Intel is an American multinational corporation and technology company headquartered in Santa Clara, California. Processors are manufactured in semiconductor fabrication plants called "fabs" which are then sent to assembly and testing sites before delivery to customers. Intel has claimed that approximately 75% of their semiconductor fabrication is performed in the United States. [1]
Intel have made effort to eliminate chlorofluorocarbon consumption for the Oregon, Puerto Rico and Ireland system factories since May 1990. [2]
Fab name | Fab location | Production start year | Process (wafer, node) |
---|---|---|---|
AFO | Aloha, Oregon, U.S. | 1976 | 300mm, Development |
D1B | Hillsboro, Oregon, U.S. | 1996 | 300mm, Development |
RB1 | Hillsboro, Oregon, U.S. | 2001 | 300mm, Development |
D1C | Hillsboro, Oregon, U.S. | 2001 | 300mm, Development |
RP1 | Hillsboro, Oregon, U.S. | 2001 | 300mm, Research |
D1D | Hillsboro, Oregon, U.S. | 2003 | 300mm, Development |
D1X | Hillsboro, Oregon, U.S. | 2013 | 300mm, Development |
Fab 11X | Rio Rancho, New Mexico, U.S. | 1995 upgrade 2020/2021 with 22/14 | 300mm, 45 nm/32 nm, Packaging |
Fab 12 | Chandler, Arizona, U.S. | 2006 | 300mm, 22 nm/14 nm/10 nm |
Fab 22 | Chandler, Arizona, U.S. | 2002 | 300mm, 22 nm/14 nm/10 nm |
Fab 24 | Leixlip, Ireland | 2006 | 300mm, 14 nm [3] |
Fab 28a | Kiryat Gat, Israel | 1996 | 300mm, 22 nm |
Fab 28 | Kiryat Gat, Israel | (2023) | 300mm, 22nm/14nm/10nm [4] [5] |
Fab 38 | Kiryat Gat, Israel | (2024) | 300mm, 22 nm [6] |
Fab 32 | Chandler, Arizona, U.S. | 2007 | 300mm, 22 nm/14 nm/10 nm |
Fab 34 | Leixlip, Ireland | 2023 | 300mm, Intel 4 (previously node 7nm) [7] [8] |
Fab 42 | Chandler, Arizona, U.S. | 2020 | 300mm, 10 nm/5 nm (2024) |
Fab 52 | Chandler, Arizona, U.S. | (2024) [9] | 300mm |
Fab 62 | Chandler, Arizona, U.S. | (2024) [9] | 300mm |
Fab 27 [10] | Licking County, Ohio, U.S. | (2024–2026) | 300mm, 18A |
SC2 | Santa Clara, California, U.S. | Reticle/Masks, Intel Mask Operations [11] | |
Pelican | Penang, Malaysia | (2024) | 300mm, Packaging [12] |
Fab 29 | Magdeburg, Saxony-Anhalt, Germany | (2027) | [13] |
Poland | (2025–2027) | 300mm, Packaging [14] |
Fab name | Fab location | Opened | Closed | Notes |
---|---|---|---|---|
Fab 1 | Mountain View, California, U.S. | 1968 | 1981 | Formerly located at 365 East Middlefield Road. [15] |
Fab 2 | Santa Clara, California, U.S. | 1968 | 2009 | Located in building SC1, at the corner of Bowers Ave. and Central Expressway [16] |
Fab 1A | Santa Clara, California, U.S. | 1980 | 1991 | Located on Mission College Boulevard |
Fab 3 | Livermore, California, U.S. | 1973 [17] | 1991 | Plant began making wafers in April 1973. First plant outside of the Santa Clara area, and is where the famous Bunny Suits were first introduced. [18] Located on North Mines Road. |
Fab 4 | Aloha, Oregon, U.S. | 1976 | 1996 (decommissioned) 2016 (demolished) | First wafer manufacturing plant outside of Silicon Valley and first facility in what is now known as Oregon's Silicon Forest. Production began for 3-inch wafers. [19] |
Fab 5 / D1 | Aloha, Oregon, U.S. | Previously a development facility, then production facility. Currently inactive. [20] | ||
Fab 6 | Chandler, Arizona, U.S. | 1980 | 2000 | First silicon wafer manufacturing facility in Arizona. Key architecture was the 286 microprocessor. |
Fab 7 | Rio Rancho, New Mexico, U.S. | 1980 | 2002 2005 (converted to test facility) | Production focused on flash memory chips. By the time production stopped, plant was producing 0.35 micron-6 inch wafers. In 2005, $105 million was invested to temporarily turn Fab 7 into a testing facility. [21] |
Fab 8 | Jerusalem, Israel | 1985 | 2008 2009 (converted to die prep facility) | First Fab outside of the United States. Ended production with, what was at the time, the last 6-inch wafer fab. Building was converted into die prep facility to support nearby Fab 28. [22] |
Fab 9 | Rio Rancho, New Mexico, U.S. | 1987 | Facility eventually expanded to merge with Fab 11 in 1999. [23] | |
