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In computer architecture, dynamic voltage scaling is a power management technique in which the voltage used in a component is increased or decreased, depending upon circumstances. Dynamic voltage scaling to increase voltage is known as overvolting; dynamic voltage scaling to decrease voltage is known as undervolting. Undervolting is done in order to conserve power, particularly in laptops and other mobile devices, where energy comes from a battery and thus is limited, or in rare cases, to increase reliability. Overvolting is done in order to support higher frequencies for performance.
The term "overvolting" is also used to refer to increasing static operating voltage of computer components to allow operation at higher speed (overclocking).
MOSFET-based digital circuits operate using voltages at circuit nodes to represent logical state. The voltage at these nodes switches between a high voltage and a low voltage during normal operation—when the inputs to a logic gate transition, the transistors making up that gate may toggle the gate's output.
Toggling a MOSFET's state requires changing its gate voltage from below the transistor's threshold voltage to above it (or from above it to below it). However, changing the gate's voltage requires charging or discharging the capacitance at its node. This capacitance is the sum of capacitances from various sources: primarily transistor gate capacitance, diffusion capacitance, and wires (coupling capacitance).
Higher supply voltages result in faster slew rate (rate of change of voltage per unit of time) when charging and discharging, which allows for quicker transitioning through the MOSFET's threshold voltage. Additionally, the more the gate voltage exceeds the threshold voltage, the lower the resistance of the transistor's conducting channel. This results in a lower RC time constant for quicker charging and discharging of the capacitance of the subsequent logic stage. Quicker transitioning afforded by higher supply voltages allows for operating at higher frequencies.
Many modern components allow voltage regulation to be controlled through software (for example, through the BIOS). It is usually possible to control the voltages supplied to the CPU, RAM, PCI, and PCI Express (or AGP) port through a PC's BIOS.
However, some components do not allow software control of supply voltages, and hardware modification is required by overclockers seeking to overvolt the component for extreme overclocks. Video cards and motherboard northbridges are components which frequently require hardware modifications to change supply voltages. These modifications are known as "voltage mods" or "Vmod" in the overclocking community.
Undervolting is reducing the voltage of a component, usually the processor, reducing temperature and cooling requirements, and possibly allowing a fan to be omitted. Just like overclocking, undervolting is highly subject to the so-called silicon lottery: one CPU can undervolt slightly better than the other and vice versa.
The switching power dissipated by a chip using static CMOS gates is , where is the capacitance being switched per clock cycle, is the supply voltage, is the switching frequency, [1] and is the activity factor. Since is squared, this part of the power consumption decreases quadratically with voltage. The formula is not exact however, as many modern chips are not implemented using 100% CMOS, but also use special memory circuits, dynamic logic such as domino logic, etc. Moreover, there is also a static leakage current, which has become more and more accentuated as feature sizes have become smaller (below 90 nanometres) and threshold levels lower.
Accordingly, dynamic voltage scaling is widely used as part of strategies to manage switching power consumption in battery powered devices such as cell phones and laptop computers. Low voltage modes are used in conjunction with lowered clock frequencies to minimize power consumption associated with components such as CPUs and DSPs; only when significant computational power is needed will the voltage and frequency be raised.
Some peripherals also support low voltage operational modes. For example, low power MMC and SD cards can run at 1.8 V as well as at 3.3 V, and driver stacks may conserve power by switching to the lower voltage after detecting a card which supports it.
When leakage current is a significant factor in terms of power consumption, chips are often designed so that portions of them can be powered completely off. This is not usually viewed as being dynamic voltage scaling, because it is not transparent to software. When sections of chips can be turned off, as for example on TI OMAP3 processors, drivers and other support software need to support that.
The speed at which a digital circuit can switch states - that is, to go from "low" (VSS) to "high" (VDD) or vice versa - is proportional to the voltage differential in that circuit. Reducing the voltage means that circuits switch slower, reducing the maximum frequency at which that circuit can run. This, in turn, reduces the rate at which program instructions that can be issued, which may increase run time for program segments which are sufficiently CPU-bound.
This again highlights why dynamic voltage scaling is generally done in conjunction with dynamic frequency scaling, at least for CPUs. There are complex tradeoffs to consider, which depend on the particular system, the load presented to it, and power management goals. When quick responses are needed (e.g. Mobile Sensors and Context-Aware Computing), clocks and voltages might be raised together. Otherwise, they may both be kept low to maximize battery life.
