![]() | This section includes a list of references, related reading, or external links, but its sources remain unclear because it lacks inline citations .(May 2021) |
Materials for use in vacuum are materials that show very low rates of outgassing in vacuum and, where applicable, are tolerant to bake-out temperatures. The requirements grow increasingly stringent with the desired degree of vacuum to be achieved in the vacuum chamber. The materials can produce gas by several mechanisms. Molecules of gases and water can be adsorbed on the material surface (therefore materials with low affinity to water have to be chosen, which eliminates many plastics). Materials may sublimate in vacuum (this includes some metals and their alloys, most notably cadmium and zinc). Or the gases can be released from porous materials or from cracks and crevices. Traces of lubricants, residues from machining, can be present on the surfaces. A specific risk is outgassing of solvents absorbed in plastics after cleaning.
The gases liberated from the materials not only lower the vacuum quality, but also can be reabsorbed on other surfaces, creating deposits and contaminating the chamber.
Yet another problem is diffusion of gases through the materials themselves. Atmospheric helium can diffuse even through Pyrex glass, even if slowly (and elevated temperatures above room temperature are generally needed); [1] this however is usually not an issue. Some materials might also expand or increase in size causing problems in delicate equipment.
In addition to the gas-related issues, the materials have to maintain adequate strength through the entire required temperature range (sometimes reaching cryogenic temperatures), maintain their properties (elasticity, plasticity, electrical and thermal conductivity or lack of it, etc.), be machinable, and if possible not be overly expensive. Yet another concern is the thermal expansion coefficient match of adjacent parts.
Materials outgas by three mechanisms: release of absorbed gases (desorption from the bulk of the material), release of adsorbed gases (desorption from the surface only), and evaporation of the material itself. The former can be reduced by a bakeout, the latter is an intrinsic property of the material. [2] Some outgassed materials can deposit on other surfaces, contaminate the vacuum system and be difficult to get rid of.
The most common sources of trouble (out-gassing) in vacuum systems are:
There are also additional physical issues which come with vacuum, including the growth of whiskers from materials such as Tin or Zinc, which can cause physical issues or electrical shorts [4]
Lubrication of moving parts is a problem for vacuum. Many lubricants have unacceptable outgassing rates, [5] others (e.g. graphite) lose lubricating properties.
In addition to the concerns above, materials for use in spacecraft applications have to cope with radiation damage and high-intensity ultraviolet radiation, thermal loads from solar radiation, radiation cooling of the vehicle in other directions, and heat produced within the spacecraft's systems. Another concern, for orbits closer to Earth, is the presence of atomic oxygen, leading to corrosion of exposed surfaces; aluminium is an especially sensitive material[ citation needed ]. Silver, often used for surface-deposited interconnects, forms layer of silver oxide that flakes off and may erode up to a total failure.
Corrosion-sensitive surfaces can be protected by a suitable plating, most often with gold; a silica layer is also possible. However the coating layer is subject to erosion by micrometeoroids.
A lubricant is a substance that helps to reduce friction between surfaces in mutual contact, which ultimately reduces the heat generated when the surfaces move. It may also have the function of transmitting forces, transporting foreign particles, or heating or cooling the surfaces. The property of reducing friction is known as lubricity.
Solder is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics.
Corrosion is a natural process that converts a refined metal into a more chemically stable oxide. It is the gradual deterioration of materials by chemical or electrochemical reaction with their environment. Corrosion engineering is the field dedicated to controlling and preventing corrosion.
In physical chemistry and engineering, passivation is coating a material so that it becomes "passive", that is, less readily affected or corroded by the environment. Passivation involves creation of an outer layer of shield material that is applied as a microcoating, created by chemical reaction with the base material, or allowed to build by spontaneous oxidation in the air. As a technique, passivation is the use of a light coat of a protective material, such as metal oxide, to create a shield against corrosion. Passivation of silicon is used during fabrication of microelectronic devices. Undesired passivation of electrodes, called "fouling", increases the circuit resistance so it interferes with some electrochemical applications such as electrocoagulation for wastewater treatment, amperometric chemical sensing, and electrochemical synthesis.
Brazing is a metal-joining process in which two or more metal items are joined by melting and flowing a filler metal into the joint, with the filler metal having a lower melting point than the adjoining metal.
In metallurgy, a flux is a chemical cleaning agent, flowing agent, or purifying agent. Fluxes may have more than one function at a time. They are used in both extractive metallurgy and metal joining.
Induction heating is the process of heating electrically conductive materials, namely metals or semi-conductors, by electromagnetic induction, through heat transfer passing through an inductor that creates an electromagnetic field within the coil to heat up and possibly melt steel, copper, brass, graphite, gold, silver, aluminum, or carbide.