D2 | Santa Clara, California, U.S. | 1989 [24] | 2009 (decommissioned) | Development for these EPROM, Flash memory and microcontroller technology. [25] After being decommissioned, was converted into a data center. [26] |
Fab 10 / IFO [27] [28] | Leixlip, Ireland | 1993 | Pentium | |
Fab 11 | Rio Rancho, New Mexico, U.S. | (Merged into F11X) | ||
Fab 14 | Leixlip, Ireland | |||
Fab 15 / D1A | Aloha, Oregon, U.S. | 2003 (converted to assembly / test) | Previously a development Fab named D1A before construction began on D1B in 1994. [29] | |
Fab 16 | Ft. Worth, Texas, U.S. | (never opened) | 2003 (canceled) | Planned to open in Ft. Worth, Texas, in 1999, but was eventually canceled in 2003. [30] |
Fab 17 | Hudson, Massachusetts, U.S. | 1998 (acquired from DEC) | 2014 | Facility used older technology and closed (along with Fab 11X) because site was not large enough to accommodate a leading-edge fab. Made specialty products on the trailing edge of chip technology, and was last to make chips on 200-millimeter silicon wafers. [31] |
Fab 20 / D1B | , Hillsboro, Oregon, U.S. | |||
Fab 23 | Colorado Springs, Colorado, U.S. | 2000 (acquired from Rockwell) | 2007 | Site originally purchased from Rockwell, but due to lack of demand and for financial reasons, Intel put it up for sale in 2007. It eventually sold in 2011 to the El Paso County government, who repurposed the offices. [32] |
Fab 68 | Dalian, Liaoning, China | 2010/2016 | 2021 | 3DNAND, 3DXPoint [33] [34] fab that was sold to SK Hynix [35] |
Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California, and incorporated in Delaware. Intel designs, manufactures and sells computer components and related products for business and consumer markets. It is considered one of the world's largest semiconductor chip manufacturers by revenue and ranked in the Fortune 500 list of the largest United States corporations by revenue for nearly a decade, from 2007 to 2016 fiscal years, until it was removed from the ranking in 2018. In 2020, it was reinstated and ranked 45th, being the 7th-largest technology company in the ranking.
Atmel Corporation was a creator and manufacturer of semiconductors before being subsumed by Microchip Technology in 2016. Atmel was founded in 1984. The company focused on embedded systems built around microcontrollers. Its products included microcontrollers radio-frequency (RF) devices including Wi-Fi, EEPROM, and flash memory devices, symmetric and asymmetric security chips, touch sensors and controllers, and application-specific products. Atmel supplies its devices as standard products, application-specific integrated circuits (ASICs), or application-specific standard product (ASSPs) depending on the requirements of its customers.
STMicroelectronics NV is a multinational corporation and technology company of French-Italian origin. Incorporated in the Netherlands, its headquarters are in Plan-les-Ouates, Switzerland and it is listed on the New York Stock Exchange, the Euronext Paris and the Borsa Italiana in Milan. ST is the largest European semiconductor contract manufacturing and design company. The company resulted from the merger of two government-owned semiconductor companies in 1987: Thomson Semiconducteurs of France and SGS Microelettronica of Italy.
Kiryat Gat, also spelled Qiryat Gat, is a city in the Southern District of Israel. It lies 56 km south of Tel Aviv, 43 km (27 mi) north of Beersheba, and 68 km (42 mi) west southwest of Jerusalem. In 2022 it had a population of 64,437. The city hosts one of the most advanced semiconductor fabrication plants in the world, Intel's Fab 28 plant producing 7 nm process chips.
Renesas Electronics Corporation is a Japanese semiconductor manufacturer headquartered in Tokyo, Japan, initially incorporated in 2002 as Renesas Technology, the consolidated entity of the semiconductor units of Hitachi and Mitsubishi excluding their dynamic random-access memory (DRAM) businesses, to which NEC Electronics merged in 2010, resulting in a minor change in the corporate name and logo to as it is now.
