDDR4-2933 or LPDDR3-2133 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 10810U 6 (12)1.14.7 UHD 620 300–115012 MB15 WMay 2020
10710U August 2019
10610U 4 (8)1.84.98 MBMay 2020
10510U August 2019
Core i5 10310U 1.74.46 MBMay 2020
10210U 1.64.2300–1100August 2019
Core i3 10110U 2 (4)2.14.1300–10004 MB

Comet Lake-H

Common features:

  • Socket: BGA 1440.
  • All the CPUs support dual-channel DDR4 RAM, at up to 2933 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboTVBModelClock (MHz)
Core i9 10980HK 8 (16)2.45.15.3 UHD 630 350–125016 MB45 WApril 2020
10885H May 2020
Core i7 10875H 2.34.95.1350–1200April 2020
10870H 2.24.85.0September 2020
10850H 6 (12)2.74.95.1350–115012 MBApril 2020
10750H 2.64.85.0
Core i5 10500H 2.54.5350–1050December 2020
10400H 4 (8)2.64.6350–11008 MBApril 2020
10300H 2.54.5350–1050
10200H 2.44.1August 2020

Ice Lake-U

Common features:

  • Socket: BGA 1526, except for models with 'N' in the name which use a smaller BGA 1344 package.
  • All the CPUs support dual-channel DDR4-3200 or LPDDR4-3733 RAM.
  • PCIe 3.0 support.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
  • L2 cache: 512 KB per core.
  • Fabrication process: 10 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 1068NG7 4 (8)2.34.1 Iris Plus (G7) 300–11008 MB28 WMay 2020
1068G7 [48] August 2019
1065G7 1.33.915 W
Core i5 1038NG7 2.03.8300–10506 MB28 WMay 2020
1035G7 1.23.715 WAugust 2019
1035G4 1.1 Iris Plus (G4)
1035G1 1.02.6 UHD Graphics (G1)
Core i3 1005G1 2 (4)1.23.4300–9004 MB

Ice Lake-Y

Common features:

  • Socket: BGA 1377, except for models with 'N' in the name which use a smaller BGA 1044 package.
  • All the CPUs support dual-channel LPDDR4 RAM, at up to 3733 MT/s speed.
  • PCIe 3.0 support.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
  • L2 cache: 512 KB per core.
  • Fabrication process: 10 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 1060G7 4 (8)1.03.8 Iris Plus (G7) 300–11008 MB9 WQ3 2019
Core i5 1030NG7 1.13.5300–10506 MB10 WQ2 2020
1030G7 0.89 WQ3 2019
1030G4 0.7 Iris Plus (G4)
Core i3 1000NG4 2 (4)1.13.2300–9004 MBQ2 2020
1000G4 Q3 2019
1000G1 UHD Graphics (G1)

Amber Lake-Y (10xxx)

Common features:

  • Socket: BGA 1377, except for i3-10100Y which uses a smaller BGA package of unknown name.
  • All the CPUs support dual-channel DDR3L-1600 or LPDDR3-1866 RAM. Models i3-10110Y and up support LPDDR3 at up to 2133 MT/s speed.
  • All CPU models provide 10 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 10510Y 4 (8)1.24.5 UHD 620 300–11508 MB7 WAugust 2019
Core i5 10310Y 1.14.1300–10506 MB
10210Y 1.04.0
Core i3 10110Y 2 (4)300–10004 MB
10100Y 1.33.9 UHD 615 5 WJanuary 2021

Core i (11th gen)

Tiger Lake-UP3

Common features:

  • Socket: BGA 1449.
  • All the CPUs support dual-channel DDR4-3200 or LPDDR4X-3733 RAM. i5 models and up support LPDDR4X at up to 4266 MT/s speed.
  • All CPU models provide 4 lanes of PCIe 4.0, in addition to PCIe 3.0 provided by the on-package PCH.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
  • L2 cache: 1.25 MB per core.
  • Fabrication process: 10 nm.
  • The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 1195G7 4 (8)1.3–2.95.0 Iris Xe
(96 EU)
 ?–140012 MB12–28 WJune 2021
1185G7 1.2–3.04.8?–1350September 2020
1165G7 1.2–2.84.7?–1300
Core i5 1155G7 1.0–2.54.5Iris Xe
(80 EU)
?–13508 MBJune 2021
1145G7 1.1–2.64.4?–1300January 2021
1135G7 0.9–2.44.2September 2020
Core i3 1125G4 0.9–2.03.7 UHD Graphics
(48 EU)
?–1250Q1 2021
1115G4 2 (4)1.7–3.04.16 MBSeptember 2020

Tiger Lake-UP4

Common features:

  • Socket: BGA 1598.
  • All the CPUs support dual-channel LPDDR4X-4266 RAM.
  • All CPU models provide 4 lanes of PCIe 4.0, in addition to PCIe 3.0 provided by the on-package PCH.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
  • L2 cache: 1.25 MB per core.
  • Fabrication process: 10 nm.
  • The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 1180G7 4 (8)0.9–2.24.6 Iris Xe
(96 EU)
 ?–110012 MB7–15 WJanuary 2021
1160G7 0.9–2.14.4September 2020
Core i5 1140G7 0.8–1.84.2Iris Xe
(80 EU)
8 MBJanuary 2021
1130G7 4.0September 2020
Core i3 1120G4 0.8–1.53.5 UHD Graphics
(48 EU)
Q1 2021
1110G4 2 (4)1.83.96 MBSeptember 2020

