Organic field-effect transistor

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OFET-based flexible display Flexible display.jpg
OFET-based flexible display
Organic CMOS logic circuit. Total thickness is less than 3 mm. Scale bar: 25 mm Organic CMOS logic circuit.jpg
Organic CMOS logic circuit. Total thickness is less than 3 μm. Scale bar: 25 mm

An organic field-effect transistor (OFET) is a field-effect transistor using an organic semiconductor in its channel. OFETs can be prepared either by vacuum evaporation of small molecules, by solution-casting of polymers or small molecules, or by mechanical transfer of a peeled single-crystalline organic layer onto a substrate. These devices have been developed to realize low-cost, large-area electronic products and biodegradable electronics. OFETs have been fabricated with various device geometries. The most commonly used device geometry is bottom gate with top drain and source electrodes, because this geometry is similar to the thin-film silicon transistor (TFT) using thermally grown SiO2 as gate dielectric. Organic polymers, such as poly(methyl-methacrylate) (PMMA), can also be used as dielectric. [1] One of the benefits of OFETs, especially compared with inorganic TFTs, is their unprecedented physical flexibility, [2] which leads to biocompatible applications, for instance in the future health care industry of personalized biomedicines and bioelectronics. [3]

Contents

In May 2007, Sony reported the first full-color, video-rate, flexible, all plastic display, [4] [5] in which both the thin-film transistors and the light-emitting pixels were made of organic materials.

History

The concept of a field-effect transistor (FET) was first proposed by Julius Edgar Lilienfeld, who received a patent for his idea in 1930. [6] He proposed that a field-effect transistor behaves as a capacitor with a conducting channel between a source and a drain electrode. Applied voltage on the gate electrode controls the amount of charge carriers flowing through the system.

The first insulated-gate field-effect transistor was designed and prepared by Mohamed Atalla and Dawon Kahng at Bell Labs using a metal–oxide–semiconductor: the MOSFET (metal–oxide–semiconductor field-effect transistor). It was invented in 1959, [7] and presented in 1960. [8] Also known as the MOS transistor, the MOSFET is the most widely manufactured device in the world. [9] [10] The concept of a thin-film transistor (TFT) was first proposed by John Wallmark who in 1957 filed a patent for a thin film MOSFET in which germanium monoxide was used as a gate dielectric. Thin-film transistor was developed in 1962 by Paul K. Weimer who implemented Wallmark's ideas. [11] The TFT is a special type of MOSFET. [12]

Rising costs of materials and manufacturing,[ citation needed ] as well as public interest in more environmentally friendly electronics materials, have supported development of organic based electronics in more recent years. In 1986, Mitsubishi Electric researchers H. Koezuka, A. Tsumura and Tsuneya Ando reported the first organic field-effect transistor, [13] [14] based on a polymer of thiophene molecules. [15] The thiophene polymer is a type of conjugated polymer that is able to conduct charge, eliminating the need to use expensive metal oxide semiconductors. Additionally, other conjugated polymers have been shown to have semiconducting properties. OFET design has also improved in the past few decades. Many OFETs are now designed based on the thin-film transistor (TFT) model, which allows the devices to use less conductive materials in their design. Improvement on these models in the past few years have been made to field-effect mobility and on–off current ratios.

Materials

One common feature of OFET materials is the inclusion of an aromatic or otherwise conjugated π-electron system, facilitating the delocalization of orbital wavefunctions. Electron withdrawing groups or donating groups can be attached that facilitate hole or electron transport.

OFETs employing many aromatic and conjugated materials as the active semiconducting layer have been reported, including small molecules such as rubrene, tetracene, pentacene, diindenoperylene, perylenediimides, tetracyanoquinodimethane (TCNQ), and polymers such as polythiophenes (especially poly(3-hexylthiophene) (P3HT)), polyfluorene, polydiacetylene, poly(2,5-thienylene vinylene), poly(p-phenylene vinylene) (PPV).

