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Chemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films.
Hydrogen is a chemical element; it has symbol H and atomic number 1. It is the lightest element and, at standard conditions, is a gas of diatomic molecules with the formula H2, sometimes called dihydrogen, but more commonly called hydrogen gas, molecular hydrogen or simply hydrogen. It is colorless, odorless, non-toxic, and highly combustible. Constituting about 75% of all normal matter, hydrogen is the most abundant chemical element in the universe. Stars, including the Sun, mainly consist of hydrogen in a plasma state, while on Earth, hydrogen is found in water, organic compounds, as dihydrogen, and in other molecular forms. The most common isotope of hydrogen consists of one proton, one electron, and no neutrons.
The Haber process, also called the Haber–Bosch process, is the main industrial procedure for the production of ammonia. It converts atmospheric nitrogen (N2) to ammonia (NH3) by a reaction with hydrogen (H2) using a finely divided iron metal catalyst:
Nitrogen is a chemical element; it has symbol N and atomic number 7. Nitrogen is a nonmetal and the lightest member of group 15 of the periodic table, often called the pnictogens. It is a common element in the universe, estimated at seventh in total abundance in the Milky Way and the Solar System. At standard temperature and pressure, two atoms of the element bond to form N2, a colourless and odourless diatomic gas. N2 forms about 78% of Earth's atmosphere, making it the most abundant chemical species in air. Because of the volatility of nitrogen compounds, nitrogen is relatively rare in the solid parts of the Earth.
Hydrogenation is a chemical reaction between molecular hydrogen (H2) and another compound or element, usually in the presence of a catalyst such as nickel, palladium or platinum. The process is commonly employed to reduce or saturate organic compounds. Hydrogenation typically constitutes the addition of pairs of hydrogen atoms to a molecule, often an alkene. Catalysts are required for the reaction to be usable; non-catalytic hydrogenation takes place only at very high temperatures. Hydrogenation reduces double and triple bonds in hydrocarbons.
Pyrolysis is the process of thermal decomposition of materials at elevated temperatures, often in an inert atmosphere without access to oxygen.
Brazing is a metal-joining process in which two or more metal items are joined by melting and flowing a filler metal into the joint, with the filler metal having a lower melting point than the adjoining metal.
A reducing atmosphere is an atmospheric condition in which oxidation is prevented by absence of oxygen and other oxidizing gases or vapours, and which may contain actively reductant gases such as hydrogen, carbon monoxide, methane and hydrogen sulfide that would be readily oxidized to remove any free oxygen. Although Early Earth had had a reducing prebiotic atmosphere prior to the Proterozoic eon, starting at about 2.5 billion years ago in the late Neoarchaean period, the Earth's atmosphere experienced a significant rise in oxygen and transitioned to an oxidizing atmosphere with a surplus of molecular oxygen (dioxygen, O2) as the primary oxidizing agent.
Industrial processes are procedures involving chemical, physical, electrical, or mechanical steps to aid in the manufacturing of an item or items, usually carried out on a very large scale. Industrial processes are the key components of heavy industry.
Tungsten(VI) fluoride, also known as tungsten hexafluoride, is an inorganic compound with the formula WF6. It is a toxic, corrosive, colorless gas, with a density of about 13 kg/m3 (22 lb/cu yd). It is the only known gaseous transition metal compound and the densest known gas under standard ambient temperature and pressure. WF6 is commonly used by the semiconductor industry to form tungsten films, through the process of chemical vapor deposition. This layer is used in a low-resistivity metallic "interconnect". It is one of seventeen known binary hexafluorides.
The water–gas shift reaction (WGSR) describes the reaction of carbon monoxide and water vapor to form carbon dioxide and hydrogen:
Lithium nitride is an inorganic compound with the chemical formula Li3N. It is the only stable alkali metal nitride. It is a reddish-pink solid with a high melting point.
In metallurgy and materials science, annealing is a heat treatment that alters the physical and sometimes chemical properties of a material to increase its ductility and reduce its hardness, making it more workable. It involves heating a material above its recrystallization temperature, maintaining a suitable temperature for an appropriate amount of time and then cooling.
Nitriding is a heat treating process that diffuses nitrogen into the surface of a metal to create a case-hardened surface. These processes are most commonly used on low-alloy steels. They are also used on titanium, aluminium and molybdenum.
Titanium hydride normally refers to the inorganic compound TiH2 and related nonstoichiometric materials. It is commercially available as a stable grey/black powder, which is used as an additive in the production of Alnico sintered magnets, in the sintering of powdered metals, the production of metal foam, the production of powdered titanium metal and in pyrotechnics.
The chemical element nitrogen is one of the most abundant elements in the universe and can form many compounds. It can take several oxidation states; but the most common oxidation states are -3 and +3. Nitrogen can form nitride and nitrate ions. It also forms a part of nitric acid and nitrate salts. Nitrogen compounds also have an important role in organic chemistry, as nitrogen is part of proteins, amino acids and adenosine triphosphate.
Endothermic gas is a gas that inhibits or reverses oxidation on the surfaces it is in contact with. This gas is the product of incomplete combustion in a controlled environment. An example mixture is hydrogen gas (H2), nitrogen gas (N2), and carbon monoxide (CO). The hydrogen and carbon monoxide are reducing agents, so they work together to shield surfaces from oxidation.
Ultra-high-purity steam, also called the clean steam, UHP steam or high purity water vapor, is used in a variety of industrial manufacturing processes that require oxidation or annealing. These processes include the growth of oxide layers on silicon wafers for the semiconductor industry, originally described by the Deal-Grove model, and for the formation of passivation layers used to improve the light capture ability of crystalline photovoltaic cells. Several methods and technologies can be employed to generate ultra high purity steam, including pyrolysis, bubbling, direct liquid injection, and purified steam generation. The level of purity, or the relative lack of contamination, affects the quality of the oxide layer or annealed surface. The method of delivery affects growth rate, uniformity, and electrical performance. Oxidation and annealing are common steps in the manufacture of such devices as microelectronics and solar cells.
Direct bonding, or fusion bonding, describes a wafer bonding process without any additional intermediate layers. The bonding process is based on chemical bonds between two surfaces of any material possible meeting numerous requirements. These requirements are specified for the wafer surface as sufficiently clean, flat and smooth. Otherwise unbonded areas so called voids, i.e. interface bubbles, can occur.
Plasma-activated bonding is a derivative, directed to lower processing temperatures for direct bonding with hydrophilic surfaces. The main requirements for lowering temperatures of direct bonding are the use of materials melting at low temperatures and with different coefficients of thermal expansion (CTE).
References
- ↑ "Forming gas specs" (PDF). Messer Group. Archived from the original (PDF) on July 14, 2011. Retrieved May 27, 2009.
- ↑ "Ammonia cracker for the generation of forming gas". Crystec Technology Trading GmbH. Retrieved April 19, 2009.
- ↑ Lodriguss, Jerry. "Gas hypersensitization". Catching the Light. Retrieved April 19, 2009.
- ↑ "Thermal treatment of steel". Crystec Technology Trading GmbH. Retrieved April 19, 2009.
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