Tiger Lake-H

Common features:

  • Socket: BGA 1598.
  • All the CPUs support dual-channel DDR4-3200 RAM.
  • All CPU models provide 20 lanes of PCIe 4.0, in addition to 24 lanes of PCIe 3.0 provided by the on-package PCH.
  • All CPUs feature a DMI 3.0 8-lane bus to the chipset (PCH).
  • L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
  • L2 cache: 1.25 MB per core.
  • Fabrication process: 10 nm.
  • The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
  • K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i9 11980HK 8 (16)2.6–3.35.0 UHD Graphics
(32 EU)
350–145024 MB45–65 WMay 2021
11950H 2.1–2.635–45 W
11900H 2.1–2.54.9
Core i7 11850H 4.8
11800H 1.9–2.34.6
11600H 6 (12)2.5–2.918 MBJuly 2021
Core i5 11500H 2.4–2.912 MBMay 2021
11400H 2.2–2.74.5UHD Graphics
(16 EU)
11260H 2.1–2.64.4350–1400

Tiger Lake-H35

Common features:

  • Socket: BGA 1449.
  • All the CPUs support dual-channel DDR4-3200 or LPDDR4X-4266 RAM.
  • PCIe 4.0 support; 12× PCIe lanes provided by on-package PCH are revision 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
  • L2 cache: 1.25 MB per core.
  • Fabrication process: 10 nm.
  • The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 11390H 4 (8)2.9–3.45.0 Iris Xe
(96 EU)
 ?–140012 MB28–35 WJune 2021
11375H 3.0–3.3 ?–1350January 2021
11370H 4.8
Core i5 11320H 2.5–3.24.58 MBJune 2021
11300H 2.6–3.14.4Iris Xe
(80 EU)
 ?–1300January 2021

Core i (12th gen)

Alder Lake-U

Common features:

  • Socket: BGA 1781 (ix-12x0U), BGA 1744 (ix-12x5U).
  • All the CPUs support dual-channel LPDDR5-5200 or LPDDR4X-4266 RAM. ix-12x5U models also support dual-channel DDR5-4800 and DDR4-3200 RAM in addition.
  • ix-12x0 models provide 4 lanes of PCIe 4.0 and 8 lanes of PCIe 3.0, while ix-12x5U models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 1.25 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
Processor
branding
ModelP-core (performance)E-core (efficiency)Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz)Cores
(Threads)
Clock rate (GHz)ModelClock (MHz)BaseMax.
Turbo
BaseTurboBaseTurbo
Core i7 1265U 2 (4)1.84.88 (8)1.33.6 Iris Xe
(96 EU)
 ?–125012 MB15 W55 WFebruary 2022
1260U 1.14.70.83.5?–9509 W29 W
1255U 1.71.2?–125015 W55 W
1250U 1.10.8?–9509 W29 W
Core i5 1245U 1.64.41.23.3Iris Xe
(80 EU)
?–120015 W55 W
1240U 1.10.8?–9009 W29 W
1235U 1.30.9?–120015 W55 W
1230U 1.00.7?–8509 W29 W
Core i3 1215U 1.24 (4)0.9 UHD Graphics
(64 EU)
?–110010 MB15 W55 W
1210U 1.00.7?–8509 W29 W

Alder Lake-P

Common features:

  • Socket: BGA 1744.
  • All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
  • All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 1.25 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
  • The following models are available with IPU (infrastructure processing unit): i5-1235U, i3-1215U. Specifications between them and the respective processor without IPU are completely identical, apart from the addition of the IPU.
Processor
branding
ModelP-core (performance)E-core (efficiency)Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz)Cores
(Threads)
Clock rate (GHz)ModelClock (MHz)BaseMax.
Turbo
BaseTurboBaseTurbo
Core i7 1280P 6 (12)1.84.88 (8)1.33.6 Iris Xe
(96 EU)
 ?–145024 MB28 W64 WFebruary 2022
1270P 4 (8)2.21.63.5?–140018 MB
1260P 2.14.71.53.4
Core i5 1250P 1.74.41.23.3Iris Xe
(80 EU)
12 MB
1240P ?–1300
Core i3 1220P 2 (4)1.51.1 UHD Graphics
(64 EU)
?–1100

Alder Lake-H

Common features:

  • Socket: BGA 1744.
  • All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
  • All CPU models provide 16 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 1.25 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
  • K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
Processor
branding
ModelP-core (performance)E-core (efficiency)Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz)Cores
(Threads)
Clock rate (GHz)ModelClock (MHz)BaseMax.
Turbo
BaseTurboBaseTurbo
Core i9 12900HK 6 (12)2.55.08 (8)1.83.8 Iris Xe
(96 EU)
 ?–145024 MB45 W115 WJanuary 2022
12900H
Core i7 12800H 2.44.83.7?–1400
12700H 2.34.71.73.5
12650H 4 (4) UHD Graphics
(64 EU)
Core i5 12600H 4 (8)2.74.58 (8)2.03.3Iris Xe
(80 EU)
18 MB95 W
12500H 2.51.8?–1300
12450H 2.04.44 (4)1.5UHD Graphics
(48 EU)
?–120012 MB

Alder Lake-HX

Common features:

