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Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as microprocessors, microcontrollers, and memories. It is a multiple-step photolithographic and physico-chemical process during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.
The transistor count is the number of transistors in an electronic device. It is the most common measure of integrated circuit complexity. The rate at which MOS transistor counts have increased generally follows Moore's law, which observes that transistor count doubles approximately every two years. However, being directly proportional to the area of a die, transistor count does not represent how advanced the corresponding manufacturing technology is. A better indication of this is transistor density which is the ratio of a semiconductor's transistor count to its die area.
The "22 nm" node is the process step following 32 nm in CMOS MOSFET semiconductor device fabrication. The typical half-pitch for a memory cell using the process is around 22 nm. It was first demonstrated by semiconductor companies for use in RAM in 2008. In 2010, Toshiba began shipping 24 nm flash memory chips, and Samsung Electronics began mass-producing 20 nm flash memory chips. The first consumer-level CPU deliveries using a 22 nm process started in April 2012 with the Intel Ivy Bridge processors.
The "14 nanometer process" refers to a marketing term for the MOSFET technology node that is the successor to the "22 nm" node. The "14 nm" was so named by the International Technology Roadmap for Semiconductors (ITRS). Until about 2011, the node following "22 nm" was expected to be "16 nm". All "14 nm" nodes use FinFET technology, a type of multi-gate MOSFET technology that is a non-planar evolution of planar silicon CMOS technology.
A multigate device, multi-gate MOSFET or multi-gate field-effect transistor (MuGFET) refers to a metal–oxide–semiconductor field-effect transistor (MOSFET) that has more than one gate on a single transistor. The multiple gates may be controlled by a single gate electrode, wherein the multiple gate surfaces act electrically as a single gate, or by independent gate electrodes. A multigate device employing independent gate electrodes is sometimes called a multiple-independent-gate field-effect transistor (MIGFET). The most widely used multi-gate devices are the FinFET and the GAAFET, which are non-planar transistors, or 3D transistors.
Intel Core is a line of multi-core central processing units (CPUs) for midrange, embedded, workstation, high-end and enthusiast computer markets marketed by Intel Corporation. These processors displaced the existing mid- to high-end Pentium processors at the time of their introduction, moving the Pentium to the entry level. Identical or more capable versions of Core processors are also sold as Xeon processors for the server and workstation markets.
In semiconductor manufacturing, the International Roadmap for Devices and Systems defines the "5 nm" process as the MOSFET technology node following the "7 nm" node. In 2020, Samsung and TSMC entered volume production of "5 nm" chips, manufactured for companies including Apple, Huawei, Mediatek, Qualcomm and Marvell.
In semiconductor manufacturing, the "7 nm" process is a term for the MOSFET technology node following the "10 nm" node, defined by the International Roadmap for Devices and Systems (IRDS), which was preceded by the International Technology Roadmap for Semiconductors (ITRS). It is based on FinFET technology, a type of multi-gate MOSFET technology.
HiSilicon is a Chinese fabless semiconductor company based in Shenzhen, Guangdong province and wholly owned by Huawei. HiSilicon purchases licenses for CPU designs from ARM Holdings, including the ARM Cortex-A9 MPCore, ARM Cortex-M3, ARM Cortex-A7 MPCore, ARM Cortex-A15 MPCore, ARM Cortex-A53, ARM Cortex-A57 and also for their Mali graphics cores. HiSilicon has also purchased licenses from Vivante Corporation for their GC4000 graphics core.
Zen 2 is a computer processor microarchitecture by AMD. It is the successor of AMD's Zen and Zen+ microarchitectures, and is fabricated on the 7 nm MOSFET node from TSMC. The microarchitecture powers the third generation of Ryzen processors, known as Ryzen 3000 for the mainstream desktop chips, Ryzen 4000U/H and Ryzen 5000U for mobile applications, as Threadripper 3000 for high-end desktop systems, and as Ryzen 4000G for accelerated processing units (APUs). The Ryzen 3000 series CPUs were released on 7 July 2019, while the Zen 2-based Epyc server CPUs were released on 7 August 2019. An additional chip, the Ryzen 9 3950X, was released in November 2019.
