Shanghai Micro Electronics Equipment

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Shanghai Micro Electronics Equipment (Group) Co., Ltd.
Native name
上海微电子装备 (集团)股份有限公司
Company type Private (part government-backed)
Industry Semiconductors
Founded2002
FounderHe Rongming
Headquarters Shanghai, China
Key people
Gan Pin (Chairman)
Owner SASAC (32%) [1]
Website www.smee.com.cn

Shanghai Micro Electronics Equipment (Group) Co., Ltd. (SMEE), is a semiconductor manufacturing equipment company based in Shanghai, China. The company is involved in the research, development, manufacture and sale of lithography scanners and inspection tools to the semiconductor manufacturing industry; it also provides support services to its customers.

Contents

Company history

SMEE was established in 2002 by He Rongming, a former vice president at Shanghai Electric. It was originally a lithography machine technology research project under the 863 Program. After a few years of research, SMEE rolled out the first domestically made lithography machine for commercial use. [1] [2]

In December 2017, SMEE signed a contract with CSC Financial to prepare it to become a public company. During the process, SMEE acquired funding from investors such as China Everbright Limited. There was a change in the management team afterwards leading He to leave SMEE in early 2018. [2]

Product history

Prior to 2023, SMEE's most advanced product for manufacturing front-end semiconductor chips was the SSA600, which has a scanning resolution that is capable of fabricating 90 nm-class integrated circuit silicon chips. The SSA600 series machines has been described by observers as an immersion deep ultraviolet lithography tool which features an argon fluoride (ArF) excimer laser emitting coherent ultraviolet light at a wavelength of 193 nm. [3]

SSA800x (December 2023)

In December 2023, western media reported that SMEE has completed the initial development of its new SSA800-10W immersion lithography machine which has a scanning resolution capable of fabricating 28 nm-process class chips. Instances of the new machine may have been delivered to manufacturers such as SMIC and to research institutes. [4] [5] SSA800 continues to use ArF laser as its light source but also includes better tools and components which enable manufacturers to fashion circuit features associated with 28 nm-process technology. [3] Western media reported that SSA800 is designed so that none of its components include intellectual properties that originate in the United States . [3] Some analysts suggest that it is likely the Chinese government had asked SMEE to benchmark its new 28 nm-capable DUV immersion system against the similar ASML NXT:2000i system and that SSA800 is part of a fully domestic production line which is currently undergoing test production and certification. [6] As of early 2024, SMEE's website does not yet include the new SSA800 lithography machine in its product list section.

In the future, a version of the SSA800 may be employed on processes below the 28 nm node via multi-patterning; generally, photolithography techniques developed in the field of multiple patterning allow immersion lithography machines using an ArF laser light source to fashion integrated circuits features associated with technologies as advanced as 7 nm or even 5 nm processes. For example, in 2016, media reports implied that Intel's then new 10 nm-process employed immersion DUV machines in combination with self-aligned double patterning techniques to achieve the desired circuit feature size, rather than using the more advanced EUV photolithography technology. [7]

SMEE's SSA800 machine lags photolithography industry leader ASML Holding in time: ASML first delivered 28 nm-capable machines to TSMC in 2011. [3]

Pre-2023 product mix

Prior to the introduction of the SSA800 scanner series in 2023, SMEE had developed a range of lithography, metrology, and derivative equipment, including four series of machines for the manufacture of front-end integrated circuits (such as the SSA600 series scanners), back-end IC packaging, LEDs, MEMS, IC power devices, and TFTs. [2]

Future developments

It is not known if SMEE will embark upon the development of an EUV lithography scanner currently produced only by Netherland's ASML; however, some observers suggest that there may be up to three separate current efforts within China, involving private, state, and educational institutions other than SMEE, to develop and deliver a prototype Chinese EUV lithography scanner in the next few years. [6]

United States sanctions

In December 2022, as part of the United States' effort to impede Chinese development of advanced semiconductor equipment, the United States Department of Commerce added SMEE to the Bureau of Industry and Security's Entity List. [8] [9]

See also

Related Research Articles

Photolithography is a process used in the manufacturing of integrated circuits. It involves using light to transfer a pattern onto a substrate, typically a silicon wafer.

<span class="mw-page-title-main">Semiconductor device fabrication</span> Manufacturing process used to create integrated circuits

Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips that are present in everyday electronic devices. It is a multiple-step photolithographic and physio-chemical process during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.

<span class="mw-page-title-main">Photomask</span> Photolithographic Tool

A photomask is an opaque plate with transparent areas that allow light to shine through in a defined pattern. Photomasks are commonly used in photolithography for the production of integrated circuits to produce a pattern on a thin wafer of material. In semiconductor manufacturing, a mask is sometimes called a reticle.

<span class="mw-page-title-main">Immersion lithography</span> Photolithography technique where there is a layer of water between a lens and a microchip

Immersion lithography is a technique used in semiconductor manufacturing to enhance the resolution and accuracy of the lithographic process. It involves using a liquid medium, typically water, between the lens and the wafer during exposure. By using a liquid with a higher refractive index than air, immersion lithography allows for smaller features to be created on the wafer.

<span class="mw-page-title-main">Planar process</span> Process used to make microchips

The planar process is a manufacturing process used in the semiconductor industry to build individual components of a transistor, and in turn, connect those transistors together. It is the primary process by which silicon integrated circuit chips are built, and it is the most commonly used method of producing junctions during the manufacture of semiconductor devices. The process utilizes the surface passivation and thermal oxidation methods.

Masklesslithography (MPL) is a photomask-less photolithography-like technology used to project or focal-spot write the image pattern onto a chemical resist-coated substrate by means of UV radiation or electron beam.