  • Socket: BGA 1964.
  • All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM.
  • All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
  • All CPUs feature a DMI 4.0 8-lane bus to the on-package chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 1.25 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
  • The i9 models have unlocked multipliers, allowing them to be overclocked.
Processor
branding
ModelP-core (performance)E-core (efficiency)Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz)Cores
(Threads)
Clock rate (GHz)ModelClock (MHz)BaseMax.
Turbo
BaseTurboBaseTurbo
Core i9 12950HX 8 (16)2.35.08 (8)1.73.6 UHD Graphics
(32 EU)
 ?–155030 MB55 W157 WMay 2022
12900HX
Core i7 12850HX 2.14.81.53.4?–145025 MB
12800HX 2.0
12650HX 6 (12)4.73.324 MB
Core i5 12600HX 4 (8)2.54.61.8?–135018 MB
12450HX 2.44.44 (4)3.1UHD Graphics
(16 EU)
?–130012 MB

Alder Lake-N

These are essentially "E-core-only" CPUs, utilizing the Gracemont architecture.

Common features:

  • Socket: BGA 1264.
  • All the CPUs support dual-channel DDR5-4800, DDR4-3200 or LPDDR5-4800 RAM.
  • All CPU models provide 9 lanes of PCIe 3.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache: 2 MB per cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)BaseMax.
Turbo
Core i3 N305 8 (8)1.83.8 UHD Graphics
(32 EU)
 ?–12506 MB15 W35 WJanuary 2023
N300 0.87 W25 W

Core i (13th gen)

Raptor Lake-U

Common features:

  • Socket: BGA 1744.
  • All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
  • All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core.
    • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
  • The i3-1315U is available with IPU (infrastructure processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.
Processor
branding
ModelP-core (performance)E-core (efficiency)Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz)Cores
(Threads)
Clock rate (GHz)ModelClock (MHz)BaseMax.
Turbo
BaseTurboBaseTurbo
Core i7 1365U 2 (4)1.85.28 (8)1.33.9 Iris Xe
(96 EU)
 ?–130012 MB15 W55 WJanuary 2023
1355U 1.75.01.23.7
Core i5 1345U 1.64.73.5Iris Xe
(80 EU)
?–1250
1335U 1.34.60.93.4
1334U
Core i3 1315U 1.24.54 (4)3.3 UHD Graphics
(64 EU)
10 MB
1305U 1 (2)1.61.2

Raptor Lake-P

Common features:

  • Socket: BGA 1744.
  • All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
  • All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core.
    • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
Processor
branding
ModelP-core (performance)E-core (efficiency)Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz)Cores
(Threads)
Clock rate (GHz)ModelClock (MHz)BaseMax.
Turbo
BaseTurboBaseTurbo
Core i7 1370P 6 (12)1.95.28 (8)1.43.9 Iris Xe
(96 EU)
 ?–150024 MB28 W64 WJanuary 2023
1360P 4 (8)2.25.01.63.718 MB
Core i5 1350P 1.94.71.43.5Iris Xe
(80 EU)
12 MB
1340P 4.63.4 ?–1450

Raptor Lake-H

Common features:

  • Socket: BGA 1744.
  • All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
  • All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core.
    • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
  • K-suffix processors have an unlocked multiplier, allowing it to be overclocked.
  • The i5-13500H is available with IPU (infrastructure processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.
Processor
branding
ModelP-core (performance)E-core (efficiency)Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz)Cores
(Threads)
Clock rate (GHz)ModelClock (MHz)BaseMax.
Turbo
BaseTurboBaseTurbo
Core i9 13900HK 6 (12)2.65.48 (8)1.94.1 Iris Xe
(96 EU)
 ?–150024 MB45 W115 WJanuary 2023
13900H
Core i7 13800H 2.55.21.84.0
13700H 2.45.03.7
13620H 4.94 (4)3.6 UHD Graphics
(64 EU)
Core i5 13600H 4 (8)2.84.88 (8)2.1Iris Xe
(80 EU)
18 MB95 W
13500H 2.64.71.93.5?–1450
13420H 2.14.64 (4)1.53.4UHD Graphics
(48 EU)
?–140012 MB

Raptor Lake-PX

Common features:

  • Socket: BGA 1792.
  • All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
  • All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core.
    • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
Processor
branding
ModelP-core (performance)E-core (efficiency)Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz)Cores
(Threads)
Clock rate (GHz)ModelClock (MHz)BaseMax.
Turbo
BaseTurboBaseTurbo
Core i9 13905H 6 (12)2.65.48 (8)1.94.1 Iris Xe
(96 EU)
 ?–150024 MB45 W115 WJanuary 2023
Core i7 13705H 2.45.01.83.7
Core i5 13505H 4 (8)2.64.71.93.5Iris Xe
(80 EU)
 ?–145018 MB

Raptor Lake-HX

Common features:

  • Socket: BGA 1964.
  • All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM. Models i7-13850HX and up support DDR5 at up to 5600 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
  • All CPUs feature a DMI 4.0 8-lane bus to the on-package chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core.
    • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
  • All models support CPU, iGPU, and memory overclocking. [49]
  • i9-13980HX features Thermal Velocity Boost. Without it enabled, the maximum boost clock speed is 0.1 GHz lower.
Processor
branding
ModelP-core (performance)E-core (efficiency)Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz)Cores
(Threads)
Clock rate (GHz)ModelClock (MHz)BaseMax.
Turbo
BaseTurboBaseTurbo
Core i9 13980HX 8 (16)2.25.616 (16)1.64.0 UHD Graphics
(32 EU)
 ?–165036 MB55 W157 WJanuary 2023
13950HX 5.5
13900HX 5.43.9
Core i7 13850HX 2.15.112 (12)1.53.8?–160030 MB
13700HX 5.08 (8)3.6?–1550
13650HX 6 (12)2.64.91.9UHD Graphics
(16 EU)
24 MB
Core i5 13600HX 4.7UHD Graphics
(32 EU)
?–1500
13500HX 2.54.61.83.5
13450HX 2.44 (4)3.4UHD Graphics
(16 EU)
?–145020 MB