The field is very active, with newly synthesized and tested compounds reported weekly in prominent research journals. Many review articles exist documenting the development of these materials. [16] [17] [18] [19] [20]

Rubrene-based OFETs show the highest carrier mobility 20–40 cm2/(V·s). Another popular OFET material is pentacene, which has been used since the 1980s, but with mobilities 10 to 100 times lower (depending on the substrate) than rubrene. [20] The major problem with pentacene, as well as many other organic conductors, is its rapid oxidation in air to form pentacene-quinone. However if the pentacene is preoxidized, and the thus formed pentacene-quinone is used as the gate insulator, then the mobility can approach the rubrene values. This pentacene oxidation technique is akin to the silicon oxidation used in the silicon electronics. [16]

Polycrystalline tetrathiafulvalene and its analogues result in mobilities in the range 0.1–1.4 cm2/(V·s). However, the mobility exceeds 10 cm2/(V·s) in solution-grown or vapor-transport-grown single crystalline hexamethylene-tetrathiafulvalene (HMTTF). The ON/OFF voltage is different for devices grown by those two techniques, presumably due to the higher processing temperatures using in the vapor transport grows. [16]

All the above-mentioned devices are based on p-type conductivity. N-type OFETs are yet poorly developed. They are usually based on perylenediimides or fullerenes or their derivatives, and show electron mobilities below 2 cm2/(V·s). [17]

Device design of organic field-effect transistors

Three essential components of field-effect transistors are the source, the drain and the gate. Field-effect transistors usually operate as a capacitor. They are composed of two plates. One plate works as a conducting channel between two ohmic contacts, which are called the source and the drain contacts. The other plate works to control the charge induced into the channel, and it is called the gate. The direction of the movement of the carriers in the channel is from the source to the drain. Hence the relationship between these three components is that the gate controls the carrier movement from the source to the drain. [21]

When this capacitor concept is applied to the device design, various devices can be built up based on the difference in the controller – i.e. the gate. This can be the gate material, the location of the gate with respect to the channel, how the gate is isolated from the channel, and what type of carrier is induced by the gate voltage into channel (such as electrons in an n-channel device, holes in a p-channel device, and both electrons and holes in a double injection device).

Figure 1. Schematic of three kinds of field-effect transistor (FET): (a) metal-insulator-semiconductor FET (MISFET); (b) metal-semiconductor FET (MESFET); (c) thin-film transistor (TFT). 3 FET structure.png
Figure 1. Schematic of three kinds of field-effect transistor (FET): (a) metal-insulator-semiconductor FET (MISFET); (b) metal-semiconductor FET (MESFET); (c) thin-film transistor (TFT).

Classified by the properties of the carrier, three types of FETs are shown schematically in Figure 1. [22] They are MOSFET (metal–oxide–semiconductor field-effect transistor), MESFET (metal–semiconductor field-effect transistor) and TFT (thin-film transistor).

MOSFET

The most prominent and widely used FET in modern microelectronics is the MOSFET (metal–oxide–semiconductor FET). There are different kinds in this category, such as MISFET (metal–insulator–semiconductor field-effect transistor), and IGFET (insulated-gate FET). A schematic of a MISFET is shown in Figure 1a. The source and the drain are connected by a semiconductor and the gate is separated from the channel by a layer of insulator. If there is no bias (potential difference) applied on the gate, the Band bending is induced due to the energy difference of metal conducting band and the semiconductor Fermi level. Therefore, a higher concentration of holes is formed on the interface of the semiconductor and the insulator. When an enough positive bias is applied on the gate contact, the bended band becomes flat. If a larger positive bias is applied, the band bending in the opposite direction occurs and the region close to the insulator-semiconductor interface becomes depleted of holes. Then the depleted region is formed. At an even larger positive bias, the band bending becomes so large that the Fermi level at the interface of the semiconductor and the insulator becomes closer to the bottom of the conduction band than to the top of the valence band, therefore, it forms an inversion layer of electrons, providing the conducting channel. Finally, it turns the device on. [23]

MESFET

The second type of device is described in Fig.1b. The only difference of this one from the MISFET is that the n-type source and drain are connected by an n-type region. In this case, the depletion region extends all over the n-type channel at zero gate voltage in a normally “off” device (it is similar to the larger positive bias in MISFET case). In the normally “on” device, a portion of the channel is not depleted, and thus leads to passage of a current at zero gate voltage.

