Wire saw

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A wire saw being used to remove concrete pad flush with surrounding - wire cutting at bottom-right corner of pad Wire Saw setup.jpg
A wire saw being used to remove concrete pad flush with surrounding - wire cutting at bottom-right corner of pad

A wire saw is a saw that uses a metal wire or cable for mechanical cutting of bulk solid material such as stone, wood, glass, ferrites, concrete, metals, crystals etc.. [1] Industrial wire saws are usually powered. There are also hand-powered survivalist wire saws suitable for cutting tree branches. Wire saws are classified as continuous (or endless, or loop) or oscillating (or reciprocating). Sometimes the wire itself is referred to as a "blade".

Contents

Wire saws are similar in principle to band saws or reciprocating saws, but they use abrasion to cut rather than saw teeth. Depending on the application, diamond material may or may not be used as an abrasive. The wire can have one strand or many strands braided together (cable). A single-strand saw can be roughened to be abrasive, abrasive compounds can be bonded to the cable, or diamond-impregnated beads (and spacers) can be threaded on the cable. Wire saws are often cooled and lubricated by water or oil.

Types

Wilderness Survival Steel Wire Cable Saw Wilderness Survival Steel Wire Cable Saw.JPG
Wilderness Survival Steel Wire Cable Saw

The simplest type of wire saw is the inexpensive "survivalist" (emergency) type intended for sawing branches which are sold in hunting and climbing shops. Continuous type wire saws are used to cut walls and other large constructions. Continuous type saws are used to cut silicon wafers for the semiconductor and photovoltaics industry. Diamond-impregnated wire saws are used in machine shops to cut metal parts.

Precision wire saws are used in laboratories to cut fragile crystals, substrates, and other materials. In addition, the technology can be used for disassembling advanced research structures. For example, Bluegrass Companies designed and fabricated a diamond wire sawing method to dismantle the Tokamak Fusion Test Reactor for the Princeton plasma physics laboratory,“Based upon the demonstration at PPPL on the TFTR surrogate, the diamond wire cutting technology is superior to the baseline technology for both cost and safety considerations. The combination of void filling with this cutting technology will significantly reduce personnel radiation exposure through shielding, remote operation (normal application of this technology), and radionuclide stabilization”. [2] Both continuous and oscillating type saws are used to cut intricate shapes in stained glass.

Materials

Stone

TSH2200 Thibaut wire saw TSH2200 by Thibaut.jpg
TSH2200 Thibaut wire saw

Mining and quarrying industries commonly use a wire saw to cut hard stone into large blocks that can then be shipped to processing plants to be further refined (in the case of ore dressing) or shipped to distributors (in the case of granite or marble for building). These wire saws are large machines that use diamond-impregnated beads on a cable. The saws allow the bottom of a quarry slab to be cut free (after the cable is passed through access drill holes); with the bottom cut, back and side charges (explosives) can cleanly cleave the slab. Quarry saws on this principle date back centuries; before the era of steel cables with diamond cutters, there were fiber ropes that drew sand through the kerf. The sand (flushed with water) cut the stone (albeit more slowly than diamond does today).

Foam

Foam manufacturers commonly use an abrasive wire saw, either manual or automatic, to cut foam to certain sizes or certain profiles (shapes). Foam saws are used in many industries, include housing (insulation, pipe insulation), furniture (couches, couch cushions, chair cushions), and entertainment (foam fingers, foam accessories). Abrasive-wire cutting is often done with a computer numerical control device that automatically cuts the pattern (or patterns) that are specified in a two-dimensional (2D) CAD/CAM drawing. The materials to be cut can range from polystyrene, polyethylene, and polyurethane, to high-density or rigid types of foam, such as cellular glass (e.g., Foamglas®). Oscillating saws are used to cut foam rubber.