Core i (14th gen)

Raptor Lake-HX Refresh

Common features:

  • Socket: BGA 1964.
  • All the CPUs support dual-channel DDR5-5600 or DDR4-3200 RAM.
  • All CPU models provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, in addition to 16 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0 provided by the on-package PCH.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core.
    • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
  • All models support CPU, iGPU, and memory overclocking.
  • i7 and up models feature Thermal Velocity Boost. Without it enabled, the maximum boost clock speed is 0.1 GHz lower.
Processor
branding
ModelP-core (performance)E-core (efficiency)Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz)Cores
(Threads)
Clock rate (GHz)ModelClock (MHz)BaseMax.
Turbo
BaseTurboBaseTurbo
Core i9 14900HX 8 (16)2.25.816 (16)1.64.1 UHD Graphics
(32 EU)
 ?–165036 MB55 W157 WJanuary 2024
Core i7 14700HX 2.15.512 (12)1.53.9?–160033 MB
14650HX 2.25.28 (8)1.63.7UHD Graphics
(16 EU)
30 MB
Core i5 14500HX 6 (12)2.64.91.93.5UHD Graphics
(32 EU)
?–155024 MB
14450HX 2.44.84 (4)1.8UHD Graphics
(16 EU)
?–150020 MB

Core / Core Ultra 3/5/7/9 (Series 1)

Raptor Lake-U Refresh

Common features:

  • Socket: BGA 1744.
  • All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
  • All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • Includes integrated graphics based on Xe-LP architecture.
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core.
    • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
  • The Core 3 100U is available with IPU (infrastructure processing unit). Specifications between it and the respective processor without IPU are completely identical, apart from the addition of the IPU.
Processor
branding
ModelP-core (performance)E-core (efficiency)Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz)Cores
(Threads)
Clock rate (GHz)ModelClock (MHz)BaseMax.
Turbo
BaseTurboBaseTurbo
Core 7 150U 2 (4)1.85.48 (8)1.24.0 Intel Graphics
(96 EU)
 ?–130012 MB15 W55 WJanuary 2024
Core 5 120U 1.45.00.93.8Intel Graphics
(80 EU)
?–1250
Core 3 100U 1.24.74 (4)3.3Intel Graphics
(64 EU)
10 MB

Meteor Lake-U

Common features:

  • Socket: BGA 2049.
  • All the CPUs except 1x4U models support dual-channel DDR5-5600 or LPDDR5X-7466 RAM. 1x4U models support dual-channel LPDDR5(X)-6400.
  • All CPU models provide 20 lanes of PCIe 4.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • Includes integrated graphics based on Alchemist architecture.
  • L1 cache:
    • P-cores: 112 KB (48 KB data + 64 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
  • All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base (0.4 GHz on 1x4U models), 2.1 GHz boost and have 2 MB of L2 cache.
  • Fabrication process: Intel 4 (compute tile).
  • Configurable TDP (cTDP) of 12–28 W is featured on 1x5U models, and 9–15 W on 1x4U models.
Processor
branding
ModelP-core (performance)E-core (efficiency)Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz)Cores
(Threads)
Clock rate (GHz)ModelClock (MHz)BaseMax.
Turbo
BaseTurboBaseTurbo
Core Ultra 7 165U 2 (4)1.74.98 (8)1.23.8 Intel Graphics
(4 Xe-cores)
 ?–200012 MB15 W57 WDecember 2023
164U 1.14.80.7?–18009 W30 W
155U 1.71.2?–195015 W57 W
Core Ultra 5 135U 1.64.41.13.6?–1900
134U 0.70.5?–17509 W30 W
125U 1.34.30.8?–185015 W57 W
115U 1.54.24 (4)1.03.5Intel Graphics
(3 Xe-cores)
?–180010 MB

Meteor Lake-H

Common features:

  • Socket: BGA 2049.
  • All the CPUs support dual-channel DDR5-5600 or LPDDR5X-7466 RAM.
  • All CPU models provide 8 lanes of PCIe 5.0 and 20 lanes of PCIe 4.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • Includes integrated graphics based on Alchemist architecture.
  • L1 cache:
    • P-cores: 112 KB (48 KB data + 64 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
  • All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base (1.0 GHz on Core Ultra 9 185H), 2.5 GHz boost and have 2 MB of L2 cache.
  • Fabrication process: Intel 4 (compute tile).
  • Configurable TDP (cTDP) of 35–65 W is featured on Core Ultra 9 185H, and 20–65 W on all other models.
Processor
branding
ModelP-core (performance)E-core (efficiency)Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz)Cores
(Threads)
Clock rate (GHz)ModelClock (MHz)BaseMax.
Turbo
BaseTurboBaseTurbo
Core Ultra 9 185H 6 (12)2.35.18 (8)1.83.8 Intel Arc
(8 Xe-cores)
 ?–235024 MB45 W115 WDecember 2023
Core Ultra 7 165H 1.45.00.9?–230028 W
155H 4.8?–2250
Core Ultra 5 135H 4 (8)1.74.61.23.6?–220018 MB
125H 1.24.50.7Intel Arc
(7 Xe-cores)