<span class="mw-page-title-main">Semiconductor Manufacturing International Corporation</span> Chinese semiconductor foundry

Semiconductor Manufacturing International Corporation (SMIC) is a partially state-owned publicly listed Chinese pure-play semiconductor foundry company. It is the largest contract chip maker in mainland China.

Nanolithography (NL) is a growing field of techniques within nanotechnology dealing with the engineering of nanometer-scale structures on various materials.

<span class="mw-page-title-main">Extreme ultraviolet lithography</span> Lithography using 13.5 nm UV light

Extreme ultraviolet lithography is a cutting-edge technology used in the semiconductor industry for manufacturing integrated circuits (ICs). It is a type of photolithography that uses extreme ultraviolet (EUV) light to create intricate patterns on silicon wafers.

Next-generation lithography or NGL is a term used in integrated circuit manufacturing to describe the lithography technologies in development which are intended to replace current techniques. Driven by Moore's law in the semiconductor industries, the shrinking of the chip size and critical dimension continues. The term applies to any lithography method which uses a shorter-wavelength light or beam type than the current state of the art, such as X-ray lithography, electron beam lithography, focused ion beam lithography, and nanoimprint lithography. The term may also be used to describe techniques which achieve finer resolution features from an existing light wavelength.

<span class="mw-page-title-main">Stepper</span> Photolithographic Tool

A stepper or wafer stepper is a device used in the manufacture of integrated circuits (ICs). It is an essential part of the process of photolithography, which creates millions of microscopic circuit elements on the surface of silicon wafers out of which chips are made. It is similar in operation to a slide projector or a photographic enlarger. The ICs that are made form the heart of computer processors, memory chips, and many other electronic devices.

<span class="mw-page-title-main">ASML Holding</span> Dutch manufacturer of semiconductor production equipment

ASML Holding N.V. is a Dutch multinational corporation founded in 1984. ASML specializes in the development and manufacturing of photolithography machines which are used to produce computer chips.

Resolution enhancement technologies are methods used to modify the photomasks in the lithographic processes used to make integrated circuits to compensate for limitations in the optical resolution of the projection systems. These processes allow the creation of features well beyond the limit that would normally apply due to the Rayleigh criterion. Modern technologies allow the creation of features on the order of 5 nanometers (nm), far below the normal resolution possible using deep ultraviolet (DUV) light.

The "32 nm" node is the step following the "45 nm" process in CMOS (MOSFET) semiconductor device fabrication. "32-nanometre" refers to the average half-pitch of a memory cell at this technology level.

In semiconductor fabrication, the International Technology Roadmap for Semiconductors (ITRS) defines the "10 nanometer process" as the MOSFET technology node following the "14 nm" node.

Computational lithography is the set of mathematical and algorithmic approaches designed to improve the resolution attainable through photolithography. Computational lithography came to the forefront of photolithography technologies in 2008 when the semiconductor industry faced challenges associated with the transition to a 22 nanometer CMOS microfabrication process and has become instrumental in further shrinking the design nodes and topology of semiconductor transistor manufacturing.

In semiconductor manufacturing, the "7 nm" process is a marketing term for the MOSFET technology node following the "10 nm" node, defined by the International Technology Roadmap for Semiconductors. It is based on FinFET technology, a type of multi-gate MOSFET technology.

<span class="mw-page-title-main">Carl Zeiss SMT</span>

Carl Zeiss SMT GmbH comprises the Semiconductor Manufacturing Technology business group of ZEISS and develops and produces equipment for the manufacture of microchips. The company is majority owned by Carl Zeiss AG, with a 24.9% minority stake by ASML Holding.

Ultratech, Inc. is an international technology company based in San Jose, California, that supplies equipment to global semiconductor fabrication plants, and also makes tools for nanotechnology applications by optical networking, data storage and automotive and display industries. Since May 2017 it has been owned by Veeco.

The Chinese semiconductor industry, including integrated circuit design and manufacturing, forms a major part of mainland China's information technology industry.

References

  1. 1 2 "Chinese chipmaking equipment manufacturers filling void left by U.S. export restrictions". Reuters.
  2. 1 2 3 Platonov, Ivan (23 June 2021). "Deep Dive: SMEE and China's Attempt to Replace ASML Tools". EqualOcean. Retrieved 2024-03-14.
  3. 1 2 3 4 Shilov, Anton (6 December 2020). "China's 28nm-Capable Chip Fabbing Tool on Track Amid Trade War". Toms Hardware. Retrieved 21 December 2023.
  4. Wu, Debby; Zheng, Sarah (20 December 2023). "Chinese Chip Gear Leader Achieves Key Breakthrough, Backer Says". Bloomberg.com. Retrieved 20 December 2023.
  5. Shilov, Anton (5 October 2023). "China's First 28nm Lithography Tool to be Delivered This Year". Toms Hardware. Retrieved 20 December 2023.
  6. 1 2 Triolo, Paul (20 February 2024). "A New Era for the Chinese Semiconductor Industry: Beijing Responds to Export Controls". American Affairs. Retrieved 20 February 2024.
  7. Lapedus, Mark (22 August 2016). "Deeper inside Intel". Semiconductor Engineering. Retrieved 22 December 2023.
  8. Alper, Alexandra (2022-12-15). "Biden blacklists China's YMTC, crackdowns on AI chip sector". Reuters . Retrieved 2022-12-15.
  9. Shilov, Anton (20 December 2023). "Chinese company claims chipmaking tool breakthrough - announces 28nm-capable litho tool". Toms Hardware. Retrieved 20 December 2023.