AlSiC

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AlSiC, pronounced "alsick", [1] is a metal matrix composite consisting of aluminium matrix with silicon carbide particles. It has high thermal conductivity (180–200 W/m K), and its thermal expansion can be adjusted to match other materials, e.g. silicon and gallium arsenide chips and various ceramics. It is chiefly used in microelectronics as substrate for power semiconductor devices and high density multi-chip modules, where it aids with removal of waste heat.

Several variants exist:

AlSiC composites are suitable replacements for copper-molybdenum (CuMo) and copper-tungsten (CuW) alloys; they have about 1/3 the weight of copper, 1/5 of CuMo, and 1/6 of CuW, making them suitable for weight-sensitive applications; they are also stronger and stiffer than copper. They can be used as heatsinks, substrates for power electronics (e.g. IGBTs and high-power LEDs), heat spreaders, housings for electronics, and lids for chips, e.g. microprocessors and ASICs. Metal and ceramic inserts and channels for a coolant can be integrated into the parts during manufacture. AlSiC composites can be produced relatively inexpensively (USD 2-4/lb in large series); the dedicated tooling however causes large up-front expenses, making AlSiC more suitable for mature designs. [1] [2] Heat pipes can be embedded into AlSiC, raising effective heat conductivity to 500–800 W/m K.[ citation needed ]

AlSiC parts are typically manufactured by near net shape approach, by creating a SiC preform by metal injection molding of an SiC-binder slurry, firing to remove the binder, then infiltration under pressure with molten aluminium. Parts can be made with sufficient tolerance to not require further machining. The material is fully dense, without voids, and is hermetic. Its high stiffness and low density suits larger parts with thin walls such as fins for heat dissipation. AlSiC can be plated with nickel and nickel-gold, or by other metals by thermal spraying. Ceramic and metal insets can be inserted into the preform before aluminium infiltration, resulting in a hermetic seal. [3] AlSiC can be also prepared by mechanical alloying. When lower degree of SiC content is used, parts can be stamped from AlSiC sheets.

The aluminium matrix contains high amount of dislocations, responsible for the strength of the material. The dislocations are introduced during cooling by the SiC particles, due to their different thermal expansion coefficient. [4]

A similar material is Dymalloy, with copper-silver alloy instead of aluminium and diamond instead of silicon carbide. Other materials are copper reinforced with carbon fiber, diamond-reinforced aluminium, reinforced carbon-carbon, and pyrolytic graphite.[ citation needed ]

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<span class="mw-page-title-main">Metal</span> Type of material

A metal is a material that, when freshly prepared, polished, or fractured, shows a lustrous appearance, and conducts electricity and heat relatively well. Metals are typically ductile and malleable. These properties are the result of the metallic bond between the atoms or molecules of the metal.

In materials science, a metal matrix composite (MMC) is a composite material with fibers or particles dispersed in a metallic matrix, such as copper, aluminum, or steel. The secondary phase is typically a ceramic or another metal. They are typically classified according to the type of reinforcement: short discontinuous fibers (whiskers), continuous fibers, or particulates. There is some overlap between MMCs and cermets, with the latter typically consisting of less than 20% metal by volume. When at least three materials are present, it is called a hybrid composite. MMCs can have much higher strength-to-weight ratios, stiffness, and ductility than traditional materials, so they are often used in demanding applications. MMCs typically have lower thermal and electrical conductivity and poor resistance to radiation, limiting their use in the very harshest environments.

<span class="mw-page-title-main">Silicon carbide</span> Extremely hard semiconductor containing silicon and carbon

Silicon carbide (SiC), also known as carborundum, is a hard chemical compound containing silicon and carbon. A semiconductor, it occurs in nature as the extremely rare mineral moissanite, but has been mass-produced as a powder and crystal since 1893 for use as an abrasive. Grains of silicon carbide can be bonded together by sintering to form very hard ceramics that are widely used in applications requiring high endurance, such as car brakes, car clutches and ceramic plates in bulletproof vests. Large single crystals of silicon carbide can be grown by the Lely method and they can be cut into gems known as synthetic moissanite.

Thermal analysis is a branch of materials science where the properties of materials are studied as they change with temperature. Several methods are commonly used – these are distinguished from one another by the property which is measured:

<span class="mw-page-title-main">Brazing</span> Metal-joining technique

Brazing is a metal-joining process in which two or more metal items are joined by melting and flowing a filler metal into the joint, with the filler metal having a lower melting point than the adjoining metal.

Aluminium–silicon alloys or Silumin is a general name for a group of lightweight, high-strength aluminium alloys based on an aluminum–silicon system (AlSi) that consist predominantly of aluminum - with silicon as the quantitatively most important alloying element. Pure AlSi alloys cannot be hardened, the commonly used alloys AlSiCu and AlSiMg can be hardened. The hardening mechanism corresponds to that of AlCu and AlMgSi. The rarely used wrought alloys in the 4000 series and the predominantly used cast alloys are standardised in the 40000 series.