Embedded processors

Core i (1st gen)

Arrandale

Common features:

  • Socket: BGA 1288.
  • All the CPUs support dual-channel DDR3 RAM. All models support it at 800 MT/s speeds while E- and LE-suffix models support up to 1066 MT/s speeds.
  • All CPU models provide 16 lanes of PCIe 2.0.
  • All CPUs feature a DMI 1.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 32 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 660UE 2 (4)1.332.40 HD Graphics 166–5004 MB18 WAugust 2010
620LE 2.002.80266–56625 WJanuary 2010
620UE 1.062.13166–50018 W
610E 2.533.20500–76635 W
Core i5 520E 2.402.933 MB
Core i3 330E 2.13500–666

Core i (2nd gen)

Sandy Bridge-DT

The following models from the Sandy Bridge desktop range are available as embedded processors:

  • Core i7-2600
  • Core i5-2400
  • Core i3-2120

See section Desktop processors § Sandy Bridge-DT for full info.

Sandy Bridge-M

Common features:

  • Socket: G2 (2xx0E and 2xx0QE models except i3-2310E), BGA 1023 (all other models).
  • All the CPUs support dual-channel DDR3 RAM. All models support it at 1333 MT/s speeds while i7-2720QM and above support up to 1600 MT/s speeds.
  • All CPU models provide 16 lanes of PCIe 2.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 32 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 2715QE 4 (8)2.13.0 HD 3000 650–12006 MB45 WJanuary 2011
2710QE
2655LE 2 (4)2.22.9650–10004 MB25 WFebruary 2011
2610UE 1.52.4350–85017 W
Core i5 2515E 2.53.1650–11003 MB35 W
2510E
Core i3 2340UE 1.3350–80017 WJune 2011
2330E 2.2650–105035 W
2310E 2.1February 2011

Gladden

Common features:

  • Socket: BGA 1284.
  • All the CPUs support dual-channel DDR3-1333 RAM.
  • All CPU models provide 16 lanes of PCIe 2.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 32 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Smart
Cache
TDP Release
date
BaseTurbo
Core i3 2115C 2 (4)2.03 MB25 WQ2 2012

Core i (3rd gen)

Ivy Bridge-DT

The following models from the Ivy Bridge desktop range are available as embedded processors:

  • Core i7-3770
  • Core i5-3550S
  • Core i3-3220

See section Desktop processors § Ivy Bridge-DT for full info.

Ivy Bridge-M

Common features:

  • Socket: G2 (3xx0ME/QE models only), BGA 1023 (all other models and also i5-3610ME, i3-3120ME).
  • All the CPUs support dual-channel DDR3 and DDR3L RAM, at up to 1600 MT/s speed.
  • i7 models provide 16 lanes of PCIe 3.0, while i5 models provide 1 lane of PCIe 3.0 and i3 models provide 1 lane of PCIe 2.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 32 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 3615QE 4 (8)2.33.3 HD 4000 650–10006 MB45 WApril 2012
3610QE
3612QE 2.13.135 W
3555LE 2 (4)2.53.2550–10004 MB25 WJune 2012
3517UE 1.72.8350–100017 W
Core i5 3610ME 2.73.3650–9503 MB35 W
Core i3 3217UE 1.6350–90017 WAugust 2012
3120ME 2.4650–90035 W

Gladden

Common features:

  • Socket: BGA 1284.
  • All the CPUs support dual-channel DDR3 and DDR3L 1333 MT/s RAM.
  • All CPU models provide 20 lanes of PCIe 3.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 22 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz) Smart
Cache
TDP Release
date
BaseTurbo
Core i3 3115C 2 (4)2.54 MB25 WQ3 2013

Core i (4th gen)

Haswell-DT

Common features:

  • Socket: LGA 1150.
  • All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 22 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 4770TE 4 (8)2.33.3 HD 4600 350–10008 MB45 WJune 2013
Core i5 4570TE 2 (4)2.74 MB35 W
Core i3 4340TE 2.6May 2014
4330TE 2.4September 2013

The following models from the Haswell-DT desktop range are also available as embedded processors:

  • Core i7-4790S
  • Core i7-4770S
  • Core i5-4590S
  • Core i5-4590T
  • Core i5-4570S
  • Core i3-4360
  • Core i3-4350T
  • Core i3-4330

See section Desktop processors § Haswell-DT for full info.