Semiconductors

In the semiconductor industry, multi-wire saws are used to cut cylindrical ingots of silicon boules into thin wafers. Thin wire is used to minimize the loss of material. For example, the Peter Wolters DW 291 has a minimum wire diameter of 40µm and can cut an 860mm work piece into 100µm wafers. [3] [4]

Advantages and disadvantages

One major advantage of wire saws is their smaller kerf, as compared to a blade. Another is the precision of the cut. Their main disadvantage is the slower speed. Other disadvantages include a greater chance the wire will break and any surface imperfections can cause errors in the cut.

Diamond wire cutting

Diamond wire cutting (DWC) is the process of using wire of various diameters and lengths, impregnated with diamond dust of various sizes to cut through materials. Because of the hardness of diamonds, this cutting technique can cut through almost any material that is softer than the diamond abrasive. DWC is also practical and less expensive than some other cutting techniques, for example, thin diamond wire cost around 10-20 cents per foot ($0.7/m) in 2005 for 140 to 500 micrometer diameter wire, to manufacture and sells around $1.25 a foot ($4.10/m) or more, compared to solid diamond impregnated blade cutters costing thousands of dollars. Thus a 1,000 foot (300 m) spool of diamond wire costs around $200 to manufacture and sells for around $1,250. Selling cost may vary because of wire grade and demand. Other diamond wire cutting can use shaped diamond rings threaded through cables. These larger cables are used to cut concrete and other large projects.

Advantages

DWC produces less kerf and wasted materials compared to solid blades (slurry wire may be similar). On very expensive materials, this could save hundreds or thousands of dollars of waste. Unlike slurry saws that use bare wire and contain the cutting material in the cutting fluid, DWC uses only water or some fluid to lubricate, cool the cut, and remove debris. On some materials DWC may not need water or cutting fluid, thus leaving a clean dry cut.

Disadvantages

Using diamond wire for cutting does have the problem of being less robust (snapping when fatigued, bent, jammed or tangling) than solid cutting blades and possibly more dangerous because when the wire breaks it can whip. Because of the unique nature of DWC, most saws are expensive and are tailor-made to handle diamond wire. Commercial saws that utilize solid blades can be augmented with diamond dust blades and thus may be more economical to operate in some areas. Another problem is when the diamond wire breaks in say, the middle of a 3,000 ft (910 m) reel leaving two 1,500 ft (460 m) reels of wire, thus requiring up to twice the saw direction change cycles to do the same cut and wearing out the wire saw and remaining diamond wire quicker. If the diamond wire breaks more towards an end, these shorter pieces (500 ft (150 m) or less) of wire are practically unusable and are commonly disposed of due to the hundreds of feet required to thread the saw, leaving little wire to use for process cutting. Because the diamond abrasive is mechanically attached to the wire, the wire loses cutting effectiveness after a few cuts because most of the abrasive is worn off the wire. This means that the last cut may take much longer than the first cut making production timing less predictable. Diamond wire lasts around six cuts then either breaks in several places or is functionally worn out. The longevity greatly depends on the material cut and the number of slices per cut. Quality control of smaller diameter diamond wire also greatly affects wire life and getting a bad batch is not unknown.

Surface quality

The surface quality in the wire saw process is important for the semiconductor and photo-voltaic industries where the material loss is undesirable. The surface quality is also important in cutting stone and concrete for the construction industry. The wire saw process develops surface roughness on the cut surface. The relation between process parameters (wire speed, feed rate and wire tension) and surface roughness was analyzed in the literature. [5]

Related Research Articles

<span class="mw-page-title-main">Circular saw</span> Power tool

A circular saw is a power-saw using a toothed or abrasive disc or blade to cut different materials using a rotary motion spinning around an arbor. A hole saw and ring saw also use a rotary motion but are different from a circular saw. Circular saws may also be loosely used for the blade itself. Circular saws were invented in the late 18th century and were in common use in sawmills in the United States by the middle of the 19th century.

A saw is a tool consisting of a tough blade, wire, or chain with a hard toothed edge used to cut through material. Various terms are used to describe toothed and abrasive saws.