TFT

A thin-film transistor (TFT) is illustrated in Figure 1c. Here the source and drain electrodes are directly deposited onto the conducting channel (a thin layer of semiconductor) then a thin film of insulator is deposited between the semiconductor and the metal gate contact. This structure suggests that there is no depletion region to separate the device from the substrate. If there is zero bias, the electrons are expelled from the surface due to the Fermi-level energy difference of the semiconductor and the metal. This leads to band bending of semiconductor. In this case, there is no carrier movement between the source and drain. When the positive charge is applied, the accumulation of electrons on the interface leads to the bending of the semiconductor in an opposite way and leads to the lowering of the conduction band with regards to the Fermi-level of the semiconductor. Then a highly conductive channel forms at the interface (shown in Figure 2).

Figure 2: Schematic of band-bending in the TFT device model. TFT DIA BIAS.png
Figure 2: Schematic of band-bending in the TFT device model.

OFET

OFETs adopt the architecture of TFT. With the development of the conducting polymer, the semiconducting properties of small conjugated molecules have been recognized. The interest in OFETs has grown enormously in the past ten years. The reasons for this surge of interest are manifold. The performance of OFETs, which can compete with that of amorphous silicon (a-Si) TFTs with field-effect mobilities of 0.5–1 cm2 V−1 s−1 and ON/OFF current ratios (which indicate the ability of the device to shut down) of 106–108, has improved significantly. Currently, thin-film OFET mobility values of 5 cm2 V−1 s−1 in the case of vacuum-deposited small molecules [24] and 0.6 cm2 V−1 s−1 for solution-processed polymers [25] have been reported. As a result, there is now a greater industrial interest in using OFETs for applications that are currently incompatible with the use of a-Si or other inorganic transistor technologies. One of their main technological attractions is that all the layers of an OFET can be deposited and patterned at room temperature by a combination of low-cost solution-processing and direct-write printing, which makes them ideally suited for realization of low-cost, large-area electronic functions on flexible substrates. [26]

Device preparation

OFET schematic OfetEng.png
OFET schematic

Thermally oxidized silicon is a traditional substrate for OFETs where the silicon dioxide serves as the gate insulator. The active FET layer is usually deposited onto this substrate using either (i) thermal evaporation, (ii) coating from organic solution, or (iii) electrostatic lamination. The first two techniques result in polycrystalline active layers; they are much easier to produce, but result in relatively poor transistor performance. Numerous variations of the solution coating technique (ii) are known, including dip-coating, spin-coating, inkjet printing and screen printing. The electrostatic lamination technique is based on manual peeling of a thin layer off a single organic crystal; it results in a superior single-crystalline active layer, yet it is more tedious. The thickness of the gate oxide and the active layer is below one micrometer. [16]

Carrier transport

Evolution of carrier mobility in organic field-effect transistor. OFETmobility.png
Evolution of carrier mobility in organic field-effect transistor.