Taiwan Semiconductor Manufacturing Company Limited is a Taiwanese multinational semiconductor contract manufacturing and design company. It is the world's second-most valuable semiconductor company, the world's largest dedicated independent ("pure-play") semiconductor foundry, and its country's largest company, with headquarters and main operations located in the Hsinchu Science Park in Hsinchu, Taiwan. Although the central government of Taiwan is the largest individual shareholder, the majority of TSMC is owned by foreign investors. In 2023, the company was ranked 44th in the Forbes Global 2000.
Micron Technology, Inc. is an American producer of computer memory and computer data storage including dynamic random-access memory, flash memory, and USB flash drives. It is headquartered in Boise, Idaho. Its consumer products, including the Ballistix line of memory modules, are marketed under the Crucial brand. Micron and Intel together created IM Flash Technologies, which produced NAND flash memory. It owned Lexar between 2006 and 2017.
Infineon Technologies AG is Germany's largest semiconductor manufacturer. The company was spun-off from Siemens AG in 1999. Infineon has about 58,600 employees in 2023 and is one of the ten largest semiconductor manufacturers worldwide. In 2023 the company achieved sales of €16.309 billion.
Intel Ireland is the Irish subsidiary of the U.S.-based semiconductor giant, Intel. Founded in 1989, the company is one of the largest employers in Ireland.
Dov Frohman is an Israeli electrical engineer and business executive. A former vice president of Intel Corporation, he is the inventor of the erasable programmable read only memory (EPROM) and the founder and first general manager of Intel Israel. He is also the author of Leadership the Hard Way.
In the microelectronics industry, a semiconductor fabrication plant is a factory for semiconductor device fabrication.
Patrick Paul Gelsinger is an American business executive and engineer, who has been the CEO of Intel since February 2021.
GlobalFoundries Inc. is a multinational semiconductor contract manufacturing and design company incorporated in the Cayman Islands and headquartered in Malta, New York. Created by the divestiture of the manufacturing arm of AMD, the company was privately owned by Mubadala Investment Company, a sovereign wealth fund of the United Arab Emirates, until an initial public offering (IPO) in October 2021.
Semiconductor consolidation is the trend of semiconductor companies collaborating in order to come to a practical synergy with the goal of being able to operate in a business model that can sustain profitability.
Tower Semiconductor Ltd. is an Israeli company that manufactures integrated circuits using specialty process technologies, including SiGe, BiCMOS, Silicon Photonics, SOI, mixed-signal and RFCMOS, CMOS image sensors, non-imaging sensors, power management (BCD), and non-volatile memory (NVM) as well as MEMS capabilities. Tower Semiconductor also owns 51% of TPSCo, an enterprise with Nuvoton Technology Corporation Japan (NTCJ).
The Kulim Hi-Tech Park is an industrial park for high technology enterprises located in Kulim District, Kedah, Malaysia. It was opened in 1996 and is Malaysia's first high-tech industrial park.
In the early twenty-first century; foreign investment, government regulations and incentives promoted growth in the Indian electronics industry. The semiconductor industry, which is its most important and resource-intensive sector, profited from the rapid growth in domestic demand. Many industries, including telecommunications, information technology, automotive, engineering, medical electronics, electricity and solar photovoltaic, defense and aerospace, consumer electronics, and appliances, required semiconductors. However, as of 2015, progress was threatened by the talent gap in the Indian sector, since 65 to 70 percent of the market was dependent on imports.
Sama Jaya Free Industrial Zone is a high tech industrial zone located in Kuching, Sarawak, Malaysia.
The CHIPS and Science Act is a U.S. federal statute enacted by the 117th United States Congress and signed into law by President Joe Biden on August 9, 2022. The act authorizes roughly $280 billion in new funding to boost domestic research and manufacturing of semiconductors in the United States, for which it appropriates $52.7 billion. The act includes $39 billion in subsidies for chip manufacturing on U.S. soil along with 25% investment tax credits for costs of manufacturing equipment, and $13 billion for semiconductor research and workforce training, with the dual aim of strengthening American supply chain resilience and countering China. It also invests $174 billion in the overall ecosystem of public sector research in science and technology, advancing human spaceflight, quantum computing, materials science, biotechnology, experimental physics, research security, social and ethical considerations, workforce development and diversity, equity, and inclusion efforts at NASA, NSF, DOE, EDA, and NIST.
{{cite news}}
: Check |archive-url=
value (help); Check |url=
value (help){{cite news}}
: Check |archive-url=
value (help); Check |url=
value (help)