An abrasive is a material, often a mineral, that is used to shape or finish a workpiece through rubbing which leads to part of the workpiece being worn away by friction. While finishing a material often means polishing it to gain a smooth, reflective surface, the process can also involve roughening as in satin, matte or beaded finishes. In short, the ceramics which are used to cut, grind and polish other softer materials are known as abrasives.

<span class="mw-page-title-main">Laser cutting</span> Technology that uses a laser to cut materials

Laser cutting is a technology that uses a laser to vaporize materials, resulting in a cut edge. While typically used for industrial manufacturing applications, it is now used by schools, small businesses, architecture, and hobbyists. Laser cutting works by directing the output of a high-power laser most commonly through optics. The laser optics and CNC are used to direct the laser beam to the material. A commercial laser for cutting materials uses a motion control system to follow a CNC or G-code of the pattern to be cut onto the material. The focused laser beam is directed at the material, which then either melts, burns, vaporizes away, or is blown away by a jet of gas, leaving an edge with a high-quality surface finish.

<span class="mw-page-title-main">Miter saw</span> Mechanical saw used to obtain precise angle cuts

A miter saw or mitre saw is a saw used to make accurate crosscuts and miters in a workpiece by positioning a mounted blade onto a board. A miter saw in its earliest form was composed of a back saw in a miter box, but in modern implementation consists of a powered circular saw that can be positioned at a variety of angles and lowered onto a board positioned against a backstop called the fence.

<span class="mw-page-title-main">Grinding wheel</span> Abrasive cutting tool for grinders

Grinding wheels are wheels that contain abrasive compounds for grinding and abrasive machining operations. Such wheels are also used in grinding machines.

<span class="mw-page-title-main">Concrete saw</span>

A concrete saw is a power tool used for cutting concrete, masonry, brick, asphalt, tile, and other solid materials. There are many types ranging from small hand-held saws, chop-saw models, and big walk-behind saws or other styles, and it may be powered by gasoline, hydraulic or pneumatic pressure, or an electric motor. The saw blades used on concrete saws are often diamond saw blades to cut concrete, asphalt, stone, etc. Abrasive cut-off wheels can also be used on cut-off saws to cut stone and steel. The significant friction generated in cutting hard substances like concrete usually requires the blades to be cooled to prolong their life and reduce dust.

<span class="mw-page-title-main">Water jet cutter</span> Industrial tool

A water jet cutter, also known as a water jet or waterjet, is an industrial tool capable of cutting a wide variety of materials using an extremely high-pressure jet of water, or a mixture of water and an abrasive substance. The term abrasive jet refers specifically to the use of a mixture of water and an abrasive to cut hard materials such as metal, stone or glass, while the terms pure waterjet and water-only cutting refer to waterjet cutting without the use of added abrasives, often used for softer materials such as wood or rubber.

<span class="mw-page-title-main">Hole saw</span> Cylindrical saw used to quickly cut holes

A hole saw, also known as a hole cutter, is a saw blade of annular (ring) shape, whose annular kerf creates a hole in the workpiece without having to cut up the core material. It is used in a drill. Hole saws typically have a pilot drill bit (arbor) at their center to keep the saw teeth from walking. The fact that a hole saw creates the hole without needing to cut up the core often makes it preferable to twist drills or spade drills for relatively large holes (especially those larger than 25 millimetres. The same hole can be made faster and using less power.

<span class="mw-page-title-main">Fretsaw</span> Bow saw for intricate cutting

The fretsaw is a bow saw used for intricate cutting work which often incorporates tight curves. The tool takes its name from its use in fretwork. Although traditionally intended for woodwork, different blades increase the versatility of this saw.

In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can involve scribing and breaking, mechanical sawing or laser cutting. All methods are typically automated to ensure precision and accuracy. Following the dicing process the individual silicon chips may be encapsulated into chip carriers which are then suitable for use in building electronic devices such as computers, etc.