Ryzen is a brand of multi-core x86-64 microprocessors, designed and marketed by AMD for desktop, mobile, server, and embedded platforms, based on the Zen microarchitecture. It consists of central processing units (CPUs) marketed for mainstream, enthusiast, server, and workstation segments, and accelerated processing units (APUs), marketed for mainstream and entry-level segments, and embedded systems applications.
Process–architecture–optimization is a development model for central processing units (CPUs) that Intel adopted in 2016. Under this three-phase (three-year) model, every microprocessor die shrink is followed by a microarchitecture change and then by one or more optimizations. It replaced the two-phase (two-year) tick–tock model that Intel adopted in 2006. The tick–tock model was no longer economically sustainable, according to Intel, because production of ever smaller dies becomes ever more costly.
In semiconductor manufacturing, the 3 nm process is the next die shrink after the 5 nm MOSFET technology node. South Korean chipmaker Samsung started shipping its 3 nm gate all around (GAA) process, named 3GAA, in mid-2022. On 29 December 2022, Taiwanese chip manufacturer TSMC announced that volume production using its 3 nm semiconductor node (N3) was underway with good yields. An enhanced 3 nm chip process called "N3E" may have started production in 2023. American manufacturer Intel planned to start 3 nm production in 2023.
Zen 4 is the name for a CPU microarchitecture designed by AMD, released on September 27, 2022. It is the successor to Zen 3 and uses TSMC's N6 process for I/O dies, N5 process for CCDs, and N4 process for APUs. Zen 4 powers Ryzen 7000 performance desktop processors, Ryzen 8000G series mainstream desktop APUs, and Ryzen Threadripper 7000 series HEDT and workstation processors. It is also used in extreme mobile processors, thin & light mobile processors, as well as EPYC 8004/9004 server processors.
Zen 5 is the name for a CPU microarchitecture by AMD, shown on their roadmap in May 2022, launched for mobile in July 2024 and for desktop in August 2024. It is the successor to Zen 4 and is currently fabricated on TSMC's N4X process. Zen 5 is also planned to be fabricated on the N3E process in the future.
In semiconductor manufacturing, the 2 nm process is the next MOSFET die shrink after the 3 nm process node.
Arrow Lake is the codename for Core Ultra Series 2 processors designed by Intel, released on October 24, 2024. It follows on from Meteor Lake which saw Intel move from monolithic silicon to a disaggregated MCM design. Meteor Lake was limited to a mobile release while Arrow Lake includes both socketable desktop processors and mainstream and enthusiast mobile processors. Core Ultra 200H and 200HX series mobile processors will follow in early 2025. Arrow Lake desktop CPUs integrated Thunderbolt 4 and USB4 in the CPU, which allowed it to not waste PCIe 3 lanes and use simple retimers instead. The chipset has the same maximum 5 integrated USB 3.2 2x2, and is Thunderbolt 5 ready if discrete board is used. Integrated GPU added HDMI 2.1 FRL 48 gbit/s and variable refresh rate. CU-DIMM DDR5 memory support was added and is needed for optimal performance.
Meteor Lake is the codename for Core Ultra Series 1 mobile processors, designed by Intel and officially released on December 14, 2023. It is the first generation of Intel mobile processors to use a chiplet architecture which means that the processor is a multi-chip module. Meteor Lake's design effort was led by Tim Wilson.
Lunar Lake is the codename for Core Ultra 200V Series mobile processors designed by Intel, released in September 2024. It is a successor to Meteor Lake which saw Intel move from monolithic silicon to a disaggregated MCM design.
References
- ↑ "The Intel Innovation 2023 Keynote Live Blog". AnandTech. September 19, 2023. Archived from the original on September 19, 2023. Retrieved September 22, 2023.
- 1 2 "Intel Accelerates 'AI Everywhere' at Computex 2024". Intel.
- ↑ "Kevin O'Buckley Talks Progress on Intel 18A".
- ↑ "Intel Process foundry".
- ↑ "Intel chiplets".
- ↑ "Samsung's 3-nm Tech Shows Nanosheet Transistor Advantage".
- ↑ "Intel Powervia".
- ↑ "Intel Is All-In on Backside Power Delivery".
- ↑ "The AI PC Powered by Intel is Here. Now, AI is for Everyone". Intel.
- ↑ "How to Check If My Intel® Processor Has an Integrated Neural Processing Unit (NPU)".
- ↑ "Microsoft CoPilot".