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General information | |
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Launched | June 18, 2020 |
Product code | 80706 |
Cache | |
L1 cache | 64 KiB per core (32 instructions + 32 data) |
L2 cache | 1 MiB per core |
L3 cache | Up to 38.5 MiB (1.375 MiB/core) |
Architecture and classification | |
Min. feature size | 14 nm (Tri-Gate) transistors |
Architecture | x86-64 |
Instructions | x86-64 |
Extensions | |
Physical specifications | |
Cores |
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GPU(s) | None |
Socket(s) |
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Products, models, variants | |
Brand name(s) |
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History | |
Predecessor | Cascade Lake |
Successor | Same generation
Next generation |
Cooper Lake is Intel's codename for the third-generation of their Xeon scalable processors, developed as the successor to Cascade Lake. It is being targeted at the 4S and 8S segments of the server market. [1]
Cooper Lake was launched on June 18, 2020 and features up to 28 cores. [2] Cooper Lake features faster memory support (DDR4-3200 over DDR4-2933), support for second-generation Optane memory, and double the UPI links over Cascade Lake. [1] Cooper Lake is the first x86 CPU to support the new bfloat16 instruction set as a part of Intel's Deep Learning Boost.
Model number | sSpec number | Cores (threads) | Frequency | Turbo Boost all-core/2.0 (/max. 3.0) | L2 cache | L3 cache | TDP | Socket | I/O bus | Memory | Release date | Part number(s) | Release price (USD) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Xeon Gold 5318H |
| 18 (36) | 2.5 GHz | ?/3.8 GHz | 18 × 1 MiB | 24.75 MiB | 150 W | LGA 4189 | 6× 10.4 GT/s UPI | 6× DDR4-2666 | 18 June 2020 |
| $1273 |
Xeon Gold 5320H |
| 20 (40) | 2.4 GHz | ?/4.2 GHz | 20 × 1 MiB | 27.5 MiB | 150 W | LGA 4189 | 6× 10.4 GT/s UPI | 6× DDR4-2666 | 18 June 2020 |
| $1555 |
Xeon Gold 6328H |
| 16 (32) | 2.8 GHz | ?/4.3 GHz | 16 × 1 MiB | 22 MiB | 165 W | LGA 4189 | 6× 10.4 GT/s UPI | 6× DDR4-2933 | 18 June 2020 |
| $1776 |
Xeon Gold 6328HL |
| 16 (32) | 2.8 GHz | ?/4.3 GHz | 16 × 1 MiB | 22 MiB | 165 W | LGA 4189 | 6× 10.4 GT/s UPI | 6× DDR4-2933 | 18 June 2020 |
| $4779 |
Xeon Gold 6330H |
| 24 (48) | 2 GHz | ?/3.7 GHz | 24 × 1 MiB | 33 MiB | 150 W | LGA 4189 | 6× 10.4 GT/s UPI | 6× DDR4-2933 | 1 September 2020 |
| $1894 |
Xeon Gold 6348H |
| 24 (48) | 2.3 GHz | ?/4.2 GHz | 24 × 1 MiB | 33 MiB | 165 W | LGA 4189 | 6× 10.4 GT/s UPI | 6× DDR4-2933 | 18 June 2020 |
| $2700 |
Model number | sSpec number | Cores (threads) | Frequency | Turbo Boost all-core/2.0 (/max. 3.0) | L2 cache | L3 cache | TDP | Socket | I/O bus | Memory | Release date | Part number(s) | Release price (USD) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Xeon Platinum 8353H |
| 18 (36) | 2.5 GHz | ?/3.8 GHz | 18 × 1 MiB | 24.75 MiB | 150 W | LGA 4189 | 6× 10.4 GT/s UPI | 6× DDR4-3200 | 18 June 2020 |
| $3003 |
Xeon Platinum 8354H |
| 18 (36) | 3.1 GHz | ?/4.3 GHz | 18 × 1 MiB | 24.75 MiB | 205 W | LGA 4189 | 6× 10.4 GT/s UPI | 6× DDR4-3200 | 18 June 2020 |
| $3500 |
Xeon Platinum 8356H |
| 8 (16) | 3.9 GHz | ?/4.4 GHz | 8 × 1 MiB | 35.75 MiB | 190 W | LGA 4189 | 6× 10.4 GT/s UPI | 6× DDR4-2933 | 1 September 2020 |
| $3400 |
Xeon Platinum 8360H |
| 24 (48) | 3 GHz | ?/4.2 GHz | 24 × 1 MiB | 33 MiB | 225 W | LGA 4189 | 6× 10.4 GT/s UPI | 6× DDR4-3200 | 1 September 2020 |
| $4200 |
Xeon Platinum 8360HL |
| 24 (48) | 3 GHz | ?/4.2 GHz | 24 × 1 MiB | 33 MiB | 225 W | LGA 4189 | 6× 10.4 GT/s UPI | 6× DDR4-3200 | 1 September 2020 |
| $7203 |