<span class="mw-page-title-main">Diamond tool</span>

A diamond tool is a cutting tool with diamond grains fixed on the functional parts of the tool via a bonding material or another method. As diamond is a superhard material, diamond tools have many advantages as compared with tools made with common abrasives such as corundum and silicon carbide.

<span class="mw-page-title-main">Diamond blade</span> Saw blade with diamond grit bonded to the cutting surface

A diamond blade is a saw blade which has diamonds fixed on its edge for cutting hard or abrasive materials. There are many types of diamond blade, and they have many uses, including cutting stone, concrete, asphalt, bricks, coal balls, glass, and ceramics in the construction industry; cutting semiconductor materials in the semiconductor industry; and cutting gemstones, including diamonds, in the gem industry.

<span class="mw-page-title-main">Cold saw</span> Type of circular saw

A cold saw is a circular saw designed to cut metal which uses a toothed blade to transfer the heat generated by cutting to the chips created by the saw blade, allowing both the blade and material being cut to remain cool. This is in contrast to an abrasive saw, which abrades the metal and generates a great deal of heat absorbed by the material being cut and saw blade.

<span class="mw-page-title-main">Ultrasonic machining</span> Subtractive manufacturing process

Ultrasonic machining is a subtractive manufacturing process that removes material from the surface of a part through high frequency, low amplitude vibrations of a tool against the material surface in the presence of fine abrasive particles. The tool travels vertically or orthogonal to the surface of the part at amplitudes of 0.05 to 0.125 mm. The fine abrasive grains are mixed with water to form a slurry that is distributed across the part and the tip of the tool. Typical grain sizes of the abrasive material range from 100 to 1000, where smaller grains produce smoother surface finishes.

<span class="mw-page-title-main">Grinding (abrasive cutting)</span> Machining process using a grinding wheel

Grinding is a type of abrasive machining process which uses a grinding wheel as cutting tool.

<span class="mw-page-title-main">Flat honing</span> Metalworking grinding process

Flat honing is a metalworking grinding process used to provide high quality flat surfaces. It combines the speed of grinding or honing with the precision of lapping. It has also been known under the terms high speed lapping and high precision grinding.

Wafering is the process by which a silicon crystal (boule) is made into wafers. This process is usually carried out by a multi-wire saw which cuts multiple wafers from the same crystal at the same time. These wafers are then polished to the desired degree of flatness and thickness.

<span class="mw-page-title-main">Disc cutter</span> Power tool used to cut hard materials

A disc cutter is a specialised, often hand-held, power tool used for cutting hard materials, ceramic tile, metal, concrete, and stone for example. This tool is very similar to an angle grinder, chop saw, or even a die grinder, with the main difference being the cutting disc itself. This tool is highly efficient at cutting very hard materials, especially when compared to hand tools.

<span class="mw-page-title-main">Jigsaw (tool)</span> Type of saw

A jigsaw is a saw which uses a reciprocating blade to cut irregular curves, such as stenciled designs, in wood, metal, or other materials.

References

  1. "Precision Wire Saws". Princeton Scientific. Archived from the original on 2022-05-23. Retrieved 2022-06-23.
  2. "Demonstrating Diamond Wire Cutting Of The TFTR". Princeton Plasma Physics Laboratory. 2000. CiteSeerX   10.1.1.26.3383 .{{cite journal}}: Cite journal requires |journal= (help)
  3. "DW 291 product page". Archived from the original on 23 October 2021. Retrieved 22 October 2021.
  4. "DW 291 data sheet" (PDF). Archived (PDF) from the original on 23 October 2021. Retrieved 22 October 2021.
  5. Teomete, Egemen (2011). "Roughness damage evolution due to wire saw process". E. Int. J. Precis. Eng. Manuf. 12 (6): 941–947. doi:10.1007/s12541-011-0126-4. S2CID   135489484.

Literature