List of Intel manufacturing sites

Intel is an American multinational corporation and technology company headquartered in Santa Clara, California. Processors are manufactured in semiconductor fabrication plants called "fabs" which are then sent to assembly and testing sites before delivery to customers. Intel has stated that approximately 75% of their semiconductor fabrication is performed in the United States. ^[1]

Since May 1990, Intel has made an effort to eliminate chlorofluorocarbon consumption for the Oregon, Puerto Rico and Ireland system factories. ^[2]

Both Schumacher a division of Air Products & Chemicals and Intel developed chemical that reduce ozone emission using TRANS-LC or trans 1, 2-dichloroethylene to replace from TCA or 1,1,1-Trichloroethane to grow defect free silicon oxide surfaces. ^[3]

The Oregon Governor's Award for Toxics Use Reduction recognising Intel's Hillsboro facility achievement in reducing the use of toxic substance and generation of hazardous wastes. ^[4]

Current fab sites

Intel Ocotillo campus in Chandler, Arizona, U.S.

Intel Ronler Acres in Hillsboro, Oregon, United States

Intel F28 in Kiryat Gat, Israel

Fab name	Fab location	Production start year	Process (wafer, node)
AFO	Aloha, Oregon, U.S.	1976	300mm, Development
D1B	Hillsboro, Oregon, U.S.	1996	300mm, Development
RB1	Hillsboro, Oregon, U.S.	2001	300mm, Development
D1C	Hillsboro, Oregon, U.S.	2001	300mm, Development
RP1	Hillsboro, Oregon, U.S.	2001	300mm, Research
D1D	Hillsboro, Oregon, U.S.	2003	300mm, Development
D1X	Hillsboro, Oregon, U.S.	2013	300mm, Development
Fab 11X	Rio Rancho, New Mexico, U.S.	1995 upgrade 2020/2021 with 22/14	300mm, 45 nm/32 nm, Packaging
Fab 12	Chandler, Arizona, U.S.	2006	300mm, 22 nm/14 nm/10 nm
Fab 22	Chandler, Arizona, U.S.	2002	300mm, 22 nm/14 nm/10 nm
Fab 24	Leixlip, Ireland	2006	300mm, 14 nm [5]
Fab 28a	Kiryat Gat, Israel	1996	300mm, 22 nm
Fab 28	Kiryat Gat, Israel	(2023)	300mm, 22nm/14nm/10nm [6] [7]
Fab 38	Kiryat Gat, Israel	(2024)	300mm, 22 nm [8]
Fab 32	Chandler, Arizona, U.S.	2007	300mm, 22 nm/14 nm/10 nm
Fab 34	Leixlip, Ireland	2023	300mm, Intel 4 (previously node 7nm) [9] [10]
Fab 42	Chandler, Arizona, U.S.	2020	300mm, 10 nm/5 nm (2024)
Fab 52	Chandler, Arizona, U.S.	(2024) [11]	300mm, 18A
Fab 62	Chandler, Arizona, U.S.	(2024) [11]	300mm
Fab 27 [12]	Licking County, Ohio, U.S.	(2030–2032)	300mm, 14A
SC2	Santa Clara, California, U.S.		Reticle/Masks, Intel Mask Operations [13]
Pelican	Penang, Malaysia	(2024)	300mm, Packaging [14]
Fab 29	Magdeburg, Saxony-Anhalt, Germany	(2027)	[15]
	Poland	(2025–2027)	300mm, Packaging [16]