Die casting is a metal casting process that is characterized by forcing molten metal under high pressure into a mold cavity. The mold cavity is created using two hardened tool steel dies which have been machined into shape and work similarly to an injection mold during the process. Most die castings are made from non-ferrous metals, specifically zinc, copper, aluminium, magnesium, lead, pewter, and tin-based alloys. Depending on the type of metal being cast, a hot- or cold-chamber machine is used.
Ultra-high vacuum is the vacuum regime characterised by pressures lower than about 1×10−6 pascals. UHV conditions are created by pumping the gas out of a UHV chamber. At these low pressures the mean free path of a gas molecule is greater than approximately 40 km, so the gas is in free molecular flow, and gas molecules will collide with the chamber walls many times before colliding with each other. Almost all molecular interactions therefore take place on various surfaces in the chamber.
The solderability of a substrate is a measure of the ease with which a soldered joint can be made to that material. Good solderability requires wetting of the substrate by the solder.
A foundry is a factory that produces metal castings. Metals are cast into shapes by melting them into a liquid, pouring the metal into a mold, and removing the mold material after the metal has solidified as it cools. The most common metals processed are aluminum and cast iron. However, other metals, such as bronze, brass, steel, magnesium, and zinc, are also used to produce castings in foundries. In this process, parts of desired shapes and sizes can be formed.
Bake-out, in several areas of technology and fabrication, and in building construction, refers to the process of using high heat temperature (heat), and possibly vacuum, to remove volatile compounds from materials and objects before placing them into situations where the slow release of the same volatile compounds would contaminate the contents of a container or vessel, spoil a vacuum, or cause discomfort or illness. Bake-out is an artificial acceleration of the process of outgassing.
A diamond tool is a cutting tool with diamond grains fixed on the functional parts of the tool via a bonding material or another method. As diamond is a superhard material, diamond tools have many advantages as compared with tools made with common abrasives such as corundum and silicon carbide.
Dip soldering is a small-scale soldering process by which electronic components are soldered to a printed circuit board (PCB) to form an electronic assembly. The solder wets to the exposed metallic areas of the board, creating a reliable mechanical and electrical connection.
Glass-to-metal seals are a type of mechanical seal which joins glass and metal surfaces. They are very important elements in the construction of vacuum tubes, electric discharge tubes, incandescent light bulbs, glass-encapsulated semiconductor diodes, reed switches, glass windows in metal cases, and metal or ceramic packages of electronic components.
Soldering is a process of joining two metal surfaces together using a filler metal called solder. The soldering process involves heating the surfaces to be joined and melting the solder, which is then allowed to cool and solidify, creating a strong and durable joint.
Glass frit bonding, also referred to as glass soldering or seal glass bonding, describes a wafer bonding technique with an intermediate glass layer. It is a widely used encapsulation technology for surface micro-machined structures, e.g., accelerometers or gyroscopes. This technique utilizes low melting-point glass and therefore provides various advantages including that viscosity of glass decreases with an increase of temperature. The viscous flow of glass has effects to compensate and planarize surface irregularities, convenient for bonding wafers with a high roughness due to plasma etching or deposition. A low viscosity promotes hermetically sealed encapsulation of structures based on a better adaption of the structured shapes. Further, the coefficient of thermal expansion (CTE) of the glass material is adapted to silicon. This results in low stress in the bonded wafer pair. The glass has to flow and wet the soldered surfaces well below the temperature where deformation or degradation of either of the joined materials or nearby structures occurs. The usual temperature of achieving flowing and wetting is between 450 and 550 °C.
Aluminium alloys are often used due to their high strength-to-weight ratio, corrosion resistance, low cost, high thermal and electrical conductivity. There are a variety of techniques to join aluminium including mechanical fasteners, welding, adhesive bonding, brazing, soldering and friction stir welding (FSW), etc. Various techniques are used based on the cost and strength required for the joint. In addition, process combinations can be performed to provide means for difficult-to-join assemblies and to reduce certain process limitations.
Extreme tribology refers to tribological situations under extreme operating conditions which can be related to high loads and/or temperatures, or severe environments. Also, they may be related to high transitory contact conditions, or to situations with near-impossible monitoring and maintenance opportunities. In general, extreme conditions can typically be categorized as involving abnormally high or excessive exposure to e.g. cold, heat, pressure, vacuum, voltage, corrosive chemicals, vibration, or dust. The extreme conditions should include any device or system requiring a lubricant operating under any of the following conditions:
{{cite journal}}
: Cite journal requires |journal=
(help)