Xeon Platinum 8376H |
| 28 (56) | 2.6 GHz | ?/4.3 GHz | 28 × 1 MiB | 38.5 MiB | 205 W | LGA 4189 | 6× 10.4 GT/s UPI | 6× DDR4-3200 | 18 June 2020 |
| $8719 |
Xeon Platinum 8376HL |
| 28 (56) | 2.6 GHz | ?/4.3 GHz | 28 × 1 MiB | 38.5 MiB | 205 W | LGA 4189 | 6× 10.4 GT/s UPI | 6× DDR4-3200 | 18 June 2020 |
| $11,722 |
Xeon Platinum 8380H |
| 28 (56) | 2.9 GHz | ?/4.3 GHz | 28 × 1 MiB | 38.5 MiB | 250 W | LGA 4189 | 6× 10.4 GT/s UPI | 6× DDR4-3200 | 18 June 2020 |
| $10,009 |
Xeon Platinum 8380HL |
| 28 (56) | 2.9 GHz | ?/4.3 GHz | 28 × 1 MiB | 38.5 MiB | 250 W | LGA 4189 | 6× 10.4 GT/s UPI | 6× DDR4-3200 | 18 June 2020 |
| $13,012 |
Xeon is a brand of x86 microprocessors designed, manufactured, and marketed by Intel, targeted at the non-consumer workstation, server, and embedded system markets. It was introduced in June 1998. Xeon processors are based on the same architecture as regular desktop-grade CPUs, but have advanced features such as support for ECC memory, higher core counts, support for larger amounts of RAM, larger cache memory and extra provision for enterprise-grade reliability, availability and serviceability (RAS) features responsible for handling hardware exceptions through the Machine Check Architecture. They are often capable of safely continuing execution where a normal processor cannot due to these extra RAS features, depending on the type and severity of the machine-check exception (MCE). Some also support multi-socket systems with two, four, or eight sockets through use of the Quick Path Interconnect (QPI) bus.
Altix is a line of server computers and supercomputers produced by Silicon Graphics, based on Intel processors. It succeeded the MIPS/IRIX-based Origin 3000 servers.
Intel Core are streamlined midrange consumer, workstation and enthusiast computers central processing units (CPU) marketed by Intel Corporation. These processors displaced the existing mid- to high-end Pentium processors at the time of their introduction, moving the Pentium to the entry level, and bumping the Celeron series of processors to the low end. Identical or more capable versions of Core processors are also sold as Xeon processors for the server and workstation markets.
LGA 2011, also called Socket R, is a CPU socket by Intel. Released on November 14, 2011, it replaces Intel's LGA 1366 and LGA 1567 in the performance and high-end desktop and server platforms. The socket has 2011 protruding pins that touch contact points on the underside of the processor.
LGA 1567 or Socket LS, is a CPU socket used for the high-end server segment. It has 1567 protruding pins to make contact with the pads on the processor. It supports Intel Nehalem, codenamed Beckton, Xeon 7500 and Xeon 6500 series processors first released in March 2010. The 6500 series is scalable up to 2 sockets, while the 7500 series is scalable up to 4/8 sockets on a supporting motherboard. In this server segment, it is a successor of Socket 604, which was first launched in 2002. A modification of LGA 2011, the LGA 2011-1 or Socket R2, is a successor of LGA 1567.
Skylake is the codename used by Intel for a processor microarchitecture that was launched in August 2015 succeeding the Broadwell microarchitecture. Skylake is a microarchitecture redesign using the same 14 nm manufacturing process technology as its predecessor, serving as a "tock" in Intel's "tick–tock" manufacturing and design model. According to Intel, the redesign brings greater CPU and GPU performance and reduced power consumption. Skylake CPUs share their microarchitecture with Kaby Lake, Coffee Lake, Cannon Lake, Whiskey Lake, and Comet Lake CPUs.