The 167-processor AsAP 2 chip enables individual processors to make extremely fast (on the order of 1-2ns) and locally controlled changes to their own supply voltages. Processors connect their local power grid to either a higher (VddHi) or lower (VddLow) supply voltage, or can be cut off entirely from either grid to dramatically cut leakage power.
Another approach uses per-core on-chip switching regulators for dynamic voltage and frequency scaling (DVFS). [2]
Unix system provides a userspace governor, allowing to modify the CPU frequencies[ citation needed ] (though limited to hardware capabilities).
Dynamic frequency scaling is another power conservation technique that works on the same principles as dynamic voltage scaling. Both dynamic voltage scaling and dynamic frequency scaling can be used to prevent computer system overheating, which can result in program or operating system crashes, and possibly hardware damage. Reducing the voltage supplied to the CPU below the manufacturer's recommended minimum setting can result in system instability.
The efficiency of some electrical components, such as voltage regulators, decreases with increasing temperature, so the power used may increase with temperature causing thermal runaway. Increases in voltage or frequency may increase system power demands even faster than the CMOS formula indicates, and vice versa. [3] [4]
The primary caveat of overvolting is increased heat: the power dissipated by a circuit increases with the square of the voltage applied, so even small voltage increases significantly affect power. At higher temperatures, transistor performance is adversely affected, and at some threshold, the performance reduction due to the heat exceeds the potential gains from the higher voltages. Overheating and damage to circuits can occur very quickly when using high voltages.
There are also longer-term concerns: various adverse device-level effects such as hot carrier injection and electromigration occur more rapidly at higher voltages, decreasing the lifespan of overvolted components.
In order to mitigate the increased heat from overvolting, it's recommended to use liquid cooling to achieve higher ceilings and thresholds than you normally would with an aftermarket cooler. Also known as 'all-in-one' (AIO) coolers, they offer a far more effective method of unit cooling by relocating heat outside a computer case via the fans on the radiator whereas air cooling only disperses heat from the affected unit, increasing overall ambient temperatures. [5]
In electronics, the metal–oxide–semiconductor field-effect transistor is a type of field-effect transistor (FET), most commonly fabricated by the controlled oxidation of silicon. It has an insulated gate, the voltage of which determines the conductivity of the device. This ability to change conductivity with the amount of applied voltage can be used for amplifying or switching electronic signals. The term metal–insulator–semiconductor field-effect transistor (MISFET) is almost synonymous with MOSFET. Another near-synonym is insulated-gate field-effect transistor (IGFET).
Transistor–transistor logic (TTL) is a logic family built from bipolar junction transistors. Its name signifies that transistors perform both the logic function and the amplifying function, as opposed to earlier resistor–transistor logic (RTL) and diode–transistor logic (DTL).
Complementary metal–oxide–semiconductor is a type of metal–oxide–semiconductor field-effect transistor (MOSFET) fabrication process that uses complementary and symmetrical pairs of p-type and n-type MOSFETs for logic functions. CMOS technology is used for constructing integrated circuit (IC) chips, including microprocessors, microcontrollers, memory chips, and other digital logic circuits. CMOS technology is also used for analog circuits such as image sensors, data converters, RF circuits, and highly integrated transceivers for many types of communication.
In computing, overclocking is the practice of increasing the clock rate of a computer to exceed that certified by the manufacturer. Commonly, operating voltage is also increased to maintain a component's operational stability at accelerated speeds. Semiconductor devices operated at higher frequencies and voltages increase power consumption and heat. An overclocked device may be unreliable or fail completely if the additional heat load is not removed or power delivery components cannot meet increased power demands. Many device warranties state that overclocking or over-specification voids any warranty, but some manufacturers allow overclocking as long as it is done (relatively) safely.
Processor power dissipation or processing unit power dissipation is the process in which computer processors consume electrical energy, and dissipate this energy in the form of heat due to the resistance in the electronic circuits.
Power management is a feature of some electrical appliances, especially copiers, computers, computer CPUs, computer GPUs and computer peripherals such as monitors and printers, that turns off the power or switches the system to a low-power state when inactive. In computing this is known as PC power management and is built around a standard called ACPI which superseded APM. All recent computers have ACPI support.
Resistor–transistor logic (RTL), sometimes also known as transistor–resistor logic (TRL), is a class of digital circuits built using resistors as the input network and bipolar junction transistors (BJTs) as switching devices. RTL is the earliest class of transistorized digital logic circuit; it was succeeded by diode–transistor logic (DTL) and transistor–transistor logic (TTL).