Haswell-H

Common features:

  • Socket: BGA 1364.
  • All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Models with Iris Pro 5200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
  • Fabrication process: 22 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 4860EQ 4 (8)1.83.2 Iris Pro 5200 750–10006 MB47 WAugust 2013
4850EQ 1.63.2650–1000
4701EQ 2.43.4 HD 4600 400–1000Q3 2013
4700EQ June 2013
4700EC 2.78 MB43 WMarch 2014
4702EC 2.027 W
Core i5 4422E 2 (4)1.82.9HD 4600400–9003 MB25 WApril 2014
4410E 2.9400–100037 W
4400E 2.73.3400–1000September 2013
4402E 1.62.7400–90025 W
4402EC 2.54 MB27 WMarch 2014
Core i3 4110E 2.6HD 4600400–9003 MB37 WApril 2014
4112E 1.825 W
4100E 2.437 WSeptember 2013
4102E 1.625 W

Core i (5th gen)

Broadwell-H

Common features:

  • Socket: BGA 1364.
  • All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Models with Iris Pro 6200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 5850EQ 4 (8)2.73.4 Iris Pro 6200 300–10006 MB47 WJune 2015
5700EQ 2.6 HD 5600

Core i (6th gen)

Skylake-S

Common features:

  • Socket: LGA 1151.
  • All the CPUs support dual-channel DDR4-2133 or DDR3L-1600 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 6700TE 4 (8)2.43.4 HD 530 350–10008 MB35 WSeptember 2015
Core i5 6500TE 4 (4)2.33.36 MB
Core i3 6100TE 2 (4)2.74 MBQ4 2015

Skylake-H

Common features:

  • Socket: BGA 1440.
  • All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Models with Iris Pro 580 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 6820EQ 4 (8)2.83.5 HD 530 350–10008 MB45 WOctober 2015
6822EQ 2.02.825 W
Core i5 6440EQ 4 (4)2.73.46 MB45 W
6442EQ 1.92.725 W
Core i3 6100E 2 (4)2.7350–9503 MB35 W
6102E 1.925 W

Core i (7th gen)

Kaby Lake-S

Common features:

  • Socket: LGA 1151.
  • All the CPUs support dual-channel DDR4-2400 or DDR3L-1600 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i3 7101E 2 (4)3.9 HD 610 350–11003 MB54 WJanuary 2017
7101TE 3.435 W

Kaby Lake-H

Common features:

  • Socket: BGA 1440.
  • All the CPUs support dual-channel DDR4-2400 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 7820EQ 4 (8)3.03.7 HD 630 350–10008 MB45 WJanuary 2017
Core i5 7440EQ 4 (4)2.93.66 MB
7442EQ 2.12.925 W
Core i3 7100E 2 (4)2.9350–9503 MB35 W
7102E 2.125 W

Core i (8th gen)

Whiskey Lake-U

Common features:

  • Socket: BGA 1528.
  • All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 8665UE 4 (8)1.74.4 UHD 620 300–11508 MB15 WApril 2019
Core i5 8365UE 1.64.1300–10506 MBJune 2019
Core i3 8145UE 2 (4)2.23.9300–10004 MB

Core i (9th gen)

Coffee Lake-R

Common features:

  • Socket: LGA 1151-2.
  • All the CPUs support dual-channel DDR4-2400 RAM. i5 models and up support it at up to 2666 MT/s speeds.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 9700E 8 (8)2.64.4 UHD 630 350–115012 MB65 WJune 2019
9700TE 1.83.835 W
Core i5 9500E 6 (6)3.04.2350–11009 MB65 W
9500TE 2.23.635 W
Core i3 9100E 4 (4)3.13.7350–10506 MB65 W
9100TE 2.23.235 W

Coffee Lake-H (refresh)

Common features:

  • Socket: BGA 1440.
  • All the CPUs support dual-channel DDR4-2666 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 9850HE 6 (12)2.74.4 UHD 630 350–11509 MB45 WJune 2019
9850HL 1.94.125 W
Core i3 9100HL 4 (4)1.62.9350–11006 MB

Core i (10th gen)

Comet Lake-S

Common features:

  • Socket: LGA 1200.
  • All the CPUs support dual-channel DDR4-2666 RAM. i7 models and higher support it at up to 2933 MT/s speeds.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • i9-10900E features Thermal Velocity Boost.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i9 10900E 10 (20)2.84.7 UHD 630 350–120020 MB65 WApril 2020
10900TE 1.84.535 W
Core i7 10700E 8 (16)2.9350–115016 MB65 WMay 2020
10700TE 2.04.435 W
Core i5 10500E 6 (12)3.14.212 MB65 WApril 2020
10500TE 2.33.735 W
Core i3 10100E 4 (8)3.23.8350–11006 MB65 W
10100TE 2.33.635 W

Core i (11th gen)

Tiger Lake-UP3

Common features:

  • Socket: BGA 1449.
  • All the CPUs support dual-channel DDR4-3200 or LPDDR4X-3733 RAM. i5 models and up support LPDDR4X at up to 4266 MT/s speed.
  • All CPU models provide 4 lanes of PCIe 4.0, in addition to PCIe 3.0 provided by the on-package PCH.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
  • L2 cache: 1.25 MB per core.
  • Fabrication process: 10 nm.
  • All models have configurable TDP (cTDP), which can be set from a minimum of 12 W to 28 W. Base clocks shown are at 15 W TDP; they will be different depending on the cTDP setting chosen.
  • -GRE suffix models have a minimum operating temperature of -40°C as opposed to 0°C for the normal models, and also feature "in-band ECC" for memory.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 1185GRE 4 (8)1.84.4 Iris Xe
(96 EU)
 ?–135012 MB15 WSeptember 2020
1185G7E
Core i5 1145GRE 1.54.1Iris Xe
(80 EU)
 ?–13008 MB
1145G7E
Core i3 1115GRE 2 (4)2.23.9 UHD Graphics
(48 EU)
 ?–12506 MB
1115G4E

Tiger Lake-H

Common features:

