An alloy is a mixture of chemical elements of which in most cases at least one is a metallic element, although it is also sometimes used for mixtures of elements; herein only metallic alloys are described. Most alloys are metallic and show good electrical conductivity, ductility, opacity, and luster, and may have properties that differ from those of the pure elements such as increased strength or hardness. In some cases, an alloy may reduce the overall cost of the material while preserving important properties. In other cases, the mixture imparts synergistic properties such as corrosion resistance or mechanical strength.
A metal is a material that, when polished or fractured, shows a lustrous appearance, and conducts electricity and heat relatively well. These properties are all associated with having electrons available at the Fermi level, as against nonmetallic materials which do not. Metals are typically ductile and malleable.
Solder is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics.
Cupronickel or copper–nickel (CuNi) is an alloy of copper with nickel, usually along with small quantities of other elements added for strength, such as iron and manganese. The copper content typically varies from 60 to 90 percent.
Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding can also be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another, although these are less common. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. Wire bonding can be used at frequencies above 100 GHz.
Brazing is a metal-joining process in which two or more metal items are joined by melting and flowing a filler metal into the joint, with the filler metal having a lower melting point than the adjoining metal.
Group 10, numbered by current IUPAC style, is the group of chemical elements in the periodic table that consists of nickel (Ni), palladium (Pd), platinum (Pt), and darmstadtium (Ds). All are d-block transition metals. All known isotopes of darmstadtium are radioactive with short half-lives, and are not known to occur in nature; only minute quantities have been synthesized in laboratories.
Anodizing is an electrolytic passivation process used to increase the thickness of the natural oxide layer on the surface of metal parts.
In modern Western body piercing, a wide variety of materials are used. Some cannot be autoclaved, and others may induce allergic reactions, or harbour bacteria. Certain countries, such as those belonging to the EU, have legal regulations specifying which materials can be used in new piercings.
Plating is a finishing process in which a metal is deposited on a surface. Plating has been done for hundreds of years; it is also critical for modern technology. Plating is used to decorate objects, for corrosion inhibition, to improve solderability, to harden, to improve wearability, to reduce friction, to improve paint adhesion, to alter conductivity, to improve IR reflectivity, for radiation shielding, and for other purposes. Jewelry typically uses plating to give a silver or gold finish.
An intermetallic is a type of metallic alloy that forms an ordered solid-state compound between two or more metallic elements. Intermetallics are generally hard and brittle, with good high-temperature mechanical properties. They can be classified as stoichiometric or nonstoichiometic intermetallic compounds.
Gold plating is a method of depositing a thin layer of gold onto the surface of another metal, most often copper or silver, by a chemical or electrochemical (electroplating) process. Plating refers to modern coating methods, such as the ones used in the electronics industry, whereas gilding is the decorative covering of an object with gold, which typically involve more traditional methods and much larger objects.
Aluminium bronze is a type of bronze in which aluminium is the main alloying metal added to copper, in contrast to standard bronze or brass. A variety of aluminium bronzes of differing compositions have found industrial use, with most ranging from 5% to 11% aluminium by weight, the remaining mass being copper; other alloying agents such as iron, nickel, manganese, and silicon are also sometimes added to aluminium bronzes.
Electroless nickel-phosphorus plating, also referred to as E-nickel, is a chemical process that deposits an even layer of nickel-phosphorus alloy on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing nickel salt and a phosphorus-containing reducing agent, usually a hypophosphite salt. It is the most common version of electroless nickel plating and is often referred by that name. A similar process uses a borohydride reducing agent, yielding a nickel-boron coating instead.
A native metal is any metal that is found pure in its metallic form in nature. Metals that can be found as native deposits singly or in alloys include antimony, arsenic, bismuth, cadmium, chromium, cobalt, indium, iron, manganese, molybdenum, nickel, niobium, rhenium, tantalum, tellurium, tin, titanium, tungsten, vanadium, and zinc, as well as the gold group and the platinum group. Among the alloys found in native state have been brass, bronze, pewter, German silver, osmiridium, electrum, white gold, silver-mercury amalgam, and gold-mercury amalgam.
Gold–aluminium intermetallic is a type of intermetallic compound of gold and aluminium that usually forms at contacts between the two metals. Gold–aluminium intermetallic have different properties from the individual metals, such as low conductivity and high melting point depending on their composition. Due to the difference of density between the metals and intermetallics, the growth of the intermetallic layers causes reduction in volume, and therefore creates gaps in the metal near the interface between gold and aluminium.
Glass-to-metal seals are a type of mechanical seal which joins glass and metal surfaces. They are very important elements in the construction of vacuum tubes, electric discharge tubes, incandescent light bulbs, glass-encapsulated semiconductor diodes, reed switches, glass windows in metal cases, and metal or ceramic packages of electronic components.
The coinage metals comprise those metallic chemical elements and alloys which have been used to mint coins. Historically, most coinage metals are from the three nonradioactive members of group 11 of the periodic table: copper, silver and gold. Copper is usually augmented with tin or other metals to form bronze. Gold, silver and bronze or copper were the principal coinage metals of the ancient world, the medieval period and into the late modern period when the diversity of coinage metals increased. Coins are often made from more than one metal, either using alloys, coatings (cladding/plating) or bimetallic configurations. While coins are primarily made from metal, some non-metallic materials have also been used.
Native element minerals are those elements that occur in nature in uncombined form with a distinct mineral structure. The elemental class includes metals, intermetallic compounds, alloys, metalloids, and nonmetals. The Nickel–Strunz classification system also includes the naturally occurring phosphides, silicides, nitrides, carbides, and arsenides.
