Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips. It is a multiple-step photolithographic and physico-chemical process during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.
STMicroelectronics NV is a multinational corporation and technology company of French-Italian origin. Incorporated in the Netherlands, its headquarters are in Plan-les-Ouates, Switzerland and it is listed on the New York Stock Exchange, the Euronext Paris and the Borsa Italiana in Milan. ST is the largest European semiconductor contract manufacturing and design company. The company resulted from the merger of two government-owned semiconductor companies in 1987: Thomson Semiconducteurs of France and SGS Microelettronica of Italy.
Applied Materials, Inc. is an American corporation that supplies equipment, services and software for the manufacture of semiconductor chips for electronics, flat panel displays for computers, smartphones, televisions, and solar products. The company also supplies equipment to produce coatings for flexible electronics, packaging and other applications. The company is headquartered in Santa Clara, California, and is the second largest supplier of semiconductor equipment in the world based on revenue behind ASML of Netherlands.
SK Group is a South Korean multinational manufacturing and services conglomerate headquartered in Seoul. A chaebol, SK Group is second largest such conglomerate by revenue in South Korea, after Samsung Group. Through a number of subsidiaries, it is engaged in various businesses, including manufacture of chemicals and petrochemicals, semiconductors, flash memory and miscellaneous information technology, as well providing telecommunications services worldwide among its other less notable ventures.
Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process. Examples include production of radio frequency (RF) amplifiers, LEDs, optical computer components, and microprocessors for computers. Wafer fabrication is used to build components with the necessary electrical structures.
Semiconductor Manufacturing International Corporation (SMIC) is a partially state-owned publicly listed Chinese pure-play semiconductor foundry company. It is the largest contract chip maker in mainland China.
SK hynix Inc. is a South Korean supplier of dynamic random-access memory (DRAM) chips and flash memory chips. SK Hynix is one of the world's largest semiconductor vendors.
Lam Research Corporation is an American supplier of wafer-fabrication equipment and related services to the semiconductor industry. Its products are used primarily in front-end wafer processing, which involves the steps that create the active components of semiconductor devices and their wiring (interconnects). The company also builds equipment for back-end wafer-level packaging (WLP) and for related manufacturing markets such as for microelectromechanical systems (MEMS).
Nexperia is a semiconductor manufacturer headquartered in Nijmegen, the Netherlands. It is a subsidiary of the partially state-owned Chinese company Wingtech Technology, a publicly traded company. It has front-end factories in Hamburg, Germany, and Greater Manchester, England. It is the former Standard Products business unit of NXP Semiconductors. The company's product range includes bipolar transistors, diodes, ESD protection, TVS diodes, MOSFETs, and logic devices.
The X-FAB Silicon Foundries is a group of semiconductor foundries. The group specializes in the fabrication of analog and mixed-signal integrated circuits for fabless semiconductor companies, as well as MEMS and solutions for high voltage applications. The holding company named "X-FAB Silicon Foundries SE" is based in Tessenderlo, Belgium while its headquarters is located in Erfurt, Germany.
GlobalFoundries Inc. is a multinational semiconductor contract manufacturing and design company incorporated in the Cayman Islands and headquartered in Malta, New York. Created by the divestiture of the manufacturing arm of AMD, the company was privately owned by Mubadala Investment Company, a sovereign wealth fund of the United Arab Emirates, until an initial public offering (IPO) in October 2021.
The Inmos microprocessor factory, also known as the Inmos factory, previously known as Newport Wafer Fab, now known as Nexperia Newport, is a semiconductor fabrication plant for Inmos built in Newport, Wales, UK in 1980. It has gone through numerous changes in ownership. Since March 2024, the factory has been owned by Vishay Intertechnology.
Tokyo Electron Limited, or TEL, is a Japanese electronics and semiconductor company headquartered in Akasaka, Minato-ku, Tokyo, Japan. The company was founded as Tokyo Electron Laboratories, Inc. in 1963. TEL is best known as a supplier of equipment to fabricate integrated circuits (IC), flat panel displays (FPD), and photovoltaic cells (PV). Tokyo Electron Device, or TED, is a subsidiary of TEL specializing in semiconductor devices, electronic components, and networking devices. As of 2011, TEL was the largest manufacturer of IC and FPD production equipment. Listed on the Nikkei 225, in 2024, Tokyo Electron had a market cap of US$114.6 billion, making it the third-most valuable company in Japan in terms of market cap, and the 12th ranked semiconductor-related company worldwide.
High Bandwidth Memory (HBM) is a computer memory interface for 3D-stacked synchronous dynamic random-access memory (SDRAM) initially from Samsung, AMD and SK Hynix. It is used in conjunction with high-performance graphics accelerators, network devices, high-performance datacenter AI ASICs, as on-package cache in CPUs and on-package RAM in upcoming CPUs, and FPGAs and in some supercomputers. The first HBM memory chip was produced by SK Hynix in 2013, and the first devices to use HBM were the AMD Fiji GPUs in 2015.
ChangXin Memory Technologies is a Chinese semiconductor integrated device manufacturer headquartered in Hefei, Anhui, specializing in the production of DRAM memory.
The semiconductor industry, including Integrated Circuit (IC) manufacturing, design, and packaging, forms a major part of Taiwan's IT industry. Due to its strong capabilities in OEM wafer manufacturing and a complete industry supply chain, Taiwan has been able to distinguish itself as a leading microchip manufacturer and dominate the global marketplace. Taiwan’s semiconductor sector accounted for US$115 billion, around 20 percent of the global semiconductor industry. In sectors such as foundry operations, Taiwanese companies account for 50 percent of the world market, with Taiwan Semiconductor Manufacturing Company (TSMC) the biggest player in the foundry market.
Hua Hong Semiconductor Limited is a publicly listed Chinese pure-play semiconductor foundry company based in Shanghai, established in 1996 as part of China's national efforts to boost its IC industry. Currently, Hua Hong's most advanced node is achieved by its subsidiary Shanghai Huali (HLMC), which can manufacture 28/22-nm process.
The Chinese semiconductor industry, including integrated circuit design and manufacturing, forms a major part of mainland China's information technology industry.
Will Semiconductor is a publicly listed Chinese fabless semiconductor company headquartered in Shanghai.
US$557.72 million (2023)