  • Socket: BGA 1598.
  • All the CPUs support dual-channel DDR4-3200 RAM.
  • All CPU models provide 20 lanes of PCIe 4.0, in addition to 24 lanes of PCIe 3.0 provided by the on-package PCH.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
  • L2 cache: 1.25 MB per core.
  • Fabrication process: 10 nm.
  • The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
  • Minimum operating temperature: 0°C.
Processor
branding
Model Cores
(Threads)
Clock rate (GHz)Integrated GPU Smart
Cache
TDP Release
date
BaseTurboModelClock (MHz)
Core i7 11850HE 8 (16)2.1–2.64.7 UHD Graphics
(32 EU)
350–135024 MB35–45 WAugust 2021
Core i5 11500HE 6 (12)4.512 MB
Core i3 11100HE 4 (8)1.9–2.44.4UHD Graphics
(16 EU)
350–12508 MB

Core i (12th gen)

Alder Lake-S

Common features:

  • Socket: LGA 1700.
  • All the CPUs support dual-channel DDR4-3200 or DDR5-4800 RAM
  • All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 1.25 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
  • Turbo Boost version is 2.0.
Processor
branding
ModelP-core (performance)E-core (efficiency)Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz)Cores
(Threads)
Clock rate (GHz)ModelClock (MHz)
BaseTurboBaseTurbo
Core i9 12900E 8 (16)2.35.08 (8)1.73.8 UHD 770 300–155030 MB65 WJanuary 2022
12900TE 1.14.81.03.635 W
Core i7 12700E 2.14 (4)1.6300–150025 MB65 W
12700TE 1.44.61.03.435 W
Core i5 12500E 6 (12)2.94.5300–145018 MB65 W
12500TE 1.94.335 W
Core i3 12100E 4 (8)3.24.2 UHD 730 300–140012 MB60 W
12100TE 2.14.035 W

Alder Lake-U

Common features:

  • Socket: BGA 1744.
  • All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
  • All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 1.25 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
Processor
branding
ModelP-core (performance)E-core (efficiency)Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz)Cores
(Threads)
Clock rate (GHz)ModelClock (MHz)BaseMax.
Turbo
BaseTurboBaseTurbo
Core i7 1265UE 2 (4) ?4.78 (8) ?3.5 Iris Xe
(96 EU)
 ?–125012 MB15 W55 WFebruary 2022
Core i5 1245UE  ?4.4 ?3.3Iris Xe
(80 EU)
 ?–1200
Core i3 1215UE  ?4 (4) ? UHD Graphics
(64 EU)
 ?–110010 MB

Alder Lake-P

Common features:

  • Socket: BGA 1744.
  • All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
  • All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 1.25 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
Processor
branding
ModelP-core (performance)E-core (efficiency)Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz)Cores
(Threads)
Clock rate (GHz)ModelClock (MHz)BaseMax.
Turbo
BaseTurboBaseTurbo
Core i7 1270PE 4 (8) ?4.58 (8) ?3.3 Iris Xe
(96 EU)
 ?–135018 MB28 W64 WFebruary 2022
Core i5 1250PE  ?4.4 ?3.2Iris Xe
(80 EU)
 ?–130012 MB
Core i3 1220PE  ?4.24 (4) ?3.1 UHD Graphics
(48 EU)
 ?–1250Q1 2022

Alder Lake-PS

Common features:

  • Socket: LGA 1700. While sharing the same socket as Alder Lake-S and Raptor Lake-S, this revision of LGA 1700 is electrically incompatible with other 12th and 13th generation Intel Core desktop processors.
  • All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM.
  • All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 1.25 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
Processor
branding
ModelP-core (performance)E-core (efficiency)Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz)Cores
(Threads)
Clock rate (GHz)ModelClock (MHz)BaseMax.
Turbo
BaseTurboBaseTurbo
Core i7 12800HL 6 (12)2.44.88 (8)1.83.7 Iris Xe
(96 EU)
 ?–140024 MB45 W65 WQ3 2022
12700HL 2.34.71.73.5
1265UL 2 (4)1.84.81.32.7?–125012 MB15 W28 W
1255UL 1.74.71.22.6
Core i5 12600HL 4 (8)2.74.52.03.3Iris Xe
(80 EU)
?–140018 MB45 W65 W
12500HL 2.51.8
1245UL 2 (4)1.64.41.22.5?–125012 MB15 W28 W
1235UL 1.31.1?–1200
Core i3 12300HL 4 (8)2.04 (4)1.53.3 UHD Graphics
(48 EU)
?–140045 W65 W
1215UL 2 (4)1.20.92.5UHD Graphics
(64 EU)
?–110010 MB15 W28 W

Alder Lake-H

Common features:

  • Socket: BGA 1744.
  • All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
  • All CPU models provide 16 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 1.25 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
Processor
branding
ModelP-core (performance)E-core (efficiency)Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz)Cores
(Threads)
Clock rate (GHz)ModelClock (MHz)BaseMax.
Turbo
BaseTurboBaseTurbo
Core i7 12800HE 6 (12)2.44.68 (8)1.83.5 Iris Xe
(96 EU)
 ?–135024 MB45 W115 WJanuary 2022
Core i5 12600HE 4 (8)2.54.53.3Iris Xe
(80 EU)
 ?–130018 MB
Core i3 12300HE 1.94.34 (4)1.5 UHD Graphics
(48 EU)
 ?–115012 MB

Core i (13th gen)

Raptor Lake-S

Common features:

  • Socket: LGA 1700.
  • All the CPUs support dual-channel DDR4-3200 or DDR5-5600 RAM.
  • All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core on i7 and above models, 1.25 MB per core on i5 and below models.
    • E-cores: 4 MB per E-core cluster on i7 and above models, 2 MB per cluster on i5 and below models (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
  • Turbo Boost version is 2.0.
Processor
branding
ModelP-core (performance)E-core (efficiency)Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz)Cores
(Threads)
Clock rate (GHz)ModelClock (MHz)
BaseTurboBaseTurbo
Core i9 13900E 8 (16)1.85.216 (16)1.34.0 UHD 770 300–165036 MB65 WJanuary 2023
13900TE 1.05.00.83.935 W
Core i7 13700E 1.95.18 (8)1.3300–160030 MB65 W
13700TE 1.14.80.83.635 W
Core i5 13500E 6 (12)2.44.61.53.3300–155024 MB65 W
13500TE 1.34.51.13.135 W
13400E 2.44.64 (4)1.53.320 MB65 W
Core i3 13100E 4 (8)3.34.4 UHD 730 300–150012 MB60 W
13100TE 2.44.135 W

Raptor Lake-U

Common features:

  • Socket: BGA 1744.
  • All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
  • All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core.
    • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
Processor
branding
ModelP-core (performance)E-core (efficiency)Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz)Cores
(Threads)
Clock rate (GHz)ModelClock (MHz)BaseMax.
Turbo
BaseTurboBaseTurbo
Core i7 1365UE 2 (4)1.74.98 (8)1.33.7 Iris Xe
(96 EU)
 ?–130012 MB15 W55 WJanuary 2023
Core i5 1345UE 1.44.61.23.4Iris Xe
(80 EU)
 ?–1250
1335UE 1.34.50.93.3
Core i3 1315UE 1.24 (4) UHD Graphics
(64 EU)
 ?–120010 MB

Raptor Lake-P

Common features:

  • Socket: BGA 1744.
  • All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
  • All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core.
    • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
Processor
branding
ModelP-core (performance)E-core (efficiency)Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz)Cores
(Threads)
Clock rate (GHz)ModelClock (MHz)BaseMax.
Turbo
BaseTurboBaseTurbo
Core i7 1370PE 6 (12)1.94.88 (8) ?3.7 Iris Xe
(96 EU)
 ?–140024 MB28 W64 WJanuary 2023
Core i5 1350PE 4 (8)1.84.6 ?3.4Iris Xe
(80 EU)
12 MB
1340PE 4.5 ?3.3 ?–1350
Core i3 1320PE 1.74 (4) ? UHD Graphics
(48 EU)
 ?–1200

Raptor Lake-H

Common features:

  • Socket: BGA 1744.
  • All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
  • All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core.
    • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
Processor
branding
ModelP-core (performance)E-core (efficiency)Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz)Cores
(Threads)
Clock rate (GHz)ModelClock (MHz)BaseMax.
Turbo
BaseTurboBaseTurbo
Core i7 13800HE 6 (12)2.55.08 (8)1.84.0 Iris Xe
(96 EU)
 ?–140024 MB45 W115 WJanuary 2023
Core i5 13600HE 4 (8)2.74.82.13.6Iris Xe
(80 EU)
18 MB
Core i3 13300HE 2.14.64 (4)1.93.4 UHD Graphics
(48 EU)
 ?–130012 MB

Core / Core Ultra 3/5/7/9 (Series 1)

Meteor Lake-PS

Common features:

  • Socket: LGA 1851 (electrically incompatible with the socket used by non-embedded processors such as Arrow Lake-S).
  • All the CPUs support dual-channel DDR5-5600 RAM.
  • All CPU models provide 20 lanes of PCIe 4.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • Includes integrated graphics based on Alchemist architecture.
  • L1 cache:
    • P-cores: 112 KB (48 KB data + 64 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
  • All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base, 2.1 GHz boost (2.5 GHz on HL-suffix models) and have 2 MB of L2 cache.
  • Fabrication process: Intel 4 (compute tile).
  • Configurable TDP (cTDP) of 12–28 W is featured on UL-suffix models, and 20–65 W on HL-suffix models.
Processor
branding
ModelP-core (performance)E-core (efficiency)Integrated GPU Smart
Cache
TDP Release
date
Cores
(Threads)
Clock rate (GHz)Cores
(Threads)
Clock rate (GHz)ModelClock (MHz)BaseMax.
Turbo
BaseTurboBaseTurbo
Core Ultra 7 165HL 6 (12)1.45.08 (8)0.93.8 Intel Arc
(8 Xe-cores)
?–230024 MB45 W115 WApril 2024
155HL 4.8?–2250
165UL 2 (4)1.74.91.2 Intel Graphics
(4 Xe-cores)
 ?–200012 MB15 W57 W
155UL 4.8?–1950
Core Ultra 5 135HL 4 (8)4.61.23.6Intel Arc
(8 Xe-cores)
?–220018 MB45 W115 W
125HL 1.24.50.7Intel Arc
(7 Xe-cores)
135UL 2 (4)1.64.41.1Intel Graphics
(4 Xe-cores)
?–190012 MB15 W57 W
125UL 1.34.30.8?–1850
Core Ultra 3 105UL 1.54.24 (4)1.03.5Intel Graphics
(3 Xe-cores)
?–180010 MB

See also

Related Research Articles

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