The carrier transport in OFET is specific for two-dimensional (2D) carrier propagation through the device. Various experimental techniques were used for this study, such as Haynes - Shockley experiment on the transit times of injected carriers, time-of-flight (TOF) experiment [27] for the determination of carrier mobility, pressure-wave propagation experiment for probing electric-field distribution in insulators, organic monolayer experiment for probing orientational dipolar changes, optical time-resolved second harmonic generation (TRM-SHG), etc. Whereas carriers propagate through polycrystalline OFETs in a diffusion-like (trap-limited) manner, [28] they move through the conduction band in the best single-crystalline OFETs. [16]

The most important parameter of OFET carrier transport is carrier mobility. Its evolution over the years of OFET research is shown in the graph for polycrystalline and single crystalline OFETs. The horizontal lines indicate the comparison guides to the main OFET competitors – amorphous (a-Si) and polycrystalline silicon. The graph reveals that the mobility in polycrystalline OFETs is comparable to that of a-Si whereas mobility in rubrene-based OFETs (20–40 cm2/(V·s)) approaches that of best poly-silicon devices. [16]

Development of accurate models of charge carrier mobility in OFETs is an active field of research. Fishchuk et al. have developed an analytical model of carrier mobility in OFETs that accounts for carrier density and the polaron effect. [29]

While average carrier density is typically calculated as function of gate voltage when used as an input for carrier mobility models, [30] modulated amplitude reflectance spectroscopy (MARS) has been shown to provide a spatial map of carrier density across an OFET channel. [31]

Light-emitting OFETs

Because an electric current flows through such a transistor, it can be used as a light-emitting device, thus integrating current modulation and light emission. In 2003, a German group reported the first organic light-emitting field-effect transistor (OLET). [32] The device structure comprises interdigitated gold source- and drain electrodes and a polycrystalline tetracene thin film. Both positive charges (holes) as well as negative charges (electrons) are injected from the gold contacts into this layer leading to electroluminescence from the tetracene.

See also

Related Research Articles

<span class="mw-page-title-main">Organic electronics</span> Field of materials science

Organic electronics is a field of materials science concerning the design, synthesis, characterization, and application of organic molecules or polymers that show desirable electronic properties such as conductivity. Unlike conventional inorganic conductors and semiconductors, organic electronic materials are constructed from organic (carbon-based) molecules or polymers using synthetic strategies developed in the context of organic chemistry and polymer chemistry.

<span class="mw-page-title-main">Transistor</span> Solid-state electrically operated switch also used as an amplifier

A transistor is a semiconductor device used to amplify or switch electrical signals and power. It is one of the basic building blocks of modern electronics. It is composed of semiconductor material, usually with at least three terminals for connection to an electronic circuit. A voltage or current applied to one pair of the transistor's terminals controls the current through another pair of terminals. Because the controlled (output) power can be higher than the controlling (input) power, a transistor can amplify a signal. Some transistors are packaged individually, but many more in miniature form are found embedded in integrated circuits. Because transistors are the key active components in practically all modern electronics, many people consider them one of the 20th century's greatest inventions.

<span class="mw-page-title-main">MOSFET</span> Type of field-effect transistor

The metal–oxide–semiconductor field-effect transistor is a type of field-effect transistor (FET), most commonly fabricated by the controlled oxidation of silicon. It has an insulated gate, the voltage of which determines the conductivity of the device. This ability to change conductivity with the amount of applied voltage can be used for amplifying or switching electronic signals. The term metal–insulator–semiconductor field-effect transistor (MISFET) is almost synonymous with MOSFET. Another near-synonym is insulated-gate field-effect transistor (IGFET).

A thin-film transistor (TFT) is a special type of field-effect transistor (FET) where the transistor is made by thin film deposition. TFTs are grown on a supporting substrate. A common substrate is glass, because the traditional application of TFTs is in liquid-crystal displays (LCDs). This differs from the conventional bulk metal oxide field effect transistor (MOSFET), where the semiconductor material typically is the substrate, such as a silicon wafer.