A cermet is a composite material composed of ceramic and metal materials.

<span class="mw-page-title-main">Refractory</span> Materials resistant to decomposition under high temperatures

In materials science, a refractory is a material that is resistant to decomposition by heat or chemical attack that retains its strength and rigidity at high temperatures. They are inorganic, non-metallic compounds that may be porous or non-porous, and their crystallinity varies widely: they may be crystalline, polycrystalline, amorphous, or composite. They are typically composed of oxides, carbides or nitrides of the following elements: silicon, aluminium, magnesium, calcium, boron, chromium and zirconium. Many refractories are ceramics, but some such as graphite are not, and some ceramics such as clay pottery are not considered refractory. Refractories are distinguished from the refractory metals, which are elemental metals and their alloys that have high melting temperatures.

<span class="mw-page-title-main">Titanium diboride</span> Chemical compound

Titanium diboride (TiB2) is an extremely hard ceramic which has excellent heat conductivity, oxidation stability and wear resistance. TiB2 is also a reasonable electrical conductor, so it can be used as a cathode material in aluminium smelting and can be shaped by electrical discharge machining.

<span class="mw-page-title-main">Tantalum carbide</span> Chemical compound

Tantalum carbides (TaC) form a family of binary chemical compounds of tantalum and carbon with the empirical formula TaCx, where x usually varies between 0.4 and 1. They are extremely hard, brittle, refractory ceramic materials with metallic electrical conductivity. They appear as brown-gray powders, which are usually processed by sintering.

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<span class="mw-page-title-main">Heat spreader</span> Device that tends to equalize temperature over its surface

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<span class="mw-page-title-main">Solid</span> State of matter

Solid is one of the four fundamental states of matter along with liquid, gas, and plasma. The molecules in a solid are closely packed together and contain the least amount of kinetic energy. A solid is characterized by structural rigidity and resistance to a force applied to the surface. Unlike a liquid, a solid object does not flow to take on the shape of its container, nor does it expand to fill the entire available volume like a gas. The atoms in a solid are bound to each other, either in a regular geometric lattice, or irregularly. Solids cannot be compressed with little pressure whereas gases can be compressed with little pressure because the molecules in a gas are loosely packed.

<span class="mw-page-title-main">Ceramic matrix composite</span> Composite material consisting of ceramic fibers in a ceramic matrix

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Dymalloy is a metal matrix composite of 20% copper and 80% silver alloy matrix with type I diamond. It has a very high thermal conductivity of 420 W/(m·K), and its thermal expansion can be adjusted to match other materials, e.g., silicon and gallium arsenide chips. It is chiefly used in microelectronics as a substrate for high-power and high-density multi-chip modules, where it aids with removing waste heat.

Copper–tungsten is a mixture of copper and tungsten. As copper and tungsten are not mutually soluble, the material is composed of distinct particles of one metal dispersed in a matrix of the other one. The microstructure is therefore rather a metal matrix composite instead of a true alloy.

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<span class="mw-page-title-main">MAX phases</span>

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SiC–SiC matrix composite is a particular type of ceramic matrix composite (CMC) which have been accumulating interest mainly as high temperature materials for use in applications such as gas turbines, as an alternative to metallic alloys. CMCs are generally a system of materials that are made up of ceramic fibers or particles that lie in a ceramic matrix phase. In this case, a SiC/SiC composite is made by having a SiC matrix phase and a fiber phase incorporated together by different processing methods. Outstanding properties of SiC/SiC composites include high thermal, mechanical, and chemical stability while also providing high strength to weight ratio.

6005A aluminium alloy is an alloy in the wrought aluminium-magnesium-silicon family. It is closely related, but not identical, to 6005 aluminium alloy. Between those two alloys, 6005A is more heavily alloyed, but the difference does not make a marked impact on material properties. It can be formed by extrusion, forging or rolling, but as a wrought alloy it is not used in casting. It cannot be work hardened, but is commonly heat treated to produce tempers with a higher strength at the expense of ductility.

References

  1. 1 2 "Packaged for the Road". Memagazine.org. Archived from the original on 13 February 2010. Retrieved 7 February 2010.
  2. "Microsoft Word - data_sheet.doc" (PDF). Archived from the original (PDF) on 2011-07-24. Retrieved 2010-02-07.
  3. Mark Occhionero, Richard Adams, Kevin Fennessy, and Robert A. Hay, Aluminum Silicon Carbide (AlSiC) for Advanced Microelectronic Packages Archived 2011-07-23 at the Wayback Machine , IMAPS May 1998 Boston Meeting
  4. Vogelsang, Mary; Arsenault, R. J.; Fisher, R. M. (1986). "An in situ HVEM study of dislocation generation at Al/SiC interfaces in metal matrix composites". Metallurgical Transactions A. 17 (3): 379. Bibcode:1986MTA....17..379V. doi:10.1007/BF02643944.