Ivy Bridge is the codename for the "third generation" of the Intel Core processors. Ivy Bridge is a die shrink to 22 nanometer manufacturing process based on the 32 nanometer Sandy Bridge —see tick–tock model. The name is also applied more broadly to the 22 nm die shrink of the Sandy Bridge microarchitecture based on FinFET ("3D") Tri-Gate transistors, which is also used in the Xeon and Core i7 Ivy Bridge-EX (Ivytown), Ivy Bridge-EP and Ivy Bridge-E microprocessors released in 2013.
LGA 1151, also known as Socket H4, is an Intel microprocessor compatible socket which comes in two distinct versions: the first revision which supports both Intel's Skylake and Kaby Lake CPUs, and the second revision which supports Coffee Lake CPUs exclusively.
Zen is the codename for the first iteration in a family of computer processor microarchitectures of the same name from AMD. It was first used with their Ryzen series of CPUs in February 2017. The first Zen-based preview system was demonstrated at E3 2016, and first substantially detailed at an event hosted a block away from the Intel Developer Forum 2016. The first Zen-based CPUs codenamed "Summit Ridge" reached the market in early March 2017, Zen-derived Epyc server processors launched in June 2017 and Zen-based APUs arrived in November 2017.
Kaby Lake is Intel's codename for its seventh generation Core microprocessor family announced on August 30, 2016. Like the preceding Skylake, Kaby Lake is produced using a 14 nanometer manufacturing process technology. Breaking with Intel's previous "tick–tock" manufacturing and design model, Kaby Lake represents the optimized step of the newer process–architecture–optimization model. Kaby Lake began shipping to manufacturers and OEMs in the second quarter of 2016, and mobile chips have started shipping while Kaby Lake (desktop) chips were officially launched in January 2017.
3D XPoint is a non-volatile memory (NVM) technology developed jointly by Intel and Micron Technology. It was announced in July 2015 and is available on the open market under the brand name Optane (Intel) since April 2017. Bit storage is based on a change of bulk resistance, in conjunction with a stackable cross-gridded data access array. Initial prices are less than dynamic random-access memory (DRAM) but more than flash memory.
Ice Lake is Intel's codename for the 10th generation Intel Core mobile processors based on the new Sunny Cove Core microarchitecture. Ice Lake represents an Architecture step in Intel's Process-Architecture-Optimization model. Ice Lake CPUs are sold together with the 14 nm Comet Lake CPUs as Intel's "10th Generation Core" product family.
EPYC is a brand of x86-64 microprocessors designed and sold by AMD, based on the company's Zen microarchitecture. Introduced in June 2017, they are specifically targeted for the server and embedded system markets. Epyc processors share the same microarchitecture as their regular desktop-grade counterparts, but have enterprise-grade features such as higher core counts, more PCI Express lanes, support for larger amounts of RAM, and larger cache memory. They also support multi-chip and dual-socket system configurations by using Infinity Fabric interchip interconnect.
Sapphire Rapids is the Intel CPU microarchitecture based on the 3rd refinement of the 10 nanometer process. Sapphire Rapids CPUs are designed for data centers, in the Xeon lineup; the roughly contemporary Alder Lake is intended for the wider public.
Cascade Lake is an Intel codename for a 14 nanometer server, workstation and enthusiast processor microarchitecture, launched in April 2019. In Intel's Process-Architecture-Optimization model, Cascade Lake is an optimization of Skylake. Intel states that this will be their first microarchitecture to support 3D XPoint-based memory modules. It also features Deep Learning Boost instructions and mitigations for Meltdown and Spectre. Intel officially launched new Xeon Scalable SKUs on February 24, 2020.
Comet Lake is Intel's codename for its 10th generation Core microprocessors. They are manufactured using Intel's third 14 nm Skylake process refinement, succeeding the Whiskey Lake U-series mobile processor and Coffee Lake desktop processor families. Intel announced low-power mobile Comet Lake-U CPUs on August 21, 2019, H-series mobile CPUs on April 2, 2020, desktop Comet Lake-S CPUs April 30, 2020, and Xeon W-1200 series workstation CPUs on May 13, 2020. Comet Lake processors and Ice Lake 10 nm processors are together branded as the Intel "10th Generation Core" family. Intel officially launched Comet Lake-Refresh CPUs on the same day as 11th Gen Core Rocket Lake launch.
Rocket Lake is a codename for Intel’s desktop x86 chip family to be released on March 30, 2021. It is based on the new Cypress Cove microarchitecture, a variant of Sunny Cove backported to the older 14nm process. The chips will be marketed as "Intel 11th generation Core". The Rocket Lake cores contain significantly more transistors than current Skylake-derived Comet Lake cores.