A voltage multiplier is an electrical circuit that converts AC electrical power from a lower voltage to a higher DC voltage, typically using a network of capacitors and diodes.
In computer engineering, a logic family is one of two related concepts:
The CPU core voltage (VCORE) is the power supply voltage supplied to the processing cores of CPU, GPU, or any other device with a processing core. The amount of power a CPU uses, and thus the amount of heat it dissipates, is the product of this voltage and the current it draws. In modern CPUs, which are CMOS circuits, the current is almost proportional to the clock speed, the CPU drawing almost no current between clock cycles.
In integrated circuits, depletion-load NMOS is a form of digital logic family that uses only a single power supply voltage, unlike earlier NMOS logic families that needed more than one different power supply voltage. Although manufacturing these integrated circuits required additional processing steps, improved switching speed and the elimination of the extra power supply made this logic family the preferred choice for many microprocessors and other logic elements.
A buck converter or step-down converter is a DC-to-DC converter which decreases voltage, while increasing current, from its input (supply) to its output (load). It is a class of switched-mode power supply. Switching converters provide much greater power efficiency as DC-to-DC converters than linear regulators, which are simpler circuits that dissipate power as heat, but do not step up output current. The efficiency of buck converters can be very high, often over 90%, making them useful for tasks such as converting a computer's main supply voltage, which is usually 12 V, down to lower voltages needed by USB, DRAM and the CPU, which are usually 5, 3.3 or 1.8 V.
Power optimization is the use of electronic design automation tools to optimize (reduce) the power consumption of a digital design, such as that of an integrated circuit, while preserving the functionality.
Integrated injection logic (IIL, I2L, or I2L) is a class of digital circuits built with multiple collector bipolar junction transistors (BJT). When introduced it had speed comparable to TTL yet was almost as low power as CMOS, making it ideal for use in VLSI (and larger) integrated circuits. The gates can be made smaller with this logic family than with CMOS because complementary transistors are not needed. Although the logic voltage levels are very close (High: 0.7V, Low: 0.2V), I2L has high noise immunity because it operates by current instead of voltage. I2L was developed in 1971 by Siegfried K. Wiedmann and Horst H. Berger who originally called it merged-transistor logic (MTL). A disadvantage of this logic family is that the gates draw power when not switching unlike with CMOS.
In integrated circuit design, dynamic logic is a design methodology in combinational logic circuits, particularly those implemented in metal–oxide–semiconductor (MOS) technology. It is distinguished from the so-called static logic by exploiting temporary storage of information in stray and gate capacitances. It was popular in the 1970s and has seen a recent resurgence in the design of high-speed digital electronics, particularly central processing units (CPUs). Dynamic logic circuits are usually faster than static counterparts and require less surface area, but are more difficult to design. Dynamic logic has a higher average rate of voltage transitions than static logic, but the capacitive loads being transitioned are smaller so the overall power consumption of dynamic logic may be higher or lower depending on various tradeoffs. When referring to a particular logic family, the dynamic adjective usually suffices to distinguish the design methodology, e.g. dynamic CMOS or dynamic SOI design.
PMOS or pMOS logic is a family of digital circuits based on p-channel, enhancement mode metal–oxide–semiconductor field-effect transistors (MOSFETs). In the late 1960s and early 1970s, PMOS logic was the dominant semiconductor technology for large-scale integrated circuits before being superseded by NMOS and CMOS devices.
Dynamic frequency scaling is a power management technique in computer architecture whereby the frequency of a microprocessor can be automatically adjusted "on the fly" depending on the actual needs, to conserve power and reduce the amount of heat generated by the chip. Dynamic frequency scaling helps preserve battery on mobile devices and decrease cooling cost and noise on quiet computing settings, or can be useful as a security measure for overheated systems.
Low-power electronics are electronics, such as notebook processors, that have been designed to use less electrical power than usual, often at some expense. In the case of notebook processors, this expense is processing power; notebook processors usually consume less power than their desktop counterparts, at the expense of lower processing power.
Power gating is a technique used in integrated circuit design to reduce power consumption, by shutting off the current to blocks of the circuit that are not in use. In addition to reducing stand-by or leakage power, power gating has the benefit of enabling Iddq testing.
In semiconductor electronics, Dennard scaling, also known as MOSFET scaling, is a scaling law which states roughly that, as transistors get smaller, their power density stays constant, so that the power use stays in proportion with area; both voltage and current scale (downward) with length. The law, originally formulated for MOSFETs, is based on a 1974 paper co-authored by Robert H. Dennard, after whom it is named.