<span class="mw-page-title-main">High-electron-mobility transistor</span> Type of field-effect transistor

A high-electron-mobility transistor, also known as heterostructure FET (HFET) or modulation-doped FET (MODFET), is a field-effect transistor incorporating a junction between two materials with different band gaps as the channel instead of a doped region. A commonly used material combination is GaAs with AlGaAs, though there is wide variation, dependent on the application of the device. Devices incorporating more indium generally show better high-frequency performance, while in recent years, gallium nitride HEMTs have attracted attention due to their high-power performance. Like other FETs, HEMTs are used in integrated circuits as digital on-off switches. FETs can also be used as amplifiers for large amounts of current using a small voltage as a control signal. Both of these uses are made possible by the FET’s unique current–voltage characteristics. HEMT transistors are able to operate at higher frequencies than ordinary transistors, up to millimeter wave frequencies, and are used in high-frequency products such as cell phones, satellite television receivers, voltage converters, and radar equipment. They are widely used in satellite receivers, in low power amplifiers and in the defense industry.

Organic semiconductors are solids whose building blocks are pi-bonded molecules or polymers made up by carbon and hydrogen atoms and – at times – heteroatoms such as nitrogen, sulfur and oxygen. They exist in the form of molecular crystals or amorphous thin films. In general, they are electrical insulators, but become semiconducting when charges are either injected from appropriate electrodes, upon doping or by photoexcitation.

<span class="mw-page-title-main">Pentacene</span> Hydrocarbon compound (C22H14) made of 5 fused benzene rings

Pentacene is a polycyclic aromatic hydrocarbon consisting of five linearly-fused benzene rings. This highly conjugated compound is an organic semiconductor. The compound generates excitons upon absorption of ultra-violet (UV) or visible light; this makes it very sensitive to oxidation. For this reason, this compound, which is a purple powder, slowly degrades upon exposure to air and light.

Hybrid solar cells combine advantages of both organic and inorganic semiconductors. Hybrid photovoltaics have organic materials that consist of conjugated polymers that absorb light as the donor and transport holes. Inorganic materials in hybrid cells are used as the acceptor and electron transporter in the structure. The hybrid photovoltaic devices have a potential for not only low-cost by roll-to-roll processing but also for scalable solar power conversion.

A two-dimensional electron gas (2DEG) is a scientific model in solid-state physics. It is an electron gas that is free to move in two dimensions, but tightly confined in the third. This tight confinement leads to quantized energy levels for motion in the third direction, which can then be ignored for most problems. Thus the electrons appear to be a 2D sheet embedded in a 3D world. The analogous construct of holes is called a two-dimensional hole gas (2DHG), and such systems have many useful and interesting properties.

Capacitance–voltage profiling is a technique for characterizing semiconductor materials and devices. The applied voltage is varied, and the capacitance is measured and plotted as a function of voltage. The technique uses a metal–semiconductor junction or a p–n junction or a MOSFET to create a depletion region, a region which is empty of conducting electrons and holes, but may contain ionized donors and electrically active defects or traps. The depletion region with its ionized charges inside behaves like a capacitor. By varying the voltage applied to the junction it is possible to vary the depletion width. The dependence of the depletion width upon the applied voltage provides information on the semiconductor's internal characteristics, such as its doping profile and electrically active defect densities., Measurements may be done at DC, or using both DC and a small-signal AC signal, or using a large-signal transient voltage.

Charge trap flash (CTF) is a semiconductor memory technology used in creating non-volatile NOR and NAND flash memory. It is a type of floating-gate MOSFET memory technology, but differs from the conventional floating-gate technology in that it uses a silicon nitride film to store electrons rather than the doped polycrystalline silicon typical of a floating-gate structure. This approach allows memory manufacturers to reduce manufacturing costs five ways:

  1. Fewer process steps are required to form a charge storage node
  2. Smaller process geometries can be used
  3. Multiple bits can be stored on a single flash memory cell
  4. Improved reliability
  5. Higher yield since the charge trap is less susceptible to point defects in the tunnel oxide layer

Hot carrier injection (HCI) is a phenomenon in solid-state electronic devices where an electron or a “hole” gains sufficient kinetic energy to overcome a potential barrier necessary to break an interface state. The term "hot" refers to the effective temperature used to model carrier density, not to the overall temperature of the device. Since the charge carriers can become trapped in the gate dielectric of a MOS transistor, the switching characteristics of the transistor can be permanently changed. Hot-carrier injection is one of the mechanisms that adversely affects the reliability of semiconductors of solid-state devices.

SONOS, short for "silicon–oxide–nitride–oxide–silicon", more precisely, "polycrystalline silicon"—"silicon dioxide"—"silicon nitride"—"silicon dioxide"—"silicon", is a cross sectional structure of MOSFET (metal–oxide–semiconductor field-effect transistor), realized by P.C.Y. Chen of Fairchild Camera and Instrument in 1977. This structure is often used for non-volatile memories, such as EEPROM and flash memories. It is sometimes used for TFT LCD displays. It is one of CTF (charge trap flash) variants. It is distinguished from traditional non-volatile memory structures by the use of silicon nitride (Si3N4 or Si9N10) instead of "polysilicon-based FG (floating-gate)" for the charge storage material. A further variant is "SHINOS" ("silicon"—"hi-k"—"nitride"—"oxide"—"silicon"), which is substituted top oxide layer with high-κ material. Another advanced variant is "MONOS" ("metal–oxide–nitride–oxide–silicon"). Companies offering SONOS-based products include Cypress Semiconductor, Macronix, Toshiba, United Microelectronics Corporation and Floadia.

In semiconductor electronics fabrication technology, a self-aligned gate is a transistor manufacturing approach whereby the gate electrode of a MOSFET is used as a mask for the doping of the source and drain regions. This technique ensures that the gate is naturally and precisely aligned to the edges of the source and drain.

<span class="mw-page-title-main">Oxide thin-film transistor</span>

An oxide thin-film transistor or metal oxide thin film transistor is a type of thin film transistor where the semiconductor is a metal oxide compound. An oxide TFT is distinct from a metal oxide field effect transistor (MOSFET) where the word "oxide" refers to the insulating gate dielectric. In an oxide TFT, the word oxide refers to the semiconductor. Oxide TFTs have applications as amplifiers to deliver current to emitters in display backplanes.

<span class="mw-page-title-main">MIS capacitor</span>

A MIS capacitor is a capacitor formed from a layer of metal, a layer of insulating material and a layer of semiconductor material. It gets its name from the initials of the metal-insulator-semiconductor (MIS) structure. As with the MOS field-effect transistor structure, for historical reasons, this layer is also often referred to as a MOS capacitor, but this specifically refers to an oxide insulator material.

<span class="mw-page-title-main">Depletion and enhancement modes</span> Two major types of field effect transistors

In field-effect transistors (FETs), depletion mode and enhancement mode are two major transistor types, corresponding to whether the transistor is in an on state or an off state at zero gate–source voltage.

Polysilicon depletion effect is the phenomenon in which unwanted variation of threshold voltage of the MOSFET devices using polysilicon as gate material is observed, leading to unpredicted behavior of the electronic circuit. Because of this variation High-k Dielectric Metal Gates (HKMG) were introduced to solve the issue.

<span class="mw-page-title-main">Field-effect transistor</span> Type of transistor

The field-effect transistor (FET) is a type of transistor that uses an electric field to control the flow of current in a semiconductor. It comes in two types: junction FET (JFET) and metal-oxide-semiconductor FET (MOSFET). FETs have three terminals: source, gate, and drain. FETs control the flow of current by the application of a voltage to the gate, which in turn alters the conductivity between the drain and source.

Low-temperature polycrystalline silicon (LTPS) is polycrystalline silicon that has been synthesized at relatively low temperatures compared to in traditional methods. LTPS is important for display industries, since the use of large glass panels prohibits exposure to deformative high temperatures. More specifically, the use of polycrystalline silicon in thin-film transistors (LTPS-TFT) has high potential for large-scale production of electronic devices like flat panel LCD displays or image sensors.

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