Past fab sites

Fab name	Fab location	Opened	Closed	Notes
Fab 1	Mountain View, California, U.S.	1968	1981	Formerly located at 365 East Middlefield Road. [17]
Fab 2	Santa Clara, California, U.S.	1968	2009	Located in building SC1, at the corner of Bowers Ave. and Central Expressway [18]
Fab 1A	Santa Clara, California, U.S.	1980	1991	Located on Mission College Boulevard
Fab 3	Livermore, California, U.S.	1973 [19]	1991	Plant began making wafers in April 1973. First plant outside of the Santa Clara area, and is where the famous Bunny Suits were first introduced. [20] Located on North Mines Road.
Fab 4	Aloha, Oregon, U.S.	1976	1996 (decommissioned) 2016 (demolished)	First wafer manufacturing plant outside of Silicon Valley and first facility in what is now known as Oregon's Silicon Forest. Production began for 3-inch wafers. [21]
Fab 5 / D1	Aloha, Oregon, U.S.			Previously a development facility, then production facility. Currently inactive. [22]
Fab 6	Chandler, Arizona, U.S.	1980	2000	First silicon wafer manufacturing facility in Arizona. Key architecture was the 286 microprocessor.
Fab 7	Rio Rancho, New Mexico, U.S.	1980	2002 2005 (converted to test facility)	Production focused on flash memory chips. By the time production stopped, plant was producing 0.35 micron-6 inch wafers. In 2005, $105 million was invested to temporarily turn Fab 7 into a testing facility. [23]
Fab 8	Jerusalem, Israel	1985	2008 2009 (converted to die prep facility)	First Fab outside of the United States. Ended production with, what was at the time, the last 6-inch wafer fab. Building was converted into die prep facility to support nearby Fab 28. [24]
Fab 9	Rio Rancho, New Mexico, U.S.	1987		Facility eventually expanded to merge with Fab 11 in 1999. [25]
D2	Santa Clara, California, U.S.	1989 [26]	2009 (decommissioned)	Development for these EPROM, Flash memory and microcontroller technology. [27] They expanded this location which was previously used for research and development. They were manufactured by using the eight-inch wafers. They have expanded up to 300,000 square foot complex and adding the 12,000 square feet of "Class-1" clean room bringing up to total of 37,000 square feet. [28] After being decommissioned, was converted into a data center. [29]
Fab 10 / IFO [30] [31]	Leixlip, Ireland	1993		Pentium
Fab 11	Rio Rancho, New Mexico, U.S.			(Merged into F11X)
Fab 14	Leixlip, Ireland
Fab 15 / D1A	Aloha, Oregon, U.S.		2003 (converted to assembly / test)	Previously a development Fab named D1A before construction began on D1B in 1994. [32]
Fab 16	Ft. Worth, Texas, U.S.	(never opened)	2003 (canceled)	Planned to open in Ft. Worth, Texas, in 1999, but was eventually canceled in 2003. [33]
Fab 17	Hudson, Massachusetts, U.S.	1998 (acquired from DEC)	2014	Facility used older technology and closed (along with Fab 11X) because site was not large enough to accommodate a leading-edge fab. Made specialty products on the trailing edge of chip technology, and was last to make chips on 200-millimeter silicon wafers. [34]
Fab 20 / D1B	, Hillsboro, Oregon, U.S.
Fab 23	Colorado Springs, Colorado, U.S.	2000 (acquired from Rockwell)	2007	Site originally purchased from Rockwell, but due to lack of demand and for financial reasons, Intel put it up for sale in 2007. It eventually sold in 2011 to the El Paso County government, who repurposed the offices. [35]
Fab 68	Dalian, Liaoning, China	2010/2016	2021	3DNAND, 3DXPoint [36] [37] fab that was sold to SK Hynix [38]

Assembly and test sites

• AFO, Aloha, Oregon, United States
• Chandler, Arizona, United States
• CD1, Chengdu, Sichuan, China
• CD6, Chengdu, Sichuan, China
• KMDSDP, Kulim, Malaysia
• KMO, Kulim, Malaysia
• KM5, Kulim, Malaysia
• PG8, Penang, Malaysia
• VNAT, Ho Chi Minh City, Vietnam
• Jerusalem, Israel
• CRAT, Heredia, Belén, Costa Rica (1997–2014; 2020 – present) ^{[39] [40]}
• Makati, Philippines – MN1-MN5 also known as A2/T11 (1974–2009)
• Cavite, Philippines – CV1-CV4 (1997–2009)
• Shanghai, China (former Assembly / Test Manufacturing)
• Las Piedras Puerto Rico 1991-2001 (assemble Pentium CPU/Motherboards)
• Wroclaw/Walbrzych, Poland - planned 2027 (former Assembly / Test Manufacturing)

See also

• List of semiconductor fabrication plants

External links

Global Manufacturing